公开(公告)号：US20210060728A1

公开(公告)日：2021-03-04

申请号：US17097668

申请日：2020-11-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Chen Wei ,  Chih-Yuan Yang ,  Shih-Ho Lin ,  Jen Chieh Lai ,  Szu-Cheng Wang ,  Chun-Jui Chu

IPC: B24B53/017 ,  H01L21/306 ,  B24B37/04 ,  B24B53/06 ,  H01L21/321 ,  B24B53/00 ,  B24B1/00

Abstract: A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.

公开(公告)号：US20240383100A1

公开(公告)日：2024-11-21

申请号：US18787934

申请日：2024-07-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Chen Wei ,  Chih-Yuan Yang ,  Shih-Ho Lin ,  Jen Chieh Lai ,  Szu-Cheng Wang ,  Chun-Jui Chu

IPC: B24B53/017 ,  B24B1/00 ,  B24B37/04 ,  B24B53/00 ,  B24B53/06 ,  H01L21/306 ,  H01L21/321 ,  H01L21/67

Abstract: A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.