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    Phenylnaphthylimidazole compound and usage of the same
    1.
    发明授权
    Phenylnaphthylimidazole compound and usage of the same 有权
    苯基萘基咪唑化合物及其用途

    公开(公告)号：US08378116B2

    公开(公告)日：2013-02-19

    申请号：US13449006

    申请日：2012-04-17

    申请人： Hirohiko Hirao ,  Yoshimasa Kikukawa ,  Takayuki Murai

    发明人： Hirohiko Hirao ,  Yoshimasa Kikukawa ,  Takayuki Murai

    IPC分类号： C07D233/56 ,  C23C22/05

    CPC分类号： C07D233/64 ,  B23K35/007 ,  C23C22/52 ,  H05K3/282 ,  H05K2203/124

    摘要： A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.

    摘要翻译： 含有下式所示的新型苯基萘基咪唑化合物的表面处理剂与铜或铜合金的表面接触。 在该式中，当A 1为苯基时，A 2表示1-萘基或2-萘基，A 1为1-萘基或2-萘基时，A 2表示苯基。 R表示氢原子或甲基。

    Phenylnaphthylimidazole compound and usage of the same
    2.
    发明授权
    Phenylnaphthylimidazole compound and usage of the same 有权
    苯基萘基咪唑化合物及其用途

    公开(公告)号：US08183386B2

    公开(公告)日：2012-05-22

    申请号：US11629179

    申请日：2005-06-08

    申请人： Hirohiko Hirao ,  Yoshimasa Kikukawa ,  Takayuki Murai

    发明人： Hirohiko Hirao ,  Yoshimasa Kikukawa ,  Takayuki Murai

    IPC分类号： C07D233/56 ,  C23C22/05

    CPC分类号： C07D233/64 ,  B23K35/007 ,  C23C22/52 ,  H05K3/282 ,  H05K2203/124

    摘要： A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.

    摘要翻译： 含有下式所示的新型苯基萘基咪唑化合物的表面处理剂与铜或铜合金的表面接触。 在该式中，当A 1为苯基时，A 2表示1-萘基或2-萘基，A 1为1-萘基或2-萘基时，A 2表示苯基。 R表示氢原子或甲基。

    Water-Soluble Preflux and Usage of the Same
    9.
    发明申请
    Water-Soluble Preflux and Usage of the Same 有权
    水溶性预流量及其用途

    公开(公告)号：US20080318070A1

    公开(公告)日：2008-12-25

    申请号：US11914138

    申请日：2006-05-23

    申请人： Hirohiko Hirao ,  Yoshimasa Kikukawa ,  Takayuki Murai

    发明人： Hirohiko Hirao ,  Yoshimasa Kikukawa ,  Takayuki Murai

    IPC分类号： B32B15/04 ,  B23K35/22 ,  B23K1/20

    CPC分类号： B23K35/362 ,  B23K35/3613 ,  C23F11/149 ,  H05K3/282 ,  H05K2203/0786 ,  Y10T428/31678

    摘要： It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux.Another object is to provide a printed wiring board wherein the surface of a metal conductive part has been brought into contact with the above water-soluble preflux and a soldering method which comprises bringing the surface of a metal conductive part into contact with the above water-soluble preflux and subsequently soldering the surface.A water-soluble preflux comprising an imidazole compound and a carboxylic acid compound having 4 to 16 carbon atoms represented by the following general formula 1: wherein R1 represents a linear or branched alkyl group having 1 to 4 carbon atoms, R2 represents a hydrogen atom or a methyl group, m represents an integer of 0 to 3, and n represents 1 or 2.

    摘要翻译： 本发明的目的是提供一种水溶性前驱物，其含有将咪唑化合物溶解在水中的性能优异的低挥发性增溶剂，能够提供咪唑化合物的优异的成膜性，还提供了一种处理方法 用于金属导电部件的表面，其包括使表面与上述水溶性前流体接触。 另一个目的是提供一种印刷电路板，其中金属导电部件的表面已经与上述水溶性前流体接触，并且包括使金属导电部件的表面与上述水溶性前流体接触的焊接方法， 可溶性前流体并随后焊接表面。 一种包含咪唑化合物和由以下通式1表示的具有4至16个碳原子的羧酸化合物的水溶性前通路：其中R 1表示具有1至4个碳原子的直链或支链烷基，R 2表示氢原子或 甲基，m表示0〜3的整数，n表示1或2。

    Agent for treating surfaces of copper and copper alloys
    10.
    发明授权
    Agent for treating surfaces of copper and copper alloys 失效
    铜和铜合金表面处理剂

    公开(公告)号：US5498301A

    公开(公告)日：1996-03-12

    申请号：US239557

    申请日：1994-05-09

    申请人： Hirohiko Hirao ,  Yoshimasa Kikukawa ,  Toshihiro Okamoto ,  Takayuki Murai ,  Seiji Sogabe ,  Miya Tanioka ,  Rie Nakayama ,  Takashi Yoshioka

    发明人： Hirohiko Hirao ,  Yoshimasa Kikukawa ,  Toshihiro Okamoto ,  Takayuki Murai ,  Seiji Sogabe ,  Miya Tanioka ,  Rie Nakayama ,  Takashi Yoshioka

    IPC分类号： C23F11/10 ,  C23F11/14 ,  H05K3/28 ,  C23C22/06

    CPC分类号： C23F11/149 ,  C23F11/10 ,  H05K3/282

    摘要： An water-based surface treatment agent used for the copper on a printed wiring board (PWB). Chemical layer formed on PWB shows excellent heat-resistance and moisture-resistance; therefore, the treated PWB preserves excellent soldability for a long time. The water-based surface treatment agent contains, as an active ingredient, a 2-arylimidazole compound represented by the following formula, ##STR1## wherein R is a hydrogen atom or a methyl group, R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, and R3 and R4 are hydrogen atoms, lower alkyl groups, halogen atoms, lower alkoxy groups, di-lower alkylamino groups, cyano groups or nitro groups, ##STR2## wherein R is a hydrogen atom or a methyl group, and R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, but excluding the case where R, R1 and R2 are all hydrogen atoms.

    摘要翻译： 用于印刷电路板（PWB）上的铜的水性表面处理剂。 在PWB上形成的化学层具有优异的耐热性和耐湿性; 因此，处理后的PWB长时间保持优异的可售性。 水性表面处理剂含有作为活性成分的下式表示的2-芳基咪唑化合物，其中R是氢原子或甲基，R 1和R 2是氢原子，低级烷基或 卤素原子，R3和R4是氢原子，低级烷基，卤原子，低级烷氧基，二低级烷基氨基，氰基或硝基，其中R是氢原子或甲基，R1 并且R 2是氢原子，低级烷基或卤素原子，但不包括R 1，R 2和R 2都是氢原子的情况。