摘要:
A thermal printhead (A) includes an insulating substrate (1), a heating resistor (2) provided on the substrate (1) and a protective film (4) covering the heating resistor (2). The protective film (4) is made up of a first layer (41), a second layer (42) and a third layer (43). The first layer (41) is held in contact with the heating resistor (2). The second layer (42) covers the first layer (41). The second layer (42) is harder than the first layer (41) and has a higher thermal conductivity than that of the first layer (41). The third layer (43) is the outermost layer and covers the second layer (42). The third layer (43) is harder than the second layer (42) and thinner than the second layer (42).
摘要:
A thermal print head A includes a substrate 1, a heat generating resistor 3 supported by the substrate 1, and a protective layer 4 which covers the heat generating resistor 3. The protective layer 4 includes a first inner layer 41 which is in contact with the heat generating resistor 3, a second inner layer 42 formed on the first inner layer 41, and an outer layer 43. Part of the second inner layer 42 is formed as a rough surface 42a which has a surface roughness of Ra 0.1 through 0.3. The rough surface 42a is disposed at a position corresponding to the heat generating resistor 3. The outer layer 43 is made of a metal nitride or a chemical compound containing a metal nitride, and has a thickness of 0.1 through 0.5 μm.
摘要:
A thermal print head A includes a substrate 1, a heat generating resistor 3 supported by the substrate 1, and a protective layer 4 which covers the heat generating resistor 3. The protective layer 4 includes a first inner layer 41 which is in contact with the heat generating resistor 3, a second inner layer 42 formed on the first inner layer 41, and an outer layer 43. Part of the second inner layer 42 is formed as a rough surface 42a which has a surface roughness of Ra 0.1 through 0.3. The rough surface 42a is disposed at a position corresponding to the heat generating resistor 3. The outer layer 43 is made of a metal nitride or a chemical compound containing a metal nitride, and has a thickness of 0.1 through 0.5 μm.
摘要:
A thermal printhead (A) includes an insulating substrate (1), a heating resistor (2) provided on the substrate (1) and a protective film (4) covering the heating resistor (2). The protective film (4) is made up of a first layer (41), a second layer (42) and a third layer (43). The first layer (41) is held in contact with the heating resistor (2). The second layer (42) covers the first layer (41). The second layer (42) is harder than the first layer (41) and has a higher thermal conductivity than that of the first layer (41). The third layer (43) is the outermost layer and covers the second layer (42). The third layer (43) is harder than the second layer (42) and thinner than the second layer (42).
摘要:
A thick-film thermal printhead includes an insulating substrate, an electrode pattern formed on the substrate and a linear heating resistor electrically connected to electrode pattern. The electrode pattern includes a common electrode and a plurality of individual electrodes. The common electrode includes a plurality of comb-teeth and a main conductor connected to the comb-teeth. The distance between the main conductor and the heating resistor is 0.25-0.75 times the width of the heating resistor.
摘要:
A thermal printhead (A) includes an insulating substrate (10) having an upper surface (10a) and a side surface (10b), and a heat retaining glaze layer (11) formed on the substrate (10). A heating resistor (13) is formed on the glaze layer (11). The thermal printhead (A) further includes a common electrode (12) and a plurality of individual electrodes. The common electrode (12) has a plurality of teeth (12a) connected to the heating resistor (13), and a connecting portion (12b) which connects the teeth (12a) with each other. An electrode auxiliary layer (14) is formed on the connecting portion (12b). The heating resistor (13) and the electrode auxiliary layer (14) are covered with an overcoat layer (16) which is, in turn, covered with a protective layer (17). The connecting portion (12b) of the common electrode (12) directly contacts both the glaze layer (11) and the upper surface (10a) of the substrate.
摘要:
An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.
摘要:
A thermal printhead (A1) includes a substrate (1) and a heating resistor (3) supported by the substrate (1). An electrode pattern (2) is formed in contact with the heating resistor (3) for applying driving voltage. The heating resistor (3) is covered with a protective film (5). The protective film (5) includes a high thermal conductivity layer (51) and a low thermal conductivity layer (52) laminated on the high thermal conductivity layer. The low thermal conductivity layer (52) is positioned farther from the heating resistor (3) than the high thermal conductivity layer (51) is.
摘要:
A thermal printhead A includes a glaze layer 2 formed on an insulating substrate 1, a resistor layer 3 formed on the glaze layer, a conductor layer 4 formed so that part of the resistor layer is exposed to serve as a heating portion 3c and a protective film 5 formed to cover the conductor layer 4 and the heating portion 3c. The protective film 5 includes a lower first protective layer 5a, and an upper second protective layer 5b overlapping the first protective layer 5a and serving as the outermost layer. The first protective layer 5a has a hardness of 500 to 800 Hk and a thickness of 1 to 2 μm. The second protective layer 5b has a hardness of 1000 to 2000 Hk and a thickness of 5 to 8 μm.
摘要:
A thermal printhead (A) includes an insulating substrate (1), a glaze layer (2), a resistor layer (3), an electrode layer (4) and a protective layer (5). The electrode layer (4) has a two-layer structure made up of a lower first electrode layer (4a) and an upper second electrode layer (4b). The resistor layer (3) includes a heating portion (7). The heating portion (7) is exposed from both the first electrode layer (4a) and the second electrode layer (4b) and is positioned on a bulging portion (2c) of the glaze layer (2).