公开(公告)号：US20240087861A1

公开(公告)日：2024-03-14

申请号：US18513313

申请日：2023-11-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Jen YANG ,  Yi-Zhen CHEN ,  Chih-Pin WANG ,  Chao-Li SHIH ,  Ching-Hou SU ,  Cheng-Yi HUANG

IPC: H01J37/34 ,  C23C14/35

CPC classification number: H01J37/3408 ,  C23C14/35 ,  H01J37/3458 ,  H01J2237/152

Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.

公开(公告)号：US20220367160A1

公开(公告)日：2022-11-17

申请号：US17876422

申请日：2022-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Jen YANG ,  Yi-Zhen CHEN ,  Chih-Pin WANG ,  Chao-Li SHIH ,  Ching-Hou SU ,  Cheng-Yi HUANG

IPC: H01J37/34 ,  C23C14/35

Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.

公开(公告)号：US20250112032A1

公开(公告)日：2025-04-03

申请号：US18981170

申请日：2024-12-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Jen YANG ,  Yi-Zhen CHEN ,  Chih-Pin WANG ,  Chao-Li SHIH ,  Ching-Hou SU ,  Cheng-Yi HUANG

IPC: H01J37/34 ,  C23C14/35

Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.

公开(公告)号：US20200161108A1

公开(公告)日：2020-05-21

申请号：US16596109

申请日：2019-10-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Jen YANG ,  Yi-Zhen CHEN ,  Chih-Pin WANG ,  Chao-Li SHIH ,  Ching-Hou SU ,  Cheng-Yi HUANG

IPC: H01J37/34 ,  C23C14/35

Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.