公开(公告)号：US20200161161A1

公开(公告)日：2020-05-21

申请号：US16598136

申请日：2019-10-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau WU ,  Yan-Han CHEN ,  Cheng-Kang HU ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  H04N5/225 ,  B25J9/16 ,  B65G47/90 ,  H01L21/67

Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

公开(公告)号：US20250096030A1

公开(公告)日：2025-03-20

申请号：US18962784

申请日：2024-11-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau WU ,  Yan-Han CHEN ,  Cheng-Kang HU ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  B25J9/16 ,  B65G47/90 ,  H01L21/67 ,  H04N23/56

Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

公开(公告)号：US20240377826A1

公开(公告)日：2024-11-14

申请号：US18784749

申请日：2024-07-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Cheng-Hung CHEN ,  Yan-Han CHEN ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: G05D1/00 ,  B25J5/00 ,  G01S17/931

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

公开(公告)号：US20220261001A1

公开(公告)日：2022-08-18

申请号：US17736915

申请日：2022-05-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Cheng-Hung CHEN ,  Yan-Han CHEN ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: G05D1/02 ,  G01S17/931 ,  B25J5/00 ,  G05D1/00

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.