摘要:
A pattern dimension calculation method according to one embodiment calculates a taper shape of a mask member used as a mask when a circuit pattern is processed in an upper layer of the circuit pattern formed on a substrate. The method calculates an opening angle facing the mask member from a shape prediction position on the circuit pattern on the basis of the taper shape. The method calculates a dimension of the circuit pattern according to the opening angle formed at the shape prediction position.
摘要:
A method of manufacturing a semiconductor device, which forms a pattern by performing pattern transformation steps multiple times, comprises setting finished pattern sizes for patterns to be formed in each consecutive two pattern transformation steps among the plurality of pattern transformation steps based on a possible total amount of in-plane size variation of the patterns to be formed in the consecutive two pattern transformation steps.
摘要:
A design layout data creating method includes creating design layout data of a semiconductor device such that patterns formed on a wafer when patterns corresponding to the design layout data are formed on the wafer have a pattern coverage ratio within a predetermined range in a wafer surface and total peripheral length of the patterns formed on the wafer when the patterns corresponding to the design layout are formed on the wafer is pattern peripheral length within a predetermined range.
摘要:
A pattern correcting method of an embodiment computes a distribution of pattern coverages on a design layout of a circuit pattern in the vicinity of a position that becomes an error pattern in a case where an on-substrate pattern is formed. Then, an area on the design layout in which a difference in the distribution of the pattern coverages becomes small by adding an addition pattern is set as an addition area. Next, addition pattern candidates to be added to the addition area are generated, an addition pattern to be added to the design layout is selected from the candidates on the basis of a predetermined selection criterion, and the addition pattern is added to the addition area.
摘要:
A mask verification method includes setting optical parameters, verifying whether a pattern, which is obtained when a mask pattern other than a reference pattern of patterns on a mask is transferred on a substrate with use of the set optical parameters, satisfies dimensional specifications, and varying, when the pattern which is obtained when the mask pattern is transferred on the substrate is determined to fail to satisfy the dimensional specifications, the optical parameters at the time of transfer such that the pattern, which is obtained when the reference pattern is transferred on the substrate, satisfies a target dimensional condition, and verifying whether a pattern, which is obtained when the mask pattern other than the reference pattern of the patterns on the mask is transferred on the substrate with use of the varied optical parameters, satisfies the dimensional specifications.
摘要:
A pattern data creating method comprising: referring to a first correspondence relation between an amount of dimension variation between a first pattern formed on a substrate and a second pattern formed by processing the substrate using the first pattern and either one of a pattern total surface area and a pattern boundary length of the first pattern; and creating pattern data for forming the first pattern.
摘要:
A method of manufacturing a semiconductor device according to an embodiment includes determining a second exposure parameter including exposure parameters except for an exposure amount from a dimension distribution information so that a resist pattern of a first resist pattern formed based on a second pattern has a desired dimension in a plurality of regions to be shot within a surface of a wafer.
摘要:
According to an aspect of the present invention, there is provided a mask pattern data generation method including: a first step of obtaining a mask data representing from a design pattern by performing a process simulation with a process parameter having a first value; a second step of obtaining a finished pattern from the mask data by performing the process simulation with the process parameter having a different value; a third step of verifying whether a dimensional error therebetween is within an allowable range; and a fourth step of: if the dimensional error is within the allowable range, determining the mask pattern data; and if the dimensional error is not within the allowable range, repeating the above steps by updating the process parameter until the dimensional error becomes within the allowable range.