公开(公告)号：US20200161161A1

公开(公告)日：2020-05-21

申请号：US16598136

申请日：2019-10-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau WU ,  Yan-Han CHEN ,  Cheng-Kang HU ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  H04N5/225 ,  B25J9/16 ,  B65G47/90 ,  H01L21/67

Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

公开(公告)号：US20190139746A1

公开(公告)日：2019-05-09

申请号：US15901970

申请日：2018-02-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wun-Kai TSAI ,  Wen-Che LIANG ,  Chao-Keng LI ,  Zheng-Jie XU ,  Chih-Kuo CHANG ,  Sing-Tsung LI ,  Feng-Kuang WU ,  Hsu-Shui LIU

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/66 ,  H01J37/244 ,  G05B19/4065 ,  C23C16/505

Abstract: A fabrication system for fabricating an IC is provided which includes a processing tool, a computation device and a FDC system. The processing tool includes an electrode and an RF sensor to execute a semiconductor manufacturing process to fabricate the IC. The RF sensor wirelessly detects the intensity of the RF signal. The computation device extracts statistical characteristics based on the detection of the intensity of the RF signal. The FDC system determines whether or not the intensity of the RF signal meets a threshold value or a threshold range according to the extracted statistical characteristics. When the detected intensity of the RF signal exceeds the threshold value or the threshold range, the FDC system notifies the processing tool to adjust the RF signal or stop tool to check parts damage.

公开(公告)号：US20250096030A1

公开(公告)日：2025-03-20

申请号：US18962784

申请日：2024-11-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau WU ,  Yan-Han CHEN ,  Cheng-Kang HU ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  B25J9/16 ,  B65G47/90 ,  H01L21/67 ,  H04N23/56

Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

公开(公告)号：US20240377826A1

公开(公告)日：2024-11-14

申请号：US18784749

申请日：2024-07-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Cheng-Hung CHEN ,  Yan-Han CHEN ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: G05D1/00 ,  B25J5/00 ,  G01S17/931

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

公开(公告)号：US20220261001A1

公开(公告)日：2022-08-18

申请号：US17736915

申请日：2022-05-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Cheng-Hung CHEN ,  Yan-Han CHEN ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: G05D1/02 ,  G01S17/931 ,  B25J5/00 ,  G05D1/00

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.