摘要:
A substrate inspection apparatus includes: an electron beam irradiation device which emits an electron beam and causes the electron beam to irradiate a substrate to be inspected as a primary beam; an electron beam detector which detects at least one of a secondary electron, a reflected electron and a backscattered electron that are generated from the substrate that has been irradiated by the electron beam, and which outputs a signal that forms a one-dimensional or two-dimensional image of a surface of the substrate; a mapping projection optical system which causes imaging of at least one of the secondary electron, the reflected electron and the backscattered electron on the electron beam detector as a secondary beam; and an electromagnetic wave irradiation device which generates an electromagnetic wave and causes the electromagnetic wave to irradiate a location on the surface of the substrate at which the secondary beam is generated.
摘要:
A magnetic immersion field emission electron gun has a vacuum vessel having a central axis in a predetermined direction, a cathode arranged along the central axis of the vacuum vessel for generating an electron beam, an anode for forming an electron beam path by accelerating a generated electron beam in the central axis direction, an electrostatic lens arranged between the cathode and anode for generating an electric field which focuses an accelerated electron beam toward the central axis, a magnetic field generating element arranged around the electron beam path for generating a magnetic field for focusing the electron beam in order to preventing a diameter of the electron beam from expansion by an aberration of the electrostatic lens, and a moving mechanism for moving the magnetic field generating element at a position where a peak point of a strength of the magnetic field generated by the magnetic field generating element coincides with a portion where the aberration of the electrostatic lens becomes most conspicuous. The electron gun having such a configuration can provide an effect of reducing a spherical and chromatic aberration by efficiently providing a lens characteristic to the electrostatic lens even though the entire length of electrostatic lens is long.
摘要:
A substrate inspection apparatus includes: an electron beam irradiation device which emits an electron beam and causes the electron beam to irradiate a substrate to be inspected as a primary beam; an electron beam detector which detects at least one of a secondary electron, a reflected electron and a backscattered electron that are generated from the substrate that has been irradiated by the electron beam, and which outputs a signal that forms a one-dimensional or two-dimensional image of a surface of the substrate; a mapping projection optical system which causes imaging of at least one of the secondary electron, the reflected electron and the backscattered electron on the electron beam detector as a secondary beam; and an electromagnetic wave irradiation device which generates an electromagnetic wave and causes the electromagnetic wave to irradiate a location on the surface of the substrate at which the secondary beam is generated.
摘要:
An electrostatic lens produces a smooth potential distribution along the center axis and is reduced in lens size and in total shape.A metal layer 13 is deposited at a certain position on an inner surface of insulating cylinder 11, and a high-resistance layer 12 is deposited on a portion except for the metal layer 13 on the inner surface of cylinder 11. A negative potential is applied from an external power source 19 to the metal layer 13, and the high-resistance layer 12 is earthed.
摘要:
An electrostatic lens produces a smooth potential distribution along the center axis and is reduced in lens size and in total shape. A metal layer 13 is deposited at a certain position on an inner surface of insulating cylinder 11, and a high-resistance layer 12 is deposited on a portion except for the metal layer 13 on the inner surface of cylinder 11. A negative potential is applied from an external power source 19 to the metal layer 13, and the high-resistance layer 12 is earthed.
摘要:
A substrate inspection apparatus includes: an electron beam irradiation device which emits an electron beam and causes the electron beam to irradiate a substrate to be inspected as a primary beam; an electron beam detector which detects at least one of a secondary electron, a reflected electron and a backscattered electron that are generated from the substrate that has been irradiated by the electron beam, and which outputs a signal that forms a one-dimensional or two-dimensional image of a surface of the substrate; a mapping projection optical system which causes imaging of at least one of the secondary electron, the reflected electron and the backscattered electron on the electron beam detector as a secondary beam; and an electromagnetic wave irradiation device which generates an electromagnetic wave and causes the electromagnetic wave to irradiate a location on the surface of the substrate at which the secondary beam is generated.
摘要:
An apparatus having an electron beam irradiation unit (11) for emitting an electron beam having a rectangular cross section from a linear cathode (12), and irradiating the inspection region (1a) of a sample (16) with the electron beam, a secondary optical system projection optical unit (17) for forming an image (defined by secondary and reflected electrons produced from the inspection region (1a) irradiated with the electron beam) onto an electron beam detection unit in a predetermined scale of enlargement, and an electron beam detection unit (22) for generating and outputting a detection signal in accordance with the formed image. The electron beam irradiation unit (11) forms the electron beam to have substantially the same area as the inspection region (1a) of the sample surface (16), and irradiates the inspection region (1a) with a single irradiation of the formed electron beam. In this way, the problems of conventional scanning electron microscopes, (i.e., low scanning velocity and image display speed, and the problems of direct mapping electron microscopes, i.e., difficulty in changing the beam shape in accordance with the inspection region while maintaining the current density), can be solved.
摘要:
A substrate inspection apparatus includes: an electron beam irradiation device which emits an electron beam and causes the electron beam to irradiate a substrate to be inspected as a primary beam; an electron beam detector which detects at least one of a secondary electron, a reflected electron and a backscattered electron that are generated from the substrate that has been irradiated by the electron beam, and which outputs a signal that forms a one-dimensional or two-dimensional image of a surface of the substrate; a mapping projection optical system which causes imaging of at least one of the secondary electron, the reflected electron and the backscattered electron on the electron beam detector as a secondary beam; and an electromagnetic wave irradiation device which generates an electromagnetic wave and causes the electromagnetic wave to irradiate a location on the surface of the substrate at which the secondary beam is generated.
摘要:
A substrate inspection apparatus includes: an electron beam irradiation device which emits an electron beam and causes the electron beam to irradiate a substrate to be inspected as a primary beam; an electron beam detector which detects at least one of a secondary electron, a reflected electron and a backscattered electron that are generated from the substrate that has been irradiated by the electron beam, and which outputs a signal that forms a one-dimensional or two-dimensional image of a surface of the substrate; a mapping projection optical system which causes imaging of at least one of the secondary electron, the reflected electron and the backscattered electron on the electron beam detector as a secondary beam; and an electromagnetic wave irradiation device which generates an electromagnetic wave and causes the electromagnetic wave to irradiate a location on the surface of the substrate at which the secondary beam is generated.
摘要:
A substrate inspection apparatus includes: an electron beam irradiation device which emits an electron beam and causes the electron beam to irradiate a substrate to be inspected as a primary beam; an electron beam detector which detects at least one of a secondary electron, a reflected electron and a backscattered electron that are generated from the substrate that has been irradiated by the electron beam, and which outputs a signal that forms a one-dimensional or two-dimensional image of a surface of the substrate; a mapping projection optical system which causes imaging of at least one of the secondary electron, the reflected electron and the backscattered electron on the electron beam detector as a secondary beam; and an electromagnetic wave irradiation device which generates an electromagnetic wave and causes the electromagnetic wave to irradiate a location on the surface of the substrate at which the secondary beam is generated.