公开(公告)号：US11171065B2

公开(公告)日：2021-11-09

申请号：US16600789

申请日：2019-10-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Han Lin ,  Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Sheng-Hsiang Chuang ,  Surendra Kumar Soni ,  Shou-Wen Kuo ,  Wu-An Weng ,  Gary Tsai ,  Chien-Ko Liao ,  Ya Hsun Hsueh ,  Becky Liao ,  Ethan Yu ,  Ming-Chi Tsai ,  Kuo-Yi Liu

IPC: H01L21/66 ,  H05K13/08 ,  G06K9/20 ,  H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

公开(公告)号：US10821871B2

公开(公告)日：2020-11-03

申请号：US15873061

申请日：2018-01-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yi-Tang Huang ,  Yuan-Yu Feng ,  Chia-Han Lin ,  Chien-Fa Lee

IPC: G06K9/00 ,  B60P1/64 ,  B65D90/00 ,  H01L21/677 ,  G06T7/00 ,  B66C1/66 ,  H01L21/67 ,  H01L21/68

Abstract: A method for transferring a container for holding one or more articles is provided. The method includes transferring the container using a transferring mechanism to a position which is adjacent to a destination space. The method further includes recording an image of the destination space before the container is deposited to the destination space. The method also includes performing an image analysis of the image and determining if the container is able to be sent to the destination space according to a result of the image analysis of the image.

公开(公告)号：US20200043812A1

公开(公告)日：2020-02-06

申请号：US16600789

申请日：2019-10-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Han Lin ,  Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Sheng-Hsiang Chuang ,  Surendra Kumar Soni ,  Shou-Wen Kuo ,  Wu-An Weng ,  Gary Tsai ,  Chien-Ko Liao ,  Ya Hsun Hsueh ,  Becky Liao ,  Ethan Yu ,  Ming-Chi Tsai ,  Kuo-Yi Liu

IPC: H01L21/66 ,  H05K13/08 ,  G06K9/20 ,  H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

公开(公告)号：US20190035696A1

公开(公告)日：2019-01-31

申请号：US15904795

申请日：2018-02-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Han Lin ,  Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Sheng-Hsiang Chuang ,  Surendra Kumar Soni ,  Shou-Wen Kuo ,  Wu-An Weng ,  Gary Tsai ,  Chien-Ko Liao ,  Ya Hsun Hsueh ,  Becky Liao ,  Ethan Yu ,  Ming-Chi Tsai ,  Kuo-Yi Liu

IPC: H01L21/66 ,  H05K13/08 ,  H01L21/67 ,  G06K9/20

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.