公开(公告)号：US11171065B2

公开(公告)日：2021-11-09

申请号：US16600789

申请日：2019-10-14

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chia-Han Lin ,  Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Sheng-Hsiang Chuang ,  Surendra Kumar Soni ,  Shou-Wen Kuo ,  Wu-An Weng ,  Gary Tsai ,  Chien-Ko Liao ,  Ya Hsun Hsueh ,  Becky Liao ,  Ethan Yu ,  Ming-Chi Tsai ,  Kuo-Yi Liu

IPC分类号： H01L21/66 ,  H05K13/08 ,  G06K9/20 ,  H01L21/67 ,  H01L21/687 ,  H01L21/677

摘要： Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

公开(公告)号：US20200043812A1

公开(公告)日：2020-02-06

申请号：US16600789

申请日：2019-10-14

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chia-Han Lin ,  Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Sheng-Hsiang Chuang ,  Surendra Kumar Soni ,  Shou-Wen Kuo ,  Wu-An Weng ,  Gary Tsai ,  Chien-Ko Liao ,  Ya Hsun Hsueh ,  Becky Liao ,  Ethan Yu ,  Ming-Chi Tsai ,  Kuo-Yi Liu

IPC分类号： H01L21/66 ,  H05K13/08 ,  G06K9/20 ,  H01L21/67 ,  H01L21/687 ,  H01L21/677

摘要： Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

公开(公告)号：US20190035696A1

公开(公告)日：2019-01-31

申请号：US15904795

申请日：2018-02-26

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chia-Han Lin ,  Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Sheng-Hsiang Chuang ,  Surendra Kumar Soni ,  Shou-Wen Kuo ,  Wu-An Weng ,  Gary Tsai ,  Chien-Ko Liao ,  Ya Hsun Hsueh ,  Becky Liao ,  Ethan Yu ,  Ming-Chi Tsai ,  Kuo-Yi Liu

IPC分类号： H01L21/66 ,  H05K13/08 ,  H01L21/67 ,  G06K9/20

摘要： Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.