公开(公告)号：US20170317038A1

公开(公告)日：2017-11-02

申请号：US15227060

申请日：2016-08-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Peng TSAI ,  Sheng-Feng WENG ,  Sheng-Hsiang CHIU ,  Meng-Tse CHEN ,  Chih-Wei LIN ,  Wei-Hung LIN ,  Ming-Da CHENG ,  Ching-Hua HSIEH ,  Chung-Shi LIU

IPC: H01L23/60 ,  H01L25/00 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31 ,  H05K9/00 ,  H01L25/065

CPC classification number: H01L23/60 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K9/0073 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Package structures and methods for forming the same are provided. The package structure includes an integrated circuit die and a first shielding feature over a base layer. The package structure also includes a package layer encapsulating the integrated circuit die and the first shielding feature. The package structure further includes a second shielding feature extending from the side surface of the base layer towards the first shielding feature to electrically connect to the first shielding feature. The side surface of the second shielding feature faces away from the side surface of the base layer and is substantially coplanar with the side surface of the package layer.