SPIN DISPENSER MODULE SUBSTRATE SURFACE PROTECTION SYSTEM

    公开(公告)号:US20220288627A1

    公开(公告)日:2022-09-15

    申请号:US17826561

    申请日:2022-05-27

    Abstract: A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

    Baking apparatus and method
    6.
    发明授权
    Baking apparatus and method 有权
    烘烤设备和方法

    公开(公告)号:US09536759B2

    公开(公告)日:2017-01-03

    申请号:US14725285

    申请日:2015-05-29

    Abstract: A baking apparatus for baking a wafer is provided. The baking apparatus includes a wafer chuck configured to hold the wafer, and a heating device disposed over the wafer chuck and configured to heat the wafer. The baking apparatus also includes a carrying arm configured to transport the wafer over the wafer chuck. The wafer chuck is in physical contact with the center area of the bottom surface of the wafer when the wafer is held by the wafer chuck.

    Abstract translation: 提供了一种用于烘烤晶片的烘烤装置。 烘烤装置包括构造成保持晶片的晶片卡盘和设置在晶片卡盘上方并构造成加热晶片的加热装置。 烘烤设备还包括配置成将晶片输送到晶片卡盘上的承载臂。 当晶片被晶片卡盘保持时,晶片卡盘与晶片的底表面的中心区域物理接触。

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