公开(公告)号：US12272580B2

公开(公告)日：2025-04-08

申请号：US18403613

申请日：2024-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Yung-Lin Hsu ,  Kuang Huan Hsu ,  Jeff Chen ,  Steven Huang ,  Yueh-Lun Yang

IPC: H01L21/677 ,  H01L21/67

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US11901206B2

公开(公告)日：2024-02-13

申请号：US18104731

申请日：2023-02-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Yung-Lin Hsu ,  Kuang Huan Hsu ,  Jeff Chen ,  Steven Huang ,  Yueh-Lun Yang

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67703 ,  H01L21/67196 ,  H01L21/67727

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US20190164794A1

公开(公告)日：2019-05-30

申请号：US15904032

申请日：2018-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Yung-Lin Hsu ,  Kuang Huan Hsu ,  Jeff Chen ,  Steven Huang ,  Yueh-Lun Yang

IPC: H01L21/677 ,  H01L21/67

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US11587811B2

公开(公告)日：2023-02-21

申请号：US17317747

申请日：2021-05-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Yung-Lin Hsu ,  Kuang Huan Hsu ,  Jeff Chen ,  Steven Huang ,  Yueh-Lun Yang

IPC: H01L21/677 ,  H01L21/67

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US11011401B2

公开(公告)日：2021-05-18

申请号：US15904032

申请日：2018-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Yung-Lin Hsu ,  Kuang Huan Hsu ,  Jeff Chen ,  Steven Huang ,  Yueh-Lun Yang

IPC: H01L21/677 ,  H01L21/67

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.