公开(公告)号：US20230065405A1

公开(公告)日：2023-03-02

申请号：US17458607

申请日：2021-08-27

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hao Chang ,  Po-Chun Lin ,  Chun-Ti Lu ,  Zheng-Gang Tsai ,  Shih-Wei Chen ,  Chia-Hung Liu ,  Hao-Yi Tsai ,  Chung-Shi Liu

IPC: H01L23/58 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern. The conductive vias extend through the molded semiconductor device and are electrically connected with the redistribution pattern.

公开(公告)号：US20240321780A1

公开(公告)日：2024-09-26

申请号：US18732662

申请日：2024-06-04

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hao Chang ,  Po-Chun Lin ,  Chun-Ti Lu ,  Zheng-Gang Tsai ,  Shih-Wei Chen ,  Chia-Hung Liu ,  Hao-Yi Tsai ,  Chung-Shi Liu

IPC: H01L23/58 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/585 ,  H01L21/568 ,  H01L23/3157 ,  H01L24/19 ,  H01L24/25 ,  H01L2224/2518

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern. The conductive vias extend through the molded semiconductor device and are electrically connected with the redistribution pattern.

公开(公告)号：US12002768B2

公开(公告)日：2024-06-04

申请号：US17458607

申请日：2021-08-27

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hao Chang ,  Po-Chun Lin ,  Chun-Ti Lu ,  Zheng-Gang Tsai ,  Shih-Wei Chen ,  Chia-Hung Liu ,  Hao-Yi Tsai ,  Chung-Shi Liu

IPC: H01L23/58 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/585 ,  H01L21/568 ,  H01L23/3157 ,  H01L24/19 ,  H01L24/25 ,  H01L2224/2518

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern. The conductive vias extend through the molded semiconductor device and are electrically connected with the redistribution pattern.

公开(公告)号：US20240096781A1

公开(公告)日：2024-03-21

申请号：US18186209

申请日：2023-03-20

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Ti Lu ,  Hao-Yi Tsai ,  Chia-Hung Liu ,  Yu-Hsiang Hu ,  Hsiu-Jen Lin ,  Tzuan-Horng Liu ,  Chih-Hao Chang ,  Bo-Jiun Lin ,  Shih-Wei Chen ,  Hung-Chun Cho ,  Pei-Rong Ni ,  Hsin-Wei Huang ,  Zheng-Gang Tsai ,  Tai-You Liu ,  Po-Chang Shih ,  Yu-Ting Huang

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H10B80/00

CPC classification number: H01L23/49894 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H10B80/00 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.