摘要:
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
摘要:
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
摘要:
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
摘要:
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
摘要:
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
摘要:
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
摘要:
The present invention has its object to provide a masterbatch for foam molding, which can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding, which shows a high expansion ratio, and which yields a foamed product with a good appearance. The present invention also has its object to provide a foamed product using the masterbatch for foam molding.A masterbatch for foam molding comprises a base resin and a thermally expandable microcapsule, the base resin being a thermoplastic resin having a melting point of 100° C. or higher, the masterbatch containing 10 to 230 parts by weight of the thermally expandable microcapsule to 100 parts by weight of the base resin, and the masterbatch having a true density of 0.80 g/cm3 or more, a bulk density of 0.35 g/cm3 or more, and a masterbatch size of 450 mg/30 pieces or more.
摘要翻译:本发明的目的是提供一种发泡成型用母料,其可以适用于显示高发泡倍率的涉及高剪切力的捏合成型,压延成型,挤出成型,注射成型等成型工艺,以及 其产生具有良好外观的发泡产品。 本发明的目的还在于提供使用发泡成型用母料的发泡体。 用于发泡成型的母料包括基础树脂和热膨胀性微胶囊,所述基础树脂是熔点为100℃以上的热塑性树脂,所述母料含有10〜230重量份的所述热膨胀性微囊至100 基础树脂重量份,真空密度为0.80g / cm 3以上,母体密度为0.35g / cm 3以上,母料粒径为450mg / 30个以上的母料。
摘要:
A valve rod is accommodated in a valve chest which is in communication with a plurality of ports, the valve rod has a round poppet valve disposed between a supply valve seat and a discharge valve seat, an annular protruding wall is formed on a side surface of the poppet valve, the protruding wall has a circumference surface including a cylindrical surface extending in parallel with an axial line of the valve chest and an inclined surface which enables the base end of the cylindrical surface to be smoothly continuous with the side surface of the poppet valve, and the cylindrical surface has a diameter smaller than that of the poppet valve and larger than that of a narrow portion of the valve rod.
摘要:
A method for forming an image of an object includes: illuminating sequentially a surface of the object arranged in the same shooting area using each of N (N is natural number equal to or more than two) polarized light beams, each of which has different property; scanning the surface using the each of N polarized light beams; and outputting the each of N polarized light beams reflected by the surface, the each of N polarized light beams passed-through the object or the each of N polarized light beams scattered by the surface, as an image signal.