公开(公告)号：US20230364734A1

公开(公告)日：2023-11-16

申请号：US18359180

申请日：2023-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Pin-Chuan Su ,  Jeng-Chi Lin ,  Guan-Yi Lee ,  Hui-Chi Huang ,  Kei-Wei Chen

IPC: B24B37/20 ,  H01L21/306 ,  H01L21/321

CPC classification number: B24B37/20 ,  H01L21/30625 ,  H01L21/3212

Abstract: An embodiment is a polishing pad including a top pad and a sub pad that is below and contacting the top pad. The top pad includes top grooves along a top surface and microchannels extending from the top grooves to a bottom surface of the top pad. The sub pad includes sub grooves along a top surface of the sub pad.

公开(公告)号：US20220359191A1

公开(公告)日：2022-11-10

申请号：US17872620

申请日：2022-07-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hui-Chi Huang ,  Jeng-Chi Lin ,  Pin-Chuan Su ,  Chien-Ming Wang ,  Kei-Wei Chen

IPC: H01L21/02 ,  B08B7/04 ,  B08B1/00 ,  B08B3/08 ,  B08B5/04 ,  A46B13/04 ,  B08B1/04

Abstract: A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.