公开(公告)号：US20240186162A1

公开(公告)日：2024-06-06

申请号：US18444299

申请日：2024-02-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Shou-Wen KUO ,  Sheng-Hsiang CHUANG ,  Jiun-Rong PAI ,  Hsu-Shui LIU

IPC: H01L21/67 ,  G01M3/38 ,  H01L21/677

CPC classification number: H01L21/67265 ,  G01M3/38 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/67772

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

公开(公告)号：US20250096030A1

公开(公告)日：2025-03-20

申请号：US18962784

申请日：2024-11-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau WU ,  Yan-Han CHEN ,  Cheng-Kang HU ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  B25J9/16 ,  B65G47/90 ,  H01L21/67 ,  H04N23/56

Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

公开(公告)号：US20220059376A1

公开(公告)日：2022-02-24

申请号：US16996211

申请日：2020-08-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Becky LIAO ,  Sheng-Hsiang CHUANG ,  Cheng-Kang HU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: H01L21/67 ,  G06T7/00 ,  H04N7/18 ,  H04N5/225 ,  H04N5/232 ,  G01B11/14

Abstract: A system and method for defect detection in a hole array on a substrate is disclosed herein. In one embodiment, a method for defect detection in a hole array on a substrate, includes: scanning a substrate surface using at least one optical detector, generating at least one image of the substrate surface; and analyzing the at least one image to detect defects in the hole array on the substrate surface based on a set of predetermined criteria.

公开(公告)号：US20190244343A1

公开(公告)日：2019-08-08

申请号：US16204387

申请日：2018-11-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Hsiang CHUANG ,  Becky LIAO ,  Cheng-Kang HU ,  Shou-Wen KUO ,  Jiun-Rong PAI ,  Hsu-Shui LIU

IPC: G06T7/00 ,  G06T7/62 ,  G06T5/00 ,  G01B11/30

CPC classification number: G06T7/0004 ,  G01B11/30 ,  G06T5/005 ,  G06T7/62 ,  G06T2207/10008

Abstract: A method for scanning and analyzing a surface, the method comprising: receiving a piece of equipment with a target surface for inspection; receiving an input from a user; determining at least one scan parameter based on the user input; scanning the target surface using an optical detector in accordance with the at least one scan parameter; generating an image of the target surface; correcting the image of the target surface to remove at least one undesired feature to generate a corrected image based on the at least one scan parameter; and analyzing the corrected image to determine at least one geometric parameter of the target surface.

公开(公告)号：US20200161161A1

公开(公告)日：2020-05-21

申请号：US16598136

申请日：2019-10-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau WU ,  Yan-Han CHEN ,  Cheng-Kang HU ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  H04N5/225 ,  B25J9/16 ,  B65G47/90 ,  H01L21/67

Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

公开(公告)号：US20190164793A1

公开(公告)日：2019-05-30

申请号：US16201312

申请日：2018-11-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO ,  Sheng-Hsiang CHUANG ,  Cheng-Hung CHEN

IPC: H01L21/67 ,  H01L21/687 ,  G05B19/18

Abstract: In an embodiment, a system includes a profiler configured to detect variations along a surface of a semiconductor stage; and a jig configured to move the profiler along an axis over the semiconductor stage.

公开(公告)号：US20200343115A1

公开(公告)日：2020-10-29

申请号：US16927089

申请日：2020-07-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Shou-Wen KUO ,  Sheng-Hsiang CHUANG ,  Jiun-Rong PAI ,  Hsu-Shui LIU

IPC: H01L21/67 ,  H01L21/677 ,  G01M3/38

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

公开(公告)号：US20240377826A1

公开(公告)日：2024-11-14

申请号：US18784749

申请日：2024-07-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Cheng-Hung CHEN ,  Yan-Han CHEN ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: G05D1/00 ,  B25J5/00 ,  G01S17/931

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

公开(公告)号：US20220261001A1

公开(公告)日：2022-08-18

申请号：US17736915

申请日：2022-05-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Cheng-Hung CHEN ,  Yan-Han CHEN ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: G05D1/02 ,  G01S17/931 ,  B25J5/00 ,  G05D1/00

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.