公开(公告)号：US20240136213A1

公开(公告)日：2024-04-25

申请号：US18403613

申请日：2024-01-03

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Yung-Lin HSU ,  Kuang Huan HSU ,  Jeff CHEN ,  Steven HUANG ,  Yueh-Lun YANG

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67703 ,  H01L21/67196 ,  H01L21/67727

摘要： In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US20230178401A1

公开(公告)日：2023-06-08

申请号：US18104731

申请日：2023-02-01

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Yung-Lin HSU ,  Kuang Huan HSU ,  Jeff CHEN ,  Steven HUANG ,  Yueh-Lun YANG

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67703 ,  H01L21/67196 ,  H01L21/67727

摘要： In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US20210265187A1

公开(公告)日：2021-08-26

申请号：US17317747

申请日：2021-05-11

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Yung-Lin HSU ,  Kuang Huan HSU ,  Jeff CHEN ,  Steven HUANG ,  Yueh-Lun YANG

IPC分类号： H01L21/677 ,  H01L21/67

摘要： In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.