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    APPARATUS AND METHOD FOR DETECTING END POINT
    1.
    发明申请
    APPARATUS AND METHOD FOR DETECTING END POINT 审中-公开

    公开(公告)号：US20200176337A1

    公开(公告)日：2020-06-04

    申请号：US16420186

    申请日：2019-05-23

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yi-Chao Mao ,  Chin-Chuan Chang ,  Szu-Wei Lu

    IPC: H01L21/66 ,  H01L21/56 ,  H01L21/306

    Abstract: An apparatus for detecting an endpoint of a grinding process includes a connecting device, a timer and a controller. The connecting device is connected to a sensor that periodically senses an interface of a reconstructed wafer comprising a plurality of dies of at least two types to generate a thickness signal comprising thicknesses from a surface of an insulating layer of the reconstructed wafer to the interface of the reconstructed wafer. The timer is configured to generate a clock signal having a plurality of pulses with a time interval. The controller is coupled to the sensor and the timer, and configured to filter the thickness signal according to the clock signal to output a thickness extremum among the thicknesses in the thickness signal within each time interval, wherein the thickness signal after the filtering is used to determine the endpoint of the grinding process being performed on the reconstructed wafer.

    Method for substrate thinning
    4.
    发明授权
    Method for substrate thinning 有权

    公开(公告)号：US11056364B2

    公开(公告)日：2021-07-06

    申请号：US16886800

    申请日：2020-05-29

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yi-Chao Mao ,  Chin-Chuan Chang ,  Szu-Wei Lu

    IPC: H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  H01L21/687 ,  H01L21/56

    Abstract: A method for thinning a substrate is provided. The method includes at least the following steps. A substrate is disposed on a carrying surface of a chuck, where a first liquid supply unit surrounds the chuck to form a frame of the chuck, and an outlet of the first liquid supply unit is disposed aside the carrying surface of the chuck. A first liquid flows from a bottom of the frame to the outlet and discharges to fill a gap between the substrate and the carrying surface of the chuck. The substrate is thinned during the gap is filled.

    Structure and formation method of package structure with stacked semiconductor dies
    5.
    发明授权
    Structure and formation method of package structure with stacked semiconductor dies 有权

    公开(公告)号：US11239180B2

    公开(公告)日：2022-02-01

    申请号：US16227449

    申请日：2018-12-20

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yi-Chao Mao ,  Chin-Chuan Chang ,  Szu-Wei Lu

    IPC: H01L23/52 ,  H01L23/00 ,  H01L21/768

    Abstract: A structure and a formation method of a package structure are provided. The method includes disposing a first semiconductor die over a carrier substrate and forming a first protective layer to surround the first semiconductor die. The method also includes forming a dielectric layer over the first protective layer and the first semiconductor die. The method further includes patterning the dielectric layer to form an opening partially exposing the first semiconductor die and the first protective layer. In addition, the method includes bonding a second semiconductor die to the first semiconductor die after the opening is formed. The method includes forming a second protective layer to surround the second semiconductor die.

    Apparatus and method for detecting end point
    6.
    发明授权
    Apparatus and method for detecting end point 有权

    公开(公告)号：US10964609B2

    公开(公告)日：2021-03-30

    申请号：US16420186

    申请日：2019-05-23

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yi-Chao Mao ,  Chin-Chuan Chang ,  Szu-Wei Lu

    IPC: H01L21/56 ,  H01L21/66 ,  H01L21/306

    Abstract: An apparatus for detecting an endpoint of a grinding process includes a connecting device, a timer and a controller. The connecting device is connected to a sensor that periodically senses an interface of a reconstructed wafer comprising a plurality of dies of at least two types to generate a thickness signal comprising thicknesses from a surface of an insulating layer of the reconstructed wafer to the interface of the reconstructed wafer. The timer is configured to generate a clock signal having a plurality of pulses with a time interval. The controller is coupled to the sensor and the timer, and configured to filter the thickness signal according to the clock signal to output a thickness extremum among the thicknesses in the thickness signal within each time interval, wherein the thickness signal after the filtering is used to determine the endpoint of the grinding process being performed on the reconstructed wafer.

    METHOD FOR SUBSTRATE THINNING
    7.
    发明申请
    METHOD FOR SUBSTRATE THINNING 审中-公开

    公开(公告)号：US20200294818A1

    公开(公告)日：2020-09-17

    申请号：US16886800

    申请日：2020-05-29

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yi-Chao Mao ,  Chin-Chuan Chang ,  Szu-Wei Lu

    IPC: H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  H01L21/687 ,  H01L21/56

    Abstract: A method for thinning a substrate is provided. The method includes at least the following steps. A substrate is disposed on a carrying surface of a chuck, where a first liquid supply unit surrounds the chuck to form a frame of the chuck, and an outlet of the first liquid supply unit is disposed aside the carrying surface of the chuck. A first liquid flows from a bottom of the frame to the outlet and discharges to fill a gap between the substrate and the carrying surface of the chuck. The substrate is thinned during the gap is filled.

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