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公开(公告)号：US06416384B1
公开(公告)日：2002-07-09
申请号：US09126088
申请日：1998-07-30
IPC分类号： B24B4900
CPC分类号： H01L21/02024 , B24B37/015
摘要： A polishing apparatus can improve the uniformity of thickness within a workpiece or reduce thickness variation between serially polished workpieces. The polishing apparatus comprises a polishing unit having a polishing tool for providing a polishing surface and a workpiece holding device for holding the workpiece. A polishing solution or liquid supplying device is provided for supplying a polishing solution or liquid into a polishing interface between the surface of the workpiece and the polishing surface. A temperature of the polishing interface is controlled according to at least an ambient temperature of a polishing space surrounding the polishing unit, as a variable parameter.
摘要翻译： 抛光装置可以改善工件内的厚度均匀性或减少连续抛光的工件之间的厚度变化。 抛光装置包括具有用于提供抛光表面的抛光工具和用于保持工件的工件保持装置的抛光单元。 提供抛光溶液或液体供应装置，用于将抛光溶液或液体供应到工件表面和抛光表面之间的抛光界面。 作为可变参数，抛光界面的温度根据抛光单元周围的抛光空间的至少环境温度进行控制。
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公开(公告)号：US5651724A
公开(公告)日：1997-07-29
申请号：US524824
申请日：1995-09-07
申请人： Norio Kimura , Takayoshi Kawamoto , You Ishii , Katsuyuki Aoki , Kunio Tateishi , Hozumi Yasuda , Keisuke Namiki
发明人： Norio Kimura , Takayoshi Kawamoto , You Ishii , Katsuyuki Aoki , Kunio Tateishi , Hozumi Yasuda , Keisuke Namiki
CPC分类号： B24B37/30
摘要： A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ring and is polished by an abrasive cloth on the turntable while the workpiece is being pressed against the turntable by the top ring. While polishing, the workpiece is deformed toward the concave workpiece holding surface of the top ring, and a curvature of the deformed workpiece is controlled by the amount of liquid between the workpiece holding surface and the backside surface of the workpiece.
摘要翻译： 将诸如水的预定量的液体供应到诸如半导体晶片的工件的背面。 这种液体是工件保持液体，并且附接到顶环的凹入的工件保持表面。 工件位于转盘和顶环之间，并通过研磨布在转台上抛光，同时工件被顶环压在转台上。 在抛光时，工件朝着顶环的凹入工件保持面变形，并且变形的工件的曲率由工件保持面与工件的背面之间的液体量控制。
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公开(公告)号：US5679063A
公开(公告)日：1997-10-21
申请号：US590477
申请日：1996-01-24
申请人： Norio Kimura , You Ishii , Hozumi Yasuda , Koji Saito , Masako Watase , Shiro Mishima
发明人： Norio Kimura , You Ishii , Hozumi Yasuda , Koji Saito , Masako Watase , Shiro Mishima
摘要： A polishing apparatus for polishing a surface of an object such as a semiconductor wafer includes a turntable having a polishing cloth mounted on an upper surface thereof, a top ring for holding and pressing the object against the polishing cloth, and a plurality of radially arranged nozzles for supplying a polishing solution, containing abrasive material, of different concentrations that differ along a radial direction of the polishing cloth.
摘要翻译： 用于研磨诸如半导体晶片的物体的表面的抛光装置包括具有安装在其上表面上的抛光布的转盘，用于将物体保持并按压在抛光布上的顶环，以及多个径向布置的喷嘴 用于供应不同浓度的研磨材料的抛光溶液，该研磨材料沿抛光布的径向方向不同。
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公开(公告)号：US06443821B1
公开(公告)日：2002-09-03
申请号：US09712155
申请日：2000-11-15
申请人： Norio Kimura , Hozumi Yasuda
发明人： Norio Kimura , Hozumi Yasuda
IPC分类号： B24B100
摘要： A workpiece carrier holds a workpiece such as a semiconductor wafer and presses the workpiece against a polishing surface on a polishing table. The workpiece carrier has a top ring body for holding the workpiece, and a retainer ring for holding an outer circumferential edge of the workpiece. A fluid chamber which is supplied with a pressurized fluid such as a compressed air is provided in the top ring body and covered by a resilient membrane. A plurality of pressing members are fixed to the resilient membrane for applying a pressing force through the resilient membrane to the workpiece under the pressure of the fluid in the fluid chamber.
摘要翻译： 工件载体保持诸如半导体晶片的工件，并将工件压靠在抛光台上的抛光表面上。 工件载体具有用于保持工件的顶环体和用于保持工件的外周边缘的保持环。 提供有加压流体例如压缩空气的流体室设置在顶环体中并被弹性膜覆盖。 多个按压构件被固定到弹性膜上，用于在流体室内的流体的压力下通过弹性膜将压力施加到工件。
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公开(公告)号：US6077385A
公开(公告)日：2000-06-20
申请号：US56617
申请日：1998-04-08
申请人： Norio Kimura , Hozumi Yasuda
发明人： Norio Kimura , Hozumi Yasuda
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , B24B53/007 , B24B53/017 , C23F1/02
CPC分类号： B24B37/32 , B24B37/30 , B24B49/16 , B24B53/017
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and is pressed against the polishing cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force. Relative rotation between the top ring and the presser ring is achieved during polishing.
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公开(公告)号：US06428403B1
公开(公告)日：2002-08-06
申请号：US09580832
申请日：2000-05-30
申请人： Norio Kimura , Hozumi Yasuda
发明人： Norio Kimura , Hozumi Yasuda
IPC分类号： B24B722
CPC分类号： B24B37/32 , B24B37/30 , B24B49/16 , B24B53/017
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and is pressed against the polishing cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force. Relative rotation between the top ring and the presser ring is achieved during polishing.
摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有安装在其上表面上的抛光布的转盘和用于保持工件的顶环，并且在第一按压力下将工件压靠在抛光布上以抛光 工件。 顶环具有限定在其中的凹部，用于在其中容纳工件。 压环围绕顶环上下移动地设置，并以可变的第二按压力压在抛光布上。 第一和第二按压力彼此独立地变化，并且基于第一按压力来确定第二按压力。 在抛光期间实现顶环和压环之间的相对旋转。
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公开(公告)号：US5876273A
公开(公告)日：1999-03-02
申请号：US625291
申请日：1996-04-01
申请人： Hiroyuki Yano , Katsuya Okumura , Norio Kimura , Tomoyuki Yahiro , Hozumi Yasuda
发明人： Hiroyuki Yano , Katsuya Okumura , Norio Kimura , Tomoyuki Yahiro , Hozumi Yasuda
CPC分类号： B24B37/30
摘要： A polishing apparatus is provided which improves uniformity across the surface of a polished wafer. The apparatus includes a wafer carrier, a guide ring coupled to a lower portion of the wafer carrier, a circular plate coupled to a first inner circumference portion of the guide ring distant from the wafer carrier, and a cavity, formed within an area bounded by the lower portion of the wafer carrier, an inner circumference of the circular plate, and a second inner circumference portion of the guide ring between the circular plate and the lower portion of the wafer carrier, the circular plate holding the wafer to be polished in the cavity.
摘要翻译： 提供了一种改善抛光晶片表面均匀性的抛光装置。 该装置包括晶片载体，联接到晶片载体的下部的引导环，耦合到远离晶片载体的引导环的第一内周部分的圆形板，以及形成在由 晶片载体的下部，圆形板的内圆周和导向环的第二内周部分在圆形板和晶片载体的下部之间，圆形板将待抛光的晶片保持在 腔。
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公开(公告)号：US06432258B1
公开(公告)日：2002-08-13
申请号：US09499472
申请日：2000-02-07
申请人： Norio Kimura , Hozumi Yasuda
发明人： Norio Kimura , Hozumi Yasuda
IPC分类号： C23F102
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. A guide ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.
摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有安装在其上表面上的研磨布的转台和用于保持工件的顶环，并且在第一按压力下将工件压靠在研磨布上以抛光 工件。 引导环可垂直移动地设置在顶环周围，并以可变的第二按压力压靠研磨布。 第一和第二按压力彼此独立地变化，并且基于第一按压力来确定第二按压力。
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公开(公告)号：US6033520A
公开(公告)日：2000-03-07
申请号：US728070
申请日：1996-10-09
申请人： Norio Kimura , Hozumi Yasuda
发明人： Norio Kimura , Hozumi Yasuda
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , C23F1/02
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. A guide ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.
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公开(公告)号：US6019868A
公开(公告)日：2000-02-01
申请号：US28661
申请日：1998-02-24
申请人： Norio Kimura , Hozumi Yasuda
发明人： Norio Kimura , Hozumi Yasuda
CPC分类号： B24B37/32
摘要： A polishing apparatus for polishing a workpiece to a flat mirror finish includes a turntable with a polishing cloth attached to an upper surface thereof, and a top ring for holding a workpiece thereon and pressing the workpiece against the polishing cloth to polish the workpiece. A retainer ring or a presser ring is disposed around the top ring. The retainer ring or the presser ring is vertically movable independently of the top ring, and pressed against the polishing cloth by a pressing mechanism. A stabilizing mechanism is disposed between an inner circumferential surface of the retainer ring or the presser ring, and an outer circumferential surface of the top ring, for holding the top ring substantially stabilized within the retainer ring or the presser ring.
摘要翻译： 用于将工件抛光到平面镜面的抛光装置包括具有安装在其上表面上的抛光布的转盘和用于在其上保持工件的顶环，并将工件压靠在抛光布上以抛光工件。 保持环或压环设置在顶环周围。 保持环或压环可以独立于顶环垂直移动，并通过按压机构压靠在抛光布上。 稳定机构设置在保持环的内周表面或压环之间，以及顶环的外圆周表面之间，用于将顶环保持基本稳定在保持环或压环内。
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