公开(公告)号：US10468270B2

公开(公告)日：2019-11-05

申请号：US15879490

申请日：2018-01-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chunhung Chen ,  Sheng-Chen Wang ,  Chin Wei Chuang

IPC: H01L21/321 ,  G01N23/20 ,  H01L21/66 ,  G06F11/07 ,  G01N1/10 ,  B24B37/013

Abstract: A planarization process is performed to a wafer. In various embodiments, the planarization process may include a chemical mechanical polishing (CMP) process. A byproduct generated by the planarization process is collected and analyzed. Based on the analysis, one or more process controls are performed for the planarization process. In some embodiments, the process controls include but are not limited to process endpoint detection or halting the planarization process based on detecting an error associated with the planarization process.

公开(公告)号：US20200051830A1

公开(公告)日：2020-02-13

申请号：US16656393

申请日：2019-10-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chunhung Chen ,  Sheng-Chen Wang ,  Chin Wei Chuang

IPC: H01L21/321 ,  G01N23/20 ,  H01L21/66 ,  G06F11/07

Abstract: A planarization process is performed to a wafer. In various embodiments, the planarization process may include a chemical mechanical polishing (CMP) process. A byproduct generated by the planarization process is collected and analyzed. Based on the analysis, one or more process controls are performed for the planarization process. In some embodiments, the process controls include but are not limited to process endpoint detection or halting the planarization process based on detecting an error associated with the planarization process.

公开(公告)号：US12009221B2

公开(公告)日：2024-06-11

申请号：US16656393

申请日：2019-10-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chunhung Chen ,  Sheng-Chen Wang ,  Chin Wei Chuang

IPC: H01L21/321 ,  G01N23/20 ,  G06F11/07 ,  H01L21/66 ,  B24B37/013 ,  G01N1/10

CPC classification number: H01L21/3212 ,  G01N23/20075 ,  G06F11/07 ,  H01L22/26 ,  B24B37/013 ,  G01N1/10

Abstract: A planarization process is performed to a wafer. In various embodiments, the planarization process may include a chemical mechanical polishing (CMP) process. A byproduct generated by the planarization process is collected and analyzed. Based on the analysis, one or more process controls are performed for the planarization process. In some embodiments, the process controls include but are not limited to process endpoint detection or halting the planarization process based on detecting an error associated with the planarization process.

公开(公告)号：US20230330803A1

公开(公告)日：2023-10-19

申请号：US18339099

申请日：2023-06-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chunhung Chen ,  Yu Chi Tsai ,  Chin Wei Chuang ,  Bo-An Chen ,  Sheng-Chen Wang ,  Chen-Hua Tsai

IPC: B24B37/005

CPC classification number: B24B37/005

Abstract: Systems and methods are provided for predicting irregular motions of one or more mechanical components of a semiconductor processing apparatus. A mechanical motion irregular prediction system includes one or more motion sensors that sense motion-related parameters associated with at least one mechanical component of a semiconductor processing apparatus. The one or more motion sensors output sensing signals based on the sensed motion-related parameters. Defect prediction circuitry predicts an irregular motion of the at least one mechanical component based on the sensing signals.

公开(公告)号：US12172262B2

公开(公告)日：2024-12-24

申请号：US18339099

申请日：2023-06-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chunhung Chen ,  Yu Chi Tsai ,  Chin Wei Chuang ,  Bo-An Chen ,  Sheng-Chen Wang ,  Chen-Hua Tsai

IPC: B24B37/005

Abstract: Systems and methods are provided for predicting irregular motions of one or more mechanical components of a semiconductor processing apparatus. A mechanical motion irregular prediction system includes one or more motion sensors that sense motion-related parameters associated with at least one mechanical component of a semiconductor processing apparatus. The one or more motion sensors output sensing signals based on the sensed motion-related parameters. Defect prediction circuitry predicts an irregular motion of the at least one mechanical component based on the sensing signals.

公开(公告)号：US11731232B2

公开(公告)日：2023-08-22

申请号：US16431957

申请日：2019-06-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chunhung Chen ,  Yu Chi Tsai ,  Chin Wei Chuang ,  Bo-An Chen ,  Sheng-Chen Wang ,  Chen-Hua Tsai

IPC: B24B37/005

CPC classification number: B24B37/005

Abstract: Systems and methods are provided for predicting irregular motions of one or more mechanical components of a semiconductor processing apparatus. A mechanical motion irregular prediction system includes one or more motion sensors that sense motion-related parameters associated with at least one mechanical component of a semiconductor processing apparatus. The one or more motion sensors output sensing signals based on the sensed motion-related parameters. Defect prediction circuitry predicts an irregular motion of the at least one mechanical component based on the sensing signals.

公开(公告)号：US20190164777A1

公开(公告)日：2019-05-30

申请号：US15879490

申请日：2018-01-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chunhung Chen ,  Sheng-Chen Wang ,  Chin Wei Chuang

IPC: H01L21/321 ,  G01N23/20 ,  G06F11/07 ,  H01L21/66

Abstract: A planarization process is performed to a wafer. In various embodiments, the planarization process may include a chemical mechanical polishing (CMP) process. A byproduct generated by the planarization process is collected and analyzed. Based on the analysis, one or more process controls are performed for the planarization process. In some embodiments, the process controls include but are not limited to process endpoint detection or halting the planarization process based on detecting an error associated with the planarization process.