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    Light source
    9.
    发明授权
    Light source 有权
    光源

    公开(公告)号：US08410501B2

    公开(公告)日：2013-04-02

    申请号：US12519506

    申请日：2008-01-10

    申请人： Satoshi Shida ,  Hiroyuki Naito ,  Takaari Uemoto

    发明人： Satoshi Shida ,  Hiroyuki Naito ,  Takaari Uemoto

    IPC分类号： H01L33/00

    CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/60 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light source that restricts the heat accumulation in the phosphor. The light source includes: a substrate 5; LED elements D21, D22, D23, D41, D42 that have been implemented on a main surface of the substrate 5; projections 11 that have been formed in areas of the main surface of the substrate 5 in which any of the LED elements D21, D22, D23, D41, D42 have not been implemented; and a translucent sealing member 7 that has been formed on the substrate in a state that the LED elements D21, D22, D23, D41, D42 and the projections 11 are covered and sealed with the sealing member 7. The sealing member 7 includes a phosphor 13 that converts light from the LED elements D21, D22, D23, D41, D42 into light of a predetermined color. The heat conductivity of the projections 11 is higher than the heat conductivity of the sealing member 7.

    摘要翻译： 限制荧光体中的热积聚的光源。 光源包括：基板5; 已经实现在基板5的主表面上的LED元件D21，D22，D23，D41，D42; 已经形成在其中没有实现任何LED元件D21，D22，D23，D41，D42的基板5的主表面的区域中的突起11; 以及在LED元件D21，D22，D23，D41，D42和突起11被密封构件7覆盖和密封的状态下在基板上形成的半透明密封构件7.密封构件7包括荧光体 将来自LED元件D21，D22，D23，D41，D42的光转换为预定颜色的光。 突起11的导热率高于密封部件7的导热率。

    LIGHT SOURCE
    10.
    发明申请
    LIGHT SOURCE 有权
    光源

    公开(公告)号：US20090321772A1

    公开(公告)日：2009-12-31

    申请号：US12519506

    申请日：2008-01-10

    申请人： Satoshi Shida ,  Hiroyuki Naito ,  Takaari Uemoto

    发明人： Satoshi Shida ,  Hiroyuki Naito ,  Takaari Uemoto

    IPC分类号： H01L33/00

    CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/60 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light source that restricts the heat accumulation in the phosphor. The light source includes: a substrate 5; LED elements D21, D22, D23, D41, D42 that have been implemented on a main surface of the substrate 5; projections 11 that have been formed in areas of the main surface of the substrate 5 in which any of the LED elements D21, D22, D23, D41, D42 have not been implemented; and a translucent sealing member 7 that has been formed on the substrate in a state that the LED elements D21, D22, D23, D41, D42 and the projections 11 are covered and sealed with the sealing member 7. The sealing member 7 includes a phosphor 13 that converts light from the LED elements D21, D22, D23, D41, D42 into light of a predetermined color. The heat conductivity of the projections 11 is higher than the heat conductivity of the sealing member 7.

    摘要翻译： 限制荧光体中的热积聚的光源。 光源包括：基板5; 已经实现在基板5的主表面上的LED元件D21，D22，D23，D41，D42; 已经形成在其中没有实现任何LED元件D21，D22，D23，D41，D42的基板5的主表面的区域中的突起11; 以及在LED元件D21，D22，D23，D41，D42和突起11被密封构件7覆盖和密封的状态下在基板上形成的半透明密封构件7.密封构件7包括荧光体 将来自LED元件D21，D22，D23，D41，D42的光转换为预定颜色的光。 突起11的导热率高于密封部件7的导热率。