公开(公告)号：US20240136213A1

公开(公告)日：2024-04-25

申请号：US18403613

申请日：2024-01-03

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Yung-Lin HSU ,  Kuang Huan HSU ,  Jeff CHEN ,  Steven HUANG ,  Yueh-Lun YANG

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67703 ,  H01L21/67196 ,  H01L21/67727

摘要： In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US20230411193A1

公开(公告)日：2023-12-21

申请号：US17843228

申请日：2022-06-17

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Y.Y. LEE ,  Kuang Huan HSU ,  Li-Hsin CHU ,  Jen-Ti WANG ,  Chieh HSU

IPC分类号： H01L21/677

CPC分类号： H01L21/67724

摘要： When there is an interruption in power to an area of an integrated circuit manufacturing facility, product may be stranded in a vehicle mounted to an automated material handling system. An automated rescue vehicle can be deployed to retrieve the stranded vehicle so that a payload carried by that vehicle can be recovered and processing can resume. The rescue vehicle can carry a battery payload. The battery payload provides backup power while the rescue operation is performed. With such an automated system, no human intervention is needed to recover product during a power outage. In addition to improving wafer throughput during the power outage, such a rescue operation may prevent quality degradation for time-critical sequences of processing operations.

公开(公告)号：US20230230839A1

公开(公告)日：2023-07-20

申请号：US18126861

申请日：2023-03-27

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Li-Hsin CHU ,  Po-Feng TSAI ,  Henry PENG ,  Kuang Huan HSU ,  Tsung Wei CHEN ,  Yung-Lin HSU

IPC分类号： H01L21/265 ,  C23C14/54 ,  C23C14/48 ,  H01L21/66

CPC分类号： H01L21/26586 ,  C23C14/54 ,  C23C14/48 ,  H01L22/14

摘要： The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.

公开(公告)号：US20230178401A1

公开(公告)日：2023-06-08

申请号：US18104731

申请日：2023-02-01

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Yung-Lin HSU ,  Kuang Huan HSU ,  Jeff CHEN ,  Steven HUANG ,  Yueh-Lun YANG

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67703 ,  H01L21/67196 ,  H01L21/67727

摘要： In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US20210265187A1

公开(公告)日：2021-08-26

申请号：US17317747

申请日：2021-05-11

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Yung-Lin HSU ,  Kuang Huan HSU ,  Jeff CHEN ,  Steven HUANG ,  Yueh-Lun YANG

IPC分类号： H01L21/677 ,  H01L21/67

摘要： In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.