公开(公告)号：US11823945B2

公开(公告)日：2023-11-21

申请号：US16876287

申请日：2020-05-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wang-Hua Lin ,  Chun-Liang Tai ,  Chun-Hsiang Fan ,  Ming-Hsi Yeh ,  Kuo-Bin Huang

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/08 ,  B08B3/10

CPC classification number: H01L21/68721 ,  B08B3/08 ,  B08B3/10 ,  H01L21/67051 ,  H01L21/67103 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68742

Abstract: A method for cleaning a semiconductor wafer is provided. The method includes placing a semiconductor wafer over a supporter arranged around a central axis of a spin base. The method further includes securing the semiconductor wafer using a clamping member positioned on the supporter. The movement of the semiconductor wafer during the placement of the semiconductor wafer over the supporter is guided by a guiding member located over the clamping member. The method also includes spinning the semiconductor wafer by rotating the spin base about the central axis. In addition, the method includes dispensing a processing liquid over the semiconductor wafer.

公开(公告)号：US11133200B2

公开(公告)日：2021-09-28

申请号：US15797676

申请日：2017-10-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Liang Tai ,  Chun-Hsiang Fan ,  Kuo-Bin Huang ,  Ming-Hsi Yeh

IPC: H01L21/67 ,  B05D1/00 ,  B05D3/00 ,  B08B3/10 ,  H01L21/02 ,  H01L21/687 ,  B05B3/02

Abstract: A method of processing a semiconductor substrate is provided. The semiconductor substrate may be placed on a spin chuck with a plurality of holding members, each holding member including a pin having a sloped portion to provide a gap between an upper edge of the substrate and the pin. Thereafter, one or more treatment fluids may be dispensed over the substrate.

公开(公告)号：US10658221B2

公开(公告)日：2020-05-19

申请号：US15812112

申请日：2017-11-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wang-Hua Lin ,  Chun-Liang Tai ,  Chun-Hsiang Fan ,  Ming-Hsi Yeh ,  Kuo-Bin Huang

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/08 ,  B08B3/10

Abstract: A method for cleaning a semiconductor wafer is provided. The method includes placing a semiconductor wafer over a supporter arranged around a central axis of a spin base. The method further includes securing the semiconductor wafer using a clamping member positioned on the supporter. The movement of the semiconductor wafer during the placement of the semiconductor wafer over the supporter is guided by a guiding member located over the clamping member. The method also includes spinning the semiconductor wafer by rotating the spin base about the central axis. In addition, the method includes dispensing a processing liquid over the semiconductor wafer.