公开(公告)号：US20240363560A1

公开(公告)日：2024-10-31

申请号：US18766246

申请日：2024-07-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Feng Wei KUO ,  Wen-Shiang LIAO ,  Chewn-Pu JOU ,  Huan-Neng CHEN ,  Lan-Chou CHO ,  William Wu SHEN

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H01L23/522 ,  H01L23/552 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5225 ,  H01L23/552 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6638 ,  H01L2224/16225 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1443 ,  H01L2924/146 ,  H01L2924/3025

Abstract: A semiconductor package includes a first semiconductor device, a second semiconductor device vertically positioned above the first semiconductor device, and a ground shielded transmission path. The ground shielded transmission path couples the first semiconductor device to the second semiconductor device. The ground shielded transmission path includes a first signal path extending longitudinally between a first end and a second end. The first signal path includes a conductive material. A first insulating layer is disposed over the signal path longitudinally between the first end and the second end. The first insulating layer includes an electrically insulating material. A ground shielding layer is disposed over the insulating material longitudinally between the first end and the second end of the signal path. The ground shielding layer includes a conductive material coupled to ground. The ground shielding layer drives radiation signals received therein to ground to prevent induced noise in the first signal path.

公开(公告)号：US20170278806A1

公开(公告)日：2017-09-28

申请号：US15076976

申请日：2016-03-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Feng Wei KUO ,  Wen-Shiang LIAO ,  Chewn-Pu JOU ,  Huan-Neng CHEN ,  Lan-Chou CHO ,  William Wu SHEN

IPC: H01L23/66 ,  H01L25/18 ,  H01L23/00 ,  H01L25/065 ,  H01L23/552 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5225 ,  H01L23/552 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6638 ,  H01L2224/16225 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1443 ,  H01L2924/146 ,  H01L2924/3025

Abstract: A semiconductor package includes a first semiconductor device, a second semiconductor device vertically positioned above the first semiconductor device, and a ground shielded transmission path. The ground shielded transmission path couples the first semiconductor device to the second semiconductor device. The ground shielded transmission path includes a first signal path extending longitudinally between a first end and a second end. The first signal path includes a conductive material. A first insulating layer is disposed over the signal path longitudinally between the first end and the second end. The first insulating layer includes an electrically insulating material. A ground shielding layer is disposed over the insulating material longitudinally between the first end and the second end of the signal path. The ground shielding layer includes a conductive material coupled to ground. The ground shielding layer drives radiation signals received therein to ground to prevent induced noise in the first signal path.

公开(公告)号：US20210175187A1

公开(公告)日：2021-06-10

申请号：US17182155

申请日：2021-02-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Feng Wei KUO ,  Wen-Shiang LIAO ,  Chewn-Pu JOU ,  Huan-Neng CHEN ,  Lan-Chou CHO ,  William Wu SHEN

IPC: H01L23/66 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L23/552 ,  H01L23/522 ,  H01L25/18

Abstract: A semiconductor package includes a first semiconductor device, a second semiconductor device vertically positioned above the first semiconductor device, and a ground shielded transmission path. The ground shielded transmission path couples the first semiconductor device to the second semiconductor device. The ground shielded transmission path includes a first signal path extending longitudinally between a first end and a second end. The first signal path includes a conductive material. A first insulating layer is disposed over the signal path longitudinally between the first end and the second end. The first insulating layer includes an electrically insulating material. A ground shielding layer is disposed over the insulating material longitudinally between the first end and the second end of the signal path. The ground shielding layer includes a conductive material coupled to ground. The ground shielding layer drives radiation signals received therein to ground to prevent induced noise in the first signal path.

公开(公告)号：US20140096102A1

公开(公告)日：2014-04-03

申请号：US13683901

申请日：2012-11-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chung-min FU ,  William Wu SHEN ,  Po-Hsiang HUANG ,  Meng-Fu YOU ,  Chi-Yeh YU

IPC: G06F17/50

CPC classification number: G06F17/50 ,  G06F17/5009 ,  G06F2217/40 ,  G06F2217/80

Abstract: A computer implemented method comprises accessing a 3D-IC model stored in a tangible, non-transitory machine readable medium, inputting a power profile in a computer processor, generating a transient temperature profile based on the 3D-IC model, identifying a potential thermal violation at a corresponding operating time interval and a corresponding location of a plurality of points of the 3D-IC design, and outputting data representing the potential thermal violation. The 3D-IC model represents a 3D-IC design comprising a plurality of elements in a stack configuration. The power profile is applied to the plurality of elements of the 3D-IC design as a function of an operating time. The transient temperature profile includes temperatures at a plurality of points of the 3D-IC design as a function of an operating time.

Abstract translation: 计算机实现的方法包括访问存储在有形的，非暂时的机器可读介质中的3D-IC模型，在计算机处理器中输入功率分布，基于3D-IC模型生成瞬态温度分布，识别潜在的热违规 在相应的操作时间间隔和3D-IC设计的多个点的对应位置，并输出表示潜在的热违规的数据。 3D-IC模型表示包括堆叠配置中的多个元件的3D-IC设计。 功率分布作为操作时间的函数应用于3D-IC设计的多个元件。 瞬态温度分布包括作为操作时间的函数的3D-IC设计的多个点处的温度。

公开(公告)号：US20180287775A1

公开(公告)日：2018-10-04

申请号：US16002970

申请日：2018-06-07

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Huan-Neng CHEN ,  William Wu SHEN ,  Lan-Chou CHO ,  Feng-Wei KUO ,  Chewn-Pu JOU

IPC: H04L7/033 ,  H04L27/00 ,  H04L7/04 ,  H04L7/00

CPC classification number: H04L7/0331 ,  H04L7/0041 ,  H04L7/042 ,  H04L27/00 ,  H04L27/227

Abstract: A device, a circuit and a method are disclosed herein. The device includes a data receiving circuit and an oscillating signal generator. The data receiving circuit is configured to output a first output signal, a second output signal, and a phase error signal according to an oscillating signal and a modulated signal, in which the phase error signal indicates a phase difference between the oscillating signal and the modulated signal. The oscillating signal generator is configured to delay a phase of a first reference signal according to the phase error signal, to generate the oscillating signal.

公开(公告)号：US20170134155A1

公开(公告)日：2017-05-11

申请号：US14938356

申请日：2015-11-11

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Huan-Neng CHEN ,  William Wu SHEN ,  Lan-Chou CHO ,  Feng-Wei KUO ,  Chewn-Pu JOU

IPC: H04L7/033 ,  H04L7/04 ,  H04L7/00

CPC classification number: H04L7/0331 ,  H04L7/0041 ,  H04L7/042 ,  H04L27/00 ,  H04L27/227

Abstract: A device, a circuit and a method are disclosed herein. The device includes a data receiving circuit and an oscillating signal generator. The data receiving circuit is configured to output a first output signal, a second output signal, and a phase error signal according to an oscillating signal and a modulated signal, in which the phase error signal indicates a phase difference between the oscillating signal and the modulated signal. The oscillating signal generator is configured to delay a phase of a first reference signal according to the phase error signal, to generate the oscillating signal.