公开(公告)号：US11972957B2

公开(公告)日：2024-04-30

申请号：US16947422

申请日：2020-07-31

Applicant: Taiwan Semiconductor Manufacturing Company Limited

Inventor： Sheng-chun Yang ,  Chih-Lung Cheng ,  Yi-Ming Lin ,  Po-Chih Huang ,  Yu-Hsiang Juan ,  Xuan-Yang Zheng

IPC: C23C16/44 ,  C23C8/24 ,  C23C14/50 ,  C23C16/458 ,  F15D1/02 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67017 ,  C23C8/24 ,  C23C14/50 ,  C23C16/4401 ,  C23C16/4412 ,  C23C16/4583 ,  C23C16/4586 ,  F15D1/025 ,  H01J37/32715 ,  H01J37/32834 ,  H01L21/6838

Abstract: A gas flow accelerator may include a body portion, and a tapered body portion including a first end integrally formed with the body portion. The gas flow accelerator may include an inlet port connected to the body portion and to receive a process gas to be removed from a semiconductor processing tool by a main pumping line. The semiconductor processing tool may include a chuck and a chuck vacuum line to apply a vacuum to the chuck to retain a semiconductor device. The tapered body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line. The gas flow accelerator may include an outlet port integrally formed with a second end of the tapered body portion. An end portion of the chuck vacuum line may be provided through the outlet port.

公开(公告)号：US12055228B2

公开(公告)日：2024-08-06

申请号：US17716046

申请日：2022-04-08

Applicant: Taiwan Semiconductor Manufacturing Company Limited

Inventor： Sheng-Chun Yang ,  Po-Chih Huang ,  Chang Chun ,  Xuan-Yang Zheng ,  Tzu-Chuan Chao ,  Ren-Jyue Wang ,  Yi-Ming Lin

IPC: F16K24/06 ,  F16K1/22

CPC classification number: F16K24/06 ,  F16K1/221

Abstract: A valve for throttling gas flow from a semiconductor processing tool includes a valve body. A shaft extends through the valve body. The shaft defines an internal cavity and a first opening communicating with the internal cavity. A first deflector is positioned on the shaft proximate the first opening and directed at a first interface between the shaft and the valve body. A method for throttling gas flow from a semiconductor processing tool includes providing a gas in an internal cavity defined in a shaft of a valve and directing the gas through an opening defined in the shaft and communicating with the bore toward an interface between the shaft and a valve body of the valve supporting the shaft.

公开(公告)号：US20220403945A1

公开(公告)日：2022-12-22

申请号：US17716046

申请日：2022-04-08

Applicant: Taiwan Semiconductor Manufacturing Company Limited

Inventor： Sheng-Chun Yang ,  Po-Chih Huang ,  Chang Chun ,  Xuan-Yang Zheng ,  Tzu-Chuan Chao ,  Ren-Jyue Wang

IPC: F16K24/06 ,  F16K1/22

Abstract: A valve for throttling gas flow from a semiconductor processing tool includes a valve body. A shaft extends through the valve body. The shaft defines an internal cavity and a first opening communicating with the internal cavity. A first deflector is positioned on the shaft proximate the first opening and directed at a first interface between the shaft and the valve body. A method for throttling gas flow from a semiconductor processing tool includes providing a gas in an internal cavity defined in a shaft of a valve and directing the gas through an opening defined in the shaft and communicating with the bore toward an interface between the shaft and a valve body of the valve supporting the shaft.