公开(公告)号：US20120103667A1

公开(公告)日：2012-05-03

申请号：US13279501

申请日：2011-10-24

申请人： Takashi ITO ,  Tomoo YAMASAKI ,  Yuta SAKAGUCHI

发明人： Takashi ITO ,  Tomoo YAMASAKI ,  Yuta SAKAGUCHI

IPC分类号： H05K1/09 ,  H01K3/10

CPC分类号： H05K3/4652 ,  H01L21/4857 ,  H01L21/486 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K3/108 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacturing a wiring substrate, includes forming a laminated body in which a nickel copper alloy layer is formed via an insulating resin layer, on a first wiring layer, forming a via hole reaching the first wiring layer in the nickel copper alloy layer and the insulating resin layer, applying a desmear process to an inside of the via hole, forming a seed layer on the nickel copper alloy layer and an inner surface of the via hole, forming a plating resist in which an opening portion is provided on a part containing the via hole, forming a metal plating layer in the opening portion in the plating resist by an electroplating, removing the plating resist, and forming a second wiring layer by etching the seed layer and the nickel copper alloy layer while using the metal plating layer as a mask.

摘要翻译： 一种制造布线基板的方法包括：在第一布线层上形成经由绝缘树脂层形成有镍铜合金层的层叠体，形成到达铜铜合金层中的第一布线层的通孔，以及 所述绝缘树脂层对所述通孔的内部进行去污处理，在所述镍铜合金层和所述通孔的内表面上形成种子层，形成电镀抗蚀剂，在所述电镀抗蚀剂上形成开口部， 包含通孔，通过电镀在电镀抗蚀剂的开口部中形成金属镀层，除去电镀抗蚀剂，并且通过在使用金属镀层的同时蚀刻种子层和镍铜合金层来形成第二配线层 作为面具。

公开(公告)号：US20060197184A1

公开(公告)日：2006-09-07

申请号：US11164614

申请日：2005-11-30

申请人： Kiyoshi OI ,  Noriyoshi SHIMIZU ,  Tomoo YAMASAKI

发明人： Kiyoshi OI ,  Noriyoshi SHIMIZU ,  Tomoo YAMASAKI

IPC分类号： H01L29/00

CPC分类号： H05K1/0231 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01L23/49822 ,  H01L27/0805 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19106 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/162 ,  H05K1/185 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09518 ,  H01L2224/0401

摘要： A capacitor parts of the present invention, includes a substrate, a plurality of capacitor elements arranged on the substrate and composed of a lower electrode, a dielectric layer, and an upper electrode respectively, a lower electrode rewiring layer formed over the plurality of capacitor elements and connected electrically to lower electrodes of the plurality of capacitor elements respectively to act as a common electrode, and an upper electrode rewiring layer formed over the plurality of capacitor elements and connected electrically to upper electrodes of the plurality of capacitor elements respectively to act as another common electrode, wherein the plurality of capacitor elements are connected electrically in parallel in a state of the capacitor parts, thus, the impedance is reduced in a wide high-frequency band by changing impedances among the plurality of capacitor elements.

摘要翻译： 本发明的电容器部件包括基板，分别配置在基板上的多个电容器元件，分别由下电极，电介质层和上电极构成，下电极重布线层形成在多个电容元件上 并且分别与多个电容器元件的下电极电连接起来用作公共电极，以及形成在所述多个电容器元件上并且分别电连接到所述多个电容器元件的上电极的上电极重新布线层，以分别作为另一个 公共电极，其中多个电容器元件在电容器部分的状态下并联电连接，因此通过改变多个电容器元件之间的阻抗，在宽的高频带中阻抗减小。