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公开(公告)号：US20100291402A1
公开(公告)日：2010-11-18
申请号：US12846865
申请日：2010-07-30
申请人： Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo , Katsumi Nomura
发明人： Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo , Katsumi Nomura
IPC分类号： B32B15/20
CPC分类号： H05K1/09 , C22C9/02 , C22F1/08 , H05K1/0393 , H05K2201/0355 , H05K2203/0143 , H05K2203/1105 , Y10T428/12431
摘要： A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by β-scanning at α=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.
摘要翻译： 在最终冷轧步骤之后进行再结晶退火并且具有满足[a] / [b]≥3的比例的晶粒取向的轧制铜箔，其中[a]和[b]是{ 111}在X射线衍射极数测量中，通过在最终冷中控制总的工作比来制造在α= 35°和74°的铜晶体的Cu平面衍射 再结晶退火前的轧制步骤为94％以上; 并且在最终冷轧步骤中将每一道次的加工率控制为15〜50％。
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公开(公告)号：US07789977B2
公开(公告)日：2010-09-07
申请号：US11682943
申请日：2007-03-07
申请人： Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo , Katsumi Nomura
发明人： Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo , Katsumi Nomura
CPC分类号： H05K1/09 , C22C9/02 , C22F1/08 , H05K1/0393 , H05K2201/0355 , H05K2203/0143 , H05K2203/1105 , Y10T428/12431
摘要： A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by β-scanning at α=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.
摘要翻译： 在最终冷轧步骤之后进行再结晶退火并且具有满足[a] / [b]≥3的比例的晶粒取向的轧制铜箔，其中[a]和[b]是{ 111}在X射线衍射极数测量中，通过在最终冷中控制总的工作比来制造在α= 35°和74°的铜晶体的Cu平面衍射 再结晶退火前的轧制步骤为94％以上; 并且在最终冷轧步骤中将每一道次的加工率控制为15〜50％。
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公开(公告)号：US08221897B2
公开(公告)日：2012-07-17
申请号：US12168937
申请日：2008-07-08
申请人： Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo
发明人： Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo
CPC分类号： H05K1/09 , B21B1/40 , B21B38/00 , B21B38/02 , B21B2003/005 , H05K1/0393 , H05K2201/0355 , Y10T428/12431
摘要： A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle α, the normalized intensity being obtained during a β scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle α in a range of 40° to 60° to a maximum value B of the normalized intensity with angle α in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle α in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.
摘要翻译： 根据本发明的轧制铜箔包括晶粒取向，其中：绘制通过相对于轧制表面的X射线衍射极数测量获得的结果中铜晶体的{200} Cu平面衍射的归一化强度被绘制 在角度α的不同值下，归一化强度在a＆bgr期间获得; 在极坐标测量中扫描，归一化强度的最大值A与40度至60度之间的角度α的比值与80度至90度范围内的角度α的归一化强度的最大值B的比率 °等于或大于4; 并且当归一化强度随着角度α在25°至45°的范围内增加时，基本上没有标准化强度逐步增加的区域。
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公开(公告)号：US20090017325A1
公开(公告)日：2009-01-15
申请号：US12168937
申请日：2008-07-08
申请人： Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo
发明人： Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo
IPC分类号： B32B15/20
CPC分类号： H05K1/09 , B21B1/40 , B21B38/00 , B21B38/02 , B21B2003/005 , H05K1/0393 , H05K2201/0355 , Y10T428/12431
摘要： A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle α, the normalized intensity being obtained during a β scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle α in a range of 40° to 60° to a maximum value B of the normalized intensity with angle α in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle α in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.
摘要翻译： 根据本发明的轧制铜箔包括晶粒取向，其中：绘制通过相对于轧制表面的X射线衍射极数测量获得的结果中铜晶体的{200} Cu平面衍射的归一化强度被绘制 在角度α的不同值下，在极坐标测量中的β扫描期间获得的归一化强度，归一化强度的最大值A与40度至60度范围内的角度α的比值与最大值 角度α在80°至90°的范围内的归一化强度的B等于或大于4; 并且当归一化强度随着角度α在25°至45°的范围内增加而增加时，基本上没有标准化强度逐步增加的区域。
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公开(公告)号：US20080099110A1
公开(公告)日：2008-05-01
申请号：US11682943
申请日：2007-03-07
申请人： Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo , Katsumi Nomura
发明人： Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo , Katsumi Nomura
CPC分类号： H05K1/09 , C22C9/02 , C22F1/08 , H05K1/0393 , H05K2201/0355 , H05K2203/0143 , H05K2203/1105 , Y10T428/12431
摘要： A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by β-scanning at α=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.
摘要翻译： 在最终冷轧步骤之后进行再结晶退火并且具有满足[a] / [b]> = 3的比例的晶粒取向的轧制铜箔，其中[a]和[b]是a的平均强度 通过在对于轧制表面的X射线衍射极数测量中分别在α= 35°和74°下的β扫描的铜晶体的{111} Cu / 再结晶退火前的最终冷轧工序中的总加工率为94％以上; 并且在最终冷轧步骤中将每一道次的加工率控制为15〜50％。
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公开(公告)号：US20090173414A1
公开(公告)日：2009-07-09
申请号：US12346962
申请日：2008-12-31
申请人： Takemi Muroga , Gen Sasaki , Yoshiki Yamamoto , Satoshi Seki
发明人： Takemi Muroga , Gen Sasaki , Yoshiki Yamamoto , Satoshi Seki
CPC分类号： H05K1/09 , C22C9/00 , H05K1/0393 , H05K2201/0355 , H05K2203/0143
摘要： A rolled copper foil, according to the present invention, obtained after a final cold rolling step but before recrystallization annealing includes a group of crystal grains which exhibits four-fold symmetry in results obtained by X-ray diffraction (XRD) pole figure measurement with respect to a rolled surface. In the XRD pole figure measurement, at least four peaks of a {220}Cu plane diffraction of a copper crystal due to the group of crystal grains exhibiting the four-fold symmetry, which is obtained during β axis scanning with an α angle set to 45°, appear at intervals of 90°±5° along the β angle.
摘要翻译： 根据本发明的轧制铜箔在最终冷轧步骤之后但在再结晶退火之前获得包括一组晶粒，其在通过X射线衍射（XRD）极数测量获得的结果中显示出四重对称性 到轧制表面。 在XRD极图测量中，由于具有四重对称性的晶粒组，铜晶体的{220} Cu平面衍射的至少四个峰，其在α轴设置为β轴扫描期间获得 45°，沿β角度以90°±5°的间隔出现。
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公开(公告)号：US08137489B2
公开(公告)日：2012-03-20
申请号：US12457727
申请日：2009-06-19
申请人： Takemi Muroga , Noboru Hagiwara , Yoshiki Yamamoto
发明人： Takemi Muroga , Noboru Hagiwara , Yoshiki Yamamoto
摘要： A copper alloy material has a rolled surface having a plurality of crystal faces parallel to the rolled surface. The crystal faces includes at least one crystal face selected from a group consisted of {011}, {1nn} (n is an integer, n≧1), {11m} (m is an integer, m≧1), {023}, {012}, and {135}. Diffraction intensities of the crystal faces in an inverse pole figure obtained by crystal diffraction measurement of the rolled surface as a reference satisfy the relationships of: {011}>{155}>{133}, {011}>{023}>{012}, and {011}>{135}>{112}.
摘要翻译： 铜合金材料具有平行于轧制表面的多个晶面的轧制表面。 晶面包括从{011}，{1nn}（n为整数，n≥1），{11m}（m为整数，m≥1），{023}的组合中选择的至少一个晶面， ，{012}和{135}。 通过以轧制面的晶体衍射测定得到的反极图中的晶面的衍射强度满足以下关系：{011}> {155}> {133}，{011}> {023}> {012 }和{011}> {135}> {112}。
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公开(公告)号：US20100224292A1
公开(公告)日：2010-09-09
申请号：US12457727
申请日：2009-06-19
申请人： Takemi Muroga , Noboru Hagiwara , Yoshiki Yamamoto
发明人： Takemi Muroga , Noboru Hagiwara , Yoshiki Yamamoto
摘要： A copper alloy material has a rolled surface having a plurality of crystal faces parallel to the rolled surface. The crystal faces includes at least one crystal face selected from a group consisted of {011}, {1nn} (n is an integer, n≧1), {11m} (m is an integer, m≧1), {023}, {012}, and {135}. Diffraction intensities of the crystal faces in an inverse pole figure obtained by crystal diffraction measurement of the rolled surface as a reference satisfy the relationships of: {011}>{155}>{133}, {011}>{023}>{012}, and {011}>{135}>{112}.
摘要翻译： 铜合金材料具有平行于轧制表面的多个晶面的轧制表面。 晶面包括从{011}，{1nn}（n为整数，n≥1），{11m}（m为整数，m≥1），{023} ，{012}和{135}。 通过以轧制面的晶体衍射测定得到的反极图中的晶面的衍射强度满足以下关系：{011}> {155}> {133}，{011}> {023}> {012 }和{011}> {135}> {112}。
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公开(公告)号：US20100323214A1
公开(公告)日：2010-12-23
申请号：US12588361
申请日：2009-10-13
申请人： Takemi Muroga , Satoshi Seki , Noboru Hagiwara
发明人： Takemi Muroga , Satoshi Seki , Noboru Hagiwara
CPC分类号： H05K1/09 , B32B15/01 , C22C9/00 , C22F1/08 , H05K1/0393 , H05K2201/0355 , Y10T428/12431
摘要： A rolled copper foil includes copper (Cu), an inevitable impurity, a first additive element that forms a solid solution in the copper, and a second additive element that is different from the first additive element, is contained in the copper, and forms a compound with the inevitable impurity.
摘要翻译： 轧制铜箔包含铜（Cu），不可避免的杂质，在铜中形成固溶体的第一添加元素和与第一添加元素不同的第二添加元素，形成铜 与不可避免的杂质混合。
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公开(公告)号：US07069065B2
公开(公告)日：2006-06-27
申请号：US10819258
申请日：2004-04-07
CPC分类号： H01L39/2425
摘要： There is provided is a method of manufacturing a superconductor layer, including preparing a coating solution by dissolving trifluoroacetates of at least one metal selected from the group consisting of yttrium and lanthanoids, barium, and copper in a solvent, coating a main surface of a substrate with the coating solution to form a coating film, subjecting the coating film to a calcining process in an atmosphere containing oxygen, and subjecting the coating film after the calcining process to a firing process in an atmosphere containing water vapor at a temperature higher than that at the calcining process. The calcining process is carried out such that the coating film after the calcining process and before the firing process have an average CuO particle diameter equal to or less than 25 nm.
摘要翻译： 提供了一种制造超导体层的方法，包括通过将选自钇和镧系元素，钡和铜中的至少一种金属的三氟乙酸盐溶解在溶剂中，涂布基材的主表面来制备涂布溶液 用涂布液形成涂膜，在含氧气氛下对涂膜进行煅烧处理，并且在煅烧过程中的涂膜在含有水蒸汽的气氛中以比在 煅烧过程。 进行煅烧过程，使得煅烧过程之后和煅烧过程之前的涂膜具有等于或小于25nm的平均CuO粒径。
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