公开(公告)号：US20100178497A1

公开(公告)日：2010-07-15

申请号：US12377155

申请日：2007-08-03

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

IPC分类号： C08F120/18 ,  B32B27/36 ,  B32B27/32

CPC分类号： C09J133/10 ,  C09J7/381 ,  C09J125/14 ,  C09J2425/00 ,  C09J2433/00 ,  Y10T428/2891

摘要： Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, (meth)acrylic acid ester having a cyclic structure and alkyl (meth)acrylate having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesive strength under high temperature conditions, and alkali resistance, and easiness in stripping of an adhesive composition that has been processed at a high temperature. Consequently, there can be obtained an adhesive composition which has high heat resistance, adhesion strength under high temperature conditions, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.

摘要翻译： 公开了主要由通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯和具有链结构的（甲基）丙烯酸烷基酯）而得到的聚合物的粘合剂组合物。 单体组合物可以另外含有双官能单体，从而提高耐热性，高温条件下的粘合强度和耐碱性，以及在高温下处理的粘合剂组合物的剥离容易性。 因此，可以获得在高温条件下具有高耐热性，粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

公开(公告)号：US20100069593A1

公开(公告)日：2010-03-18

申请号：US12516363

申请日：2007-09-27

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

IPC分类号： C08F18/02

CPC分类号： C09J133/04 ,  C09J7/381 ,  C09J125/14 ,  C09J135/06 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2924/30105 ,  Y10T428/2852 ,  Y10T428/2891

摘要： An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.

摘要翻译： 作为主要成分，本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物， 具有链结构的（甲基）丙烯酸烷基酯; 具有脂肪族环的（甲基）丙烯酸酯; 和具有芳香环的（甲基）丙烯酸酯，其中：所述苯乙烯的含量为40〜69质量份; 具有链结构的（甲基）丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的（甲基）丙烯酸酯的含量为10〜25质量份; 具有芳环的（甲基）丙烯酸酯的含量为1〜5质量份，上述成分的总量为100质量份。 这允许在高温环境下提供具有高粘合强度的粘合剂组合物，以及即使在高温处理之后也具有高耐热性，高耐碱性和从半导体晶片等剥离的容易性。

公开(公告)号：US08148457B2

公开(公告)日：2012-04-03

申请号：US12514633

申请日：2007-09-26

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

IPC分类号： C08L31/00

CPC分类号： C09J153/00 ,  C08F212/08 ,  C08F220/06 ,  C08F220/18 ,  C08F290/046 ,  C08F2220/301 ,  C09J7/381 ,  C09J133/10 ,  C09J133/12 ,  C09J135/06 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2453/00 ,  Y10T428/2852 ,  Y10T428/2891

摘要： Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.

摘要翻译： 公开了一种粘合剂组合物，其组分是通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯）和具有链结构的（甲基）丙烯酸烷基酯获得的聚合物。 单体组合物还含有具有乙烯双键的羧酸，双官能单体和苯乙烯大分子单体。 聚合物具有苯乙烯嵌段。 这可以提高耐热性，在高温环境下的粘合强度，耐碱性，以及剥离已经进行高温处理的粘合剂组合物的容易性。 结果，可以获得耐热性高，在高温环境下的粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

公开(公告)号：US07999052B2

公开(公告)日：2011-08-16

申请号：US12377473

申请日：2007-08-01

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

IPC分类号： C08F220/10

CPC分类号： C08L53/00 ,  C08F293/00 ,  C08F293/005 ,  C08L2666/02 ,  C09J7/10 ,  C09J7/387 ,  C09J153/00 ,  C09J2453/00 ,  Y10T428/31721

摘要： An adhesive composition according to the present invention is an adhesive composition whose main component is a polymer obtained by copolymerization of a monomer composition, which monomer composition contains styrene, (meth)acrylic ester having a cyclic structure, and alkyl (meth)acrylate having a chain structure. The polymer thus having a styrene block segment allows improvement of thermal resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping following a high temperature process of the adhesive composition. As such, an adhesive composition is provided, which has high thermal resistance, adhesive strength in the high temperature environment, and alkaline resistance, and further which can easily carry out stripping of the adhesive composition after a high temperature process has been carried out to the adhesive composition.

摘要翻译： 根据本发明的粘合剂组合物是其主要成分是通过单体组合物共聚获得的聚合物，该单体组合物含有苯乙烯，具有环状结构的（甲基）丙烯酸酯和（甲基）丙烯酸烷基酯，其具有 链结构。 因此，具有苯乙烯嵌段链段的聚合物可以改善耐热性，在高温环境下的粘合强度，耐碱性和在粘合剂组合物的高温过程中的剥离容易性。 因此，提供了一种粘合剂组合物，其具有高耐热性，在高温环境中的粘合强度和耐碱性，并且还可以在进行高温处理之后容易地进行粘合剂组合物的剥离 粘合剂组成。

公开(公告)号：US20100227996A1

公开(公告)日：2010-09-09

申请号：US12377473

申请日：2007-08-01

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

IPC分类号： C08F220/10

CPC分类号： C08L53/00 ,  C08F293/00 ,  C08F293/005 ,  C08L2666/02 ,  C09J7/10 ,  C09J7/387 ,  C09J153/00 ,  C09J2453/00 ,  Y10T428/31721

摘要： An adhesive composition according to the present invention is an adhesive composition whose main component is a polymer obtained by copolymerization of a monomer composition, which monomer composition contains styrene, (meth)acrylic ester having a cyclic structure, and alkyl (meth)acrylate having a chain structure. The polymer thus having a styrene block segment allows improvement of thermal resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping following a high temperature process of the adhesive composition. As such, an adhesive composition is provided, which has high thermal resistance, adhesive strength in the high temperature environment, and alkaline resistance, and further which can easily carry out stripping of the adhesive composition after a high temperature process has been carried out to the adhesive composition.

摘要翻译： 根据本发明的粘合剂组合物是其主要成分是通过单体组合物共聚获得的聚合物，该单体组合物含有苯乙烯，具有环状结构的（甲基）丙烯酸酯和（甲基）丙烯酸烷基酯，其具有 链结构。 因此，具有苯乙烯嵌段链段的聚合物可以改善耐热性，在高温环境下的粘合强度，耐碱性和在粘合剂组合物的高温过程中的剥离容易性。 因此，提供了一种粘合剂组合物，其具有高耐热性，在高温环境中的粘合强度和耐碱性，并且进一步可以在对高温工艺进行后容易地进行粘合剂组合物的剥离 粘合剂组成。

公开(公告)号：US20100075141A1

公开(公告)日：2010-03-25

申请号：US12514633

申请日：2007-09-26

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

IPC分类号： B32B27/36 ,  C09J153/00

CPC分类号： C09J153/00 ,  C08F212/08 ,  C08F220/06 ,  C08F220/18 ,  C08F290/046 ,  C08F2220/301 ,  C09J7/381 ,  C09J133/10 ,  C09J133/12 ,  C09J135/06 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2453/00 ,  Y10T428/2852 ,  Y10T428/2891

摘要： Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.

摘要翻译： 公开了一种粘合剂组合物，其组分是通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯）和具有链结构的（甲基）丙烯酸烷基酯获得的聚合物。 单体组合物还含有具有乙烯双键的羧酸，双官能单体和苯乙烯大分子单体。 聚合物具有苯乙烯嵌段。 这可以提高耐热性，在高温环境下的粘合强度，耐碱性，以及剥离已经进行高温处理的粘合剂组合物的容易性。 结果，可以获得耐热性高，在高温环境下的粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

公开(公告)号：US08426543B2

公开(公告)日：2013-04-23

申请号：US12516363

申请日：2007-09-27

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

IPC分类号： C08F20/10

CPC分类号： C09J133/04 ,  C09J7/381 ,  C09J125/14 ,  C09J135/06 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2924/30105 ,  Y10T428/2852 ,  Y10T428/2891

摘要： An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.

摘要翻译： 作为主要成分，本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物， 具有链结构的（甲基）丙烯酸烷基酯; 具有脂肪族环的（甲基）丙烯酸酯; 和具有芳香环的（甲基）丙烯酸酯，其中：所述苯乙烯的含量为40〜69质量份; 具有链结构的（甲基）丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的（甲基）丙烯酸酯的含量为10〜25质量份; 具有芳环的（甲基）丙烯酸酯的含量为1〜5质量份，上述成分的总量为100质量份。 这允许在高温环境下提供具有高粘合强度的粘合剂组合物，以及即使在高温处理之后也具有高耐热性，高耐碱性和从半导体晶片等剥离的容易性。

公开(公告)号：US20050170612A1

公开(公告)日：2005-08-04

申请号：US11001575

申请日：2004-12-01

申请人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

发明人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

IPC分类号： C09J5/00 ,  C09J133/00 ,  C09J161/06 ,  H01L21/02 ,  H01L21/30 ,  H01L21/301 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683 ,  H01L21/78

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/28

摘要： A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80° C. by using an oven. The thickness of the adhesive layer is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer. Next, a supporting plate is attached to the semiconductor wafer on which the adhesive layer of a desired thickness has been formed.

摘要翻译： 一种用于安装诸如半导体晶片的衬底的方法，其中当衬底变薄时可以防止裂纹或碎裂，包括将粘合剂液体施加到半导体晶片的电路（元件）形成表面上。 粘合剂液体进行预干燥，其流动性降低，并且可以保持其作为粘合剂层的形状。 对于预干燥，通过使用烘箱在80℃的温度下加热5分钟。 基于在半导体晶片的表面上形成的电路的凹凸来确定粘合剂层的厚度。 接下来，将支撑板安装到其上形成有所需厚度的粘合剂层的半导体晶片上。

公开(公告)号：US20090137760A1

公开(公告)日：2009-05-28

申请号：US12090343

申请日：2006-10-23

申请人： Koichi Misumi ,  Ken Miyagi ,  Atsushi Miyanari ,  Yoshihiro Inao

发明人： Koichi Misumi ,  Ken Miyagi ,  Atsushi Miyanari ,  Yoshihiro Inao

IPC分类号： C08F118/02

CPC分类号： C09J133/06 ,  B24B37/30 ,  B24B37/34 ,  C09J7/385 ,  C09J133/08 ,  C09J133/10 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/2861 ,  Y10T428/2891 ,  Y10T428/31935

摘要： An adhesive composition which is reduced in gas generation upon heating (has low hygroscopicity), has high alkali resistance, has heat resistance of 200° C. or higher, and can be easily removed with a stripping liquid; and an adhesive film made with the adhesive composition. The adhesive composition is prepared using, at least as a major ingredient, an acrylic polymer produced from (a) styrene, (b) a (meth)acrylic ester monomer containing a cyclic skeleton, and (c) an alkyl (meth)acrylate monomer. The adhesive film has an adhesive composition layer formed from this adhesive composition.

摘要翻译： 在加热时气体产生减少（吸湿性低）的粘合剂组合物具有高耐碱性，耐热性为200℃以上，并且可以容易地用剥离液除去; 和由粘合剂组合物制成的粘合膜。 粘合剂组合物使用（a）苯乙烯，（b）含有环状骨架的（甲基）丙烯酸酯单体，（c）（甲基）丙烯酸烷基酯单体 。 粘合剂膜具有由该粘合剂组合物形成的粘合剂组合物层。

公开(公告)号：US07268061B2

公开(公告)日：2007-09-11

申请号：US11001575

申请日：2004-12-01

申请人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

发明人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

IPC分类号： H01L21/20

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/28

摘要： A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80° C. by using an oven. The thickness of the adhesive layer is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer. Next, a supporting plate is attached to the semiconductor wafer on which the adhesive layer of a desired thickness has been formed.

摘要翻译： 一种用于安装诸如半导体晶片的衬底的方法，其中当衬底变薄时可以防止裂纹或碎裂，包括将粘合剂液体施加到半导体晶片的电路（元件）形成表面上。 粘合剂液体进行预干燥，其流动性降低，并且可以保持其作为粘合剂层的形状。 对于预干燥，通过使用烘箱在80℃的温度下加热5分钟。 基于在半导体晶片的表面上形成的电路的凹凸来确定粘合剂层的厚度。 接下来，将支撑板安装到其上形成有所需厚度的粘合剂层的半导体晶片上。