公开(公告)号：US11615961B2

公开(公告)日：2023-03-28

申请号：US17529504

申请日：2021-11-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Li-Hsin Chu ,  Po-Feng Tsai ,  Henry Peng ,  Kuang Huan Hsu ,  Tsung Wei Chen ,  Yung-Lin Hsu

IPC: H01L21/265 ,  C23C14/54 ,  C23C14/48 ,  H01L21/66

Abstract: The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.

公开(公告)号：US11195720B2

公开(公告)日：2021-12-07

申请号：US16381863

申请日：2019-04-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Li-Hsin Chu ,  Po-Feng Tsai ,  Henry Peng ,  Kuang Huan Hsu ,  Tsung Wei Chen ,  Yung-Lin Hsu

IPC: H01L21/265 ,  C23C14/54 ,  C23C14/48 ,  H01L21/66

Abstract: The present disclosure describes a system and a method for a ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.

公开(公告)号：US10564632B2

公开(公告)日：2020-02-18

申请号：US15883497

申请日：2018-01-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Lin Hsu ,  Richard Lin ,  Chiung-Min Lin ,  Alan Yang

IPC: G05B19/418 ,  H01L21/677

Abstract: In an embodiment an automated material handling system (AMHS) for a semiconductor fabrication facility (FAB) includes: a sensor supported by a rail, wherein the sensor is configured to collect sensor data characterizing a vehicle that moves along the rail, wherein the vehicle is configured to carry at least one wafer; and a monitoring module configured to: detect a trigger event based on the sensor data, and initiate a remediation action in response to the trigger event.

公开(公告)号：US10464583B2

公开(公告)日：2019-11-05

申请号：US15645980

申请日：2017-07-10

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Shih-Hung Chien ,  Jen-Ti Wang ,  Fu-Hsien Li ,  Chih-Hung Liu ,  Yung-Lin Hsu

IPC: B61L23/04 ,  B60M1/12 ,  B61B13/00 ,  B60M1/28 ,  B61L25/02

Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle body, at least one supporting structure, and at least one first sensor. The wheeled trolley is operable to move over one or more rails of the rail system. The supporting structure connects the wheeled trolley and overhead vehicle body. The first sensor is on the wheeled trolley and configured to detect at least one first parameter of the one or more rails of the rail system.

公开(公告)号：US20180151412A1

公开(公告)日：2018-05-31

申请号：US15438883

申请日：2017-02-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chun-Jung Huang ,  Hsu-Shui Liu ,  Han-Wen Liao ,  Yu-Yao Huang ,  Hsiao-Wei Chen ,  Yung-Lin Hsu ,  Kuang-Huan Hsu

IPC: H01L21/762 ,  H01L29/06 ,  H01L27/092 ,  H01L21/8238 ,  H01L21/3105 ,  H01L21/02

CPC classification number: H01L21/76224 ,  H01L21/02112 ,  H01L21/02126 ,  H01L21/02271 ,  H01L21/0228 ,  H01L21/02282 ,  H01L21/31053 ,  H01L21/76819 ,  H01L21/76837 ,  H01L29/0649 ,  H01L29/665 ,  H01L29/6659 ,  H01L29/7833

Abstract: A planarization method includes forming a dielectric layer over a polish stop layer. The dielectric layer is polished until reaching the polish stop layer, and the polished dielectric layer has a concave top surface. A compensation layer is formed over the concave top surface. The compensation layer is polished.

公开(公告)号：US12051593B2

公开(公告)日：2024-07-30

申请号：US18126861

申请日：2023-03-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Li-Hsin Chu ,  Po-Feng Tsai ,  Henry Peng ,  Kuang Huan Hsu ,  Tsung Wei Chen ,  Yung-Lin Hsu

IPC: H01L21/265 ,  C23C14/48 ,  C23C14/54 ,  H01L21/66

CPC classification number: H01L21/26586 ,  C23C14/48 ,  C23C14/54 ,  H01L22/14

Abstract: The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.

公开(公告)号：US11626315B2

公开(公告)日：2023-04-11

申请号：US15438883

申请日：2017-02-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chun-Jung Huang ,  Hsu-Shui Liu ,  Han-Wen Liao ,  Yu-Yao Huang ,  Hsiao-Wei Chen ,  Yung-Lin Hsu ,  Kuang-Huan Hsu

IPC: H01L21/3105 ,  H01L21/762 ,  H01L29/06 ,  H01L29/66 ,  H01L21/02 ,  H01L21/768 ,  H01L29/78

Abstract: A planarization method includes forming a dielectric layer over a polish stop layer. The dielectric layer is polished until reaching the polish stop layer, and the polished dielectric layer has a concave top surface. A compensation layer is formed over the concave top surface. The compensation layer is polished.

公开(公告)号：US20190164794A1

公开(公告)日：2019-05-30

申请号：US15904032

申请日：2018-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Yung-Lin Hsu ,  Kuang Huan Hsu ,  Jeff Chen ,  Steven Huang ,  Yueh-Lun Yang

IPC: H01L21/677 ,  H01L21/67

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US12272580B2

公开(公告)日：2025-04-08

申请号：US18403613

申请日：2024-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Yung-Lin Hsu ,  Kuang Huan Hsu ,  Jeff Chen ,  Steven Huang ,  Yueh-Lun Yang

IPC: H01L21/677 ,  H01L21/67

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US11901206B2

公开(公告)日：2024-02-13

申请号：US18104731

申请日：2023-02-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Jung Huang ,  Yung-Lin Hsu ,  Kuang Huan Hsu ,  Jeff Chen ,  Steven Huang ,  Yueh-Lun Yang

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67703 ,  H01L21/67196 ,  H01L21/67727

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.