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    COPPER PARTICLES, COPPER PASTE, PROCESS FOR PRODUCING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM
    3.
    发明申请
    COPPER PARTICLES, COPPER PASTE, PROCESS FOR PRODUCING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM 有权
    铜颗粒，铜浆，生产导电涂膜的方法和导电涂膜

    公开(公告)号：US20140203222A1

    公开(公告)日：2014-07-24

    申请号：US14117970

    申请日：2012-05-17

    申请人： Chiho Ito ,  Takeshi Yatsuka ,  Yasuo Kakihara

    发明人： Chiho Ito ,  Takeshi Yatsuka ,  Yasuo Kakihara

    IPC分类号： C09D5/24 ,  H01B1/02

    CPC分类号： C09D5/24 ,  B22F1/0011 ,  B22F1/0074 ,  B22F7/04 ,  B22F9/24 ,  B22F2998/10 ,  C22C1/0425 ,  H01B1/026 ,  H01B1/22 ,  H05K1/095 ,  H05K2201/0272 ,  H05K2201/0323 ,  B22F3/22 ,  B22F2003/248 ,  C23C18/00

    摘要： There are provided copper particles and a copper paste for a copper powder-containing coating film which can be subjected to electroless metal plating without using an expensive catalyst such as palladium, and a process for producing a conductive coating film by subjecting a copper powder-containing coating film formed by using the copper paste to electroless metal plating or heat treatment with superheated steam. The present invention relates to a process for producing a conductive coating film comprising the step of forming a coating film on an insulating substrate using copper particles having an average particle diameter of 0.05 to 2 μm as measured by observation using SEM in which a BET specific surface area value (SSA) (m2/g) and a carbon content (C) (% by weight) of the copper particles satisfy a relationship represented the following formula [1]: C/SSA·7×10−2 [1], and a copper paste comprising the copper particles; drying the coating film to obtain a copper powder-containing coating film; and then subjecting the resulting coating film to electroless metal plating or heat treatment with superheated steam.

    摘要翻译： 提供了铜颗粒和用于含铜粉末涂膜的铜浆，其可以在不使用钯等昂贵催化剂的情况下进行无电镀金属镀覆，以及通过使含铜粉末的 通过使用铜浆形成的涂膜通过无电镀金属镀层或用过热蒸汽进行热处理。 导电性涂膜的制造方法技术领域本发明涉及导电性涂膜的制造方法，其特征在于，包括以下步骤：使用平均粒径为0.05〜2μm的铜粒子，在绝缘性基材上形成涂膜， 铜颗粒的面积值（SSA）（m2 / g）和碳含量（C）（重量％）满足下式[1]所示的关系：C / SSA·7×10-2 [1] 以及包含铜颗粒的铜浆料; 干燥涂膜得到含铜粉末的涂膜; 然后对所得到的涂膜进行化学镀金属或用过热蒸汽的热处理。

    Copper particles, copper paste, process for producing conductive coating film, and conductive coating film
    5.
    发明授权
    Copper particles, copper paste, process for producing conductive coating film, and conductive coating film 有权
    铜颗粒，铜浆，导电涂膜生产工艺及导电涂膜

    公开(公告)号：US09221979B2

    公开(公告)日：2015-12-29

    申请号：US14117970

    申请日：2012-05-17

    申请人： Chiho Ito ,  Takeshi Yatsuka ,  Yasuo Kakihara

    发明人： Chiho Ito ,  Takeshi Yatsuka ,  Yasuo Kakihara

    IPC分类号： B22F1/00 ,  C09D5/24 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  C22C1/04 ,  B22F7/04 ,  B22F9/24

    CPC分类号： C09D5/24 ,  B22F1/0011 ,  B22F1/0074 ,  B22F7/04 ,  B22F9/24 ,  B22F2998/10 ,  C22C1/0425 ,  H01B1/026 ,  H01B1/22 ,  H05K1/095 ,  H05K2201/0272 ,  H05K2201/0323 ,  B22F3/22 ,  B22F2003/248 ,  C23C18/00

    摘要： There are provided copper particles and a copper paste for a copper powder-containing coating film which can be subjected to electroless metal plating without using an expensive catalyst such as palladium, and a process for producing a conductive coating film by subjecting a copper powder-containing coating film formed by using the copper paste to electroless metal plating or heat treatment with superheated steam. The present invention relates to a process for producing a conductive coating film comprising the step of forming a coating film on an insulating substrate using copper particles having an average particle diameter of 0.05 to 2 μm as measured by observation using SEM in which a BET specific surface area value (SSA) (m2/g) and a carbon content (C) (% by weight) of the copper particles satisfy a relationship represented the following formula [1]: C/SSA·7×10−2 [1], and a copper paste comprising the copper particles; drying the coating film to obtain a copper powder-containing coating film; and then subjecting the resulting coating film to electroless metal plating or heat treatment with superheated steam.

    摘要翻译： 提供了铜颗粒和用于含铜粉末涂膜的铜浆，其可以在不使用钯等昂贵催化剂的情况下进行无电镀金属镀覆，以及通过使含铜粉末的 通过使用铜浆形成的涂膜通过无电镀金属镀层或用过热蒸汽进行热处理。 导电性涂膜的制造方法技术领域本发明涉及导电性涂膜的制造方法，其特征在于，包括以下步骤：使用平均粒径为0.05〜2μm的铜粒子，在绝缘性基材上形成涂膜， 铜颗粒的面积值（SSA）（m2 / g）和碳含量（C）（重量％）满足下式[1]所示的关系：C / SSA·7×10-2 [1] 以及包含铜颗粒的铜浆料; 干燥涂膜得到含铜粉末的涂膜; 然后对所得到的涂膜进行化学镀金属或用过热蒸汽的热处理。

    PROCESS FOR PRODUCING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM
    6.
    发明申请
    PROCESS FOR PRODUCING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM 审中-公开
    生产导电涂膜的方法和导电涂膜

    公开(公告)号：US20140141238A1

    公开(公告)日：2014-05-22

    申请号：US14117976

    申请日：2012-05-17

    申请人： Takeshi Yatsuka ,  Chiho Ito ,  Yasuo Kakihara ,  Hirotoshi Kizumoto ,  Koji Shoki

    发明人： Takeshi Yatsuka ,  Chiho Ito ,  Yasuo Kakihara ,  Hirotoshi Kizumoto ,  Koji Shoki

    IPC分类号： H05K1/09 ,  H05K3/22

    CPC分类号： H05K1/095 ,  C08J7/045 ,  C08J2379/08 ,  C08K3/08 ,  C09D5/24 ,  C09D7/61 ,  H05K3/227 ,  Y10T428/266

    摘要： An object of the present invention is to provide a conductive coating film formed on a polyimide-based insulating substrate by using a metal powder paste which can exhibit a good conductivity and good adhesion to the insulating substrate. By forming a resin cured layer having a solvent-soluble content of not more than 20% by weight and a thickness of not more than 5 μm on a polyimide-based insulating substrate; forming a metal powder-containing coating layer on the resin cured layer by using a metal powder paste; and then subjecting the resulting coating layer to heat treatment with superheated steam, it is possible to obtain a conductive coating film which can exhibit a good conductivity and good adhesion to the insulating substrate.

    摘要翻译： 本发明的目的是提供一种通过使用能够表现出良好的导电性和对绝缘基板具有良好粘合性的金属粉末膏，形成在聚酰亚胺系绝缘基板上的导电性涂膜。 通过在聚酰亚胺系绝缘基板上形成溶剂可溶物含量为20重量％以下且5μm以下的树脂固化层， 通过使用金属粉末膏在树脂固化层上形成含金属粉末的涂层; 然后对所得到的涂层进行过热蒸汽的热处理，可以获得能够表现出良好的导电性和对绝缘基板的良好粘接性的导电性涂膜。