公开(公告)号：US20060154496A1

公开(公告)日：2006-07-13

申请号：US10530518

申请日：2003-10-06

申请人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

发明人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

IPC分类号： H01R12/00

CPC分类号： H05K1/184 ,  H05K1/023 ,  H05K1/186 ,  H05K3/3442 ,  H05K3/4602 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/49798

摘要： To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

摘要翻译： 提供一种组件内置布线板及其制造方法，其能够进一步提高部件安装密度而不劣化可靠性。 所述部件内置布线板包括：导电层（34,35），其在所述板的厚度方向上延伸并埋设在所述板中而不暴露于所述板的上表面和下表面; 一个电子/电子部件（33），具有一个终端并埋设在该电路板中，该端子面向该掩埋的导电层; 设置在掩埋电气/电子部件的端子与导电层之间的间隙中的电连接/机械连接端子和导电层的连接件（36,37）; 以及两个覆盖所述埋入的电气/电子部件的外表面的绝缘层（11,15），除了连接到所述连接构件的部分之外，所述外部表面与所述电气/电子部件的板厚方向上的顶部和底部紧密接触 电气/电子部件。

公开(公告)号：US20080163486A1

公开(公告)日：2008-07-10

申请号：US12007924

申请日：2008-01-17

申请人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

发明人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

IPC分类号： H05K3/30 ,  H05K3/36

CPC分类号： H05K1/184 ,  H05K1/023 ,  H05K1/186 ,  H05K3/3442 ,  H05K3/4602 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/49798

摘要： To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

公开(公告)号：US07345888B2

公开(公告)日：2008-03-18

申请号：US11785607

申请日：2007-04-19

申请人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

发明人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

IPC分类号： H05K1/18

CPC分类号： H05K1/184 ,  H05K1/023 ,  H05K1/186 ,  H05K3/3442 ,  H05K3/4602 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/49798

摘要： To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

摘要翻译： 提供一种组件内置布线板及其制造方法，其能够进一步提高部件安装密度而不劣化可靠性。 所述部件内置布线板包括：导电层（34,35），其在所述板的厚度方向上延伸并埋设在所述板中而不暴露于所述板的上表面和下表面; 一个电子/电子部件（33），具有一个终端并埋设在该电路板中，该端子面向该掩埋的导电层; 设置在掩埋电气/电子部件的端子与导电层之间的间隙中的电连接/机械连接端子和导电层的连接件（36,37）; 以及两个覆盖所述埋入的电气/电子部件的外表面的绝缘层（11,15），除了连接到所述连接构件的部分之外，所述外部表面与所述电气/电子部件的板厚方向上的顶部和底部紧密接触 电气/电子部件。

公开(公告)号：US20070195511A1

公开(公告)日：2007-08-23

申请号：US11785607

申请日：2007-04-19

申请人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

发明人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

IPC分类号： H05K1/18

CPC分类号： H05K1/184 ,  H05K1/023 ,  H05K1/186 ,  H05K3/3442 ,  H05K3/4602 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/49798

摘要： To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

摘要翻译： 提供一种组件内置布线板及其制造方法，其能够进一步提高部件安装密度而不劣化可靠性。 所述部件内置布线板包括：导电层（34,35），其在所述板的厚度方向上延伸并埋设在所述板中而不暴露于所述板的上表面和下表面; 一个电子/电子部件（33），具有一个终端并埋设在该电路板中，该端子面向该掩埋的导电层; 设置在掩埋电气/电子部件的端子与导电层之间的间隙中的电连接/机械连接端子和导电层的连接件（36,37）; 以及两个覆盖所述埋入的电气/电子部件的外表面的绝缘层（11,15），除了连接到所述连接构件的部分之外，所述外部表面与所述电气/电子部件的板厚方向上的顶部和底部紧密接触 电气/电子部件。

公开(公告)号：US07242591B2

公开(公告)日：2007-07-10

申请号：US10530518

申请日：2003-10-06

申请人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

发明人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

IPC分类号： H05K1/18

CPC分类号： H05K1/184 ,  H05K1/023 ,  H05K1/186 ,  H05K3/3442 ,  H05K3/4602 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/49798

摘要： To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

摘要翻译： 提供一种组件内置布线板及其制造方法，其能够进一步提高部件安装密度而不劣化可靠性。 所述部件内置布线板包括：导电层（34,35），其在所述板的厚度方向上延伸并埋设在所述板中而不暴露于所述板的上表面和下表面; 一个电子/电子部件（33），具有一个终端并埋设在该电路板中，该端子面向该掩埋的导电层; 设置在掩埋电气/电子部件的端子与导电层之间的间隙中的电连接/机械连接端子和导电层的连接件（36,37）; 以及两个覆盖所述埋入的电气/电子部件的外表面的绝缘层（11,15），除了连接到所述连接构件的部分之外，所述外部表面与所述电气/电子部件的板厚方向上的顶部和底部紧密接触 电气/电子部件。

公开(公告)号：US07644497B2

公开(公告)日：2010-01-12

申请号：US12007924

申请日：2008-01-17

申请人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

发明人： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

IPC分类号： H05K3/30 ,  H05K3/36

CPC分类号： H05K1/184 ,  H05K1/023 ,  H05K1/186 ,  H05K3/3442 ,  H05K3/4602 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/49798

摘要： To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

摘要翻译： 提供一种组件内置布线板及其制造方法，其能够进一步提高部件安装密度而不劣化可靠性。 所述部件内置布线板包括：导电层（34,35），其在所述板的厚度方向上延伸并埋设在所述板中而不暴露于所述板的上表面和下表面; 一个电子/电子部件（33），具有一个终端并埋设在该电路板中，该端子面向该掩埋的导电层; 设置在掩埋电气/电子部件的端子与导电层之间的间隙中的电连接/机械连接端子和导电层的连接件（36,37）; 以及两个覆盖所述埋入的电气/电子部件的外表面的绝缘层（11,15），除了连接到所述连接构件的部分之外，所述外部表面与所述电气/电子部件的板厚方向上的顶部和底部紧密接触 电气/电子部件。

公开(公告)号：US06353189B1

公开(公告)日：2002-03-05

申请号：US09403223

申请日：1999-10-15

申请人： Osamu Shimada ,  Yoshitaka Fukuoka ,  Akihiko Takagi ,  Kenji Sasaoka

发明人： Osamu Shimada ,  Yoshitaka Fukuoka ,  Akihiko Takagi ,  Kenji Sasaoka

IPC分类号： H05K103

CPC分类号： H01P3/087 ,  H01L21/563 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/552 ,  H01L23/66 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/047 ,  H01P3/088 ,  H01P11/003 ,  H05K1/0206 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/09845 ,  H05K2201/09981 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A wiring board provided with a line 1, a shield pattern 2 formed in parallel with the line 1, a conductor layer 4 formed so as to face the line 1 and the shield pattern 2 through an insulating layer 3, a conductor layer 6 formed so as to face the line 1 and the shield pattern 2 through an insulating layer 5, and conductive pillars 7a, 7b for connecting the conductor layer 4 to the conductor layer 6. The conductive pillars 7a, 7b are connected to each other through the shield pattern 2. In the above structure, by supplying the ground potential to the shield pattern 2, conductor layers 4, 6, and conductive pillars 7a, 7b, an electromagnetic field is blocked in the direction where the line 1 extends over 360° about the line 1.

摘要翻译： 具有线1的线路板，与线1平行形成的屏蔽图案2，通过绝缘层3形成为与线1和屏蔽图案2相对形成的导体层4，导体层6形成为 通过绝缘层5面对线1和屏蔽图案2，以及用于将导体层4连接到导体层6的导电柱7a，7b。导电柱7a，7b通过屏蔽图案相互连接 在上述结构中，通过向屏蔽图案2，导体层4,6和导电柱7a，7b提供接地电位，电磁场在线1围绕线路360°延伸的方向上被阻挡 1。

公开(公告)号：US20100025082A1

公开(公告)日：2010-02-04

申请号：US12519745

申请日：2007-12-14

申请人： Kenji Sasaoka ,  Yoshitaka Fukuoka

发明人： Kenji Sasaoka ,  Yoshitaka Fukuoka

IPC分类号： H05K7/20 ,  H05K1/16 ,  H01S4/00

CPC分类号： H05K1/0206 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4647 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49002 ,  H01L2224/0401

摘要： An electronic component built-in wiring board includes: at least a pair of wiring patterns; an insulating layer disposed between the pair of wiring board; an electronic component embedded in the insulating layer; and a metallic body provided at least on or above a main surface of the electronic component in the insulating layer and thermally contacted with the electronic component.

摘要翻译： 电子部件内置布线板包括：至少一对布线图案; 绝缘层，设置在所述一对布线板之间; 嵌入绝缘层中的电子部件; 以及金属体，其设置在所述绝缘层中至少在所述电子部件的主表面上或上方，并与所述电子部件热接触。

公开(公告)号：US08198541B2

公开(公告)日：2012-06-12

申请号：US12519745

申请日：2007-12-14

申请人： Kenji Sasaoka ,  Yoshitaka Fukuoka

发明人： Kenji Sasaoka ,  Yoshitaka Fukuoka

IPC分类号： H05K7/20 ,  H01K1/00

CPC分类号： H05K1/0206 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4647 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49002 ,  H01L2224/0401

摘要： An electronic component built-in wiring board includes: at least a pair of wiring patterns; an insulating layer disposed between the pair of wiring board; an electronic component embedded in the insulating layer; and a metallic body provided at least on or above a main surface of the electronic component in the insulating layer and thermally contacted with the electronic component.

摘要翻译： 电子部件内置布线板包括：至少一对布线图案; 绝缘层，设置在所述一对布线板之间; 嵌入绝缘层中的电子部件; 以及金属体，其设置在所述绝缘层中至少在所述电子部件的主表面上或上方，并与所述电子部件热接触。

公开(公告)号：US07134193B2

公开(公告)日：2006-11-14

申请号：US11023478

申请日：2004-12-29

申请人： Kenji Sasaoka ,  Fumitoshi Ikegaya ,  Takahiro Mori ,  Tomohisa Motomura ,  Yoshizumi Sato ,  Koichiro Shibayama

发明人： Kenji Sasaoka ,  Fumitoshi Ikegaya ,  Takahiro Mori ,  Tomohisa Motomura ,  Yoshizumi Sato ,  Koichiro Shibayama

IPC分类号： H01R43/00

CPC分类号： B32B38/162 ,  B32B38/1858 ,  B32B2038/1891 ,  B32B2309/65 ,  B32B2457/08 ,  H05K3/1216 ,  H05K3/26 ,  H05K3/4069 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2203/066 ,  H05K2203/082 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/4922 ,  Y10T29/49991 ,  Y10T29/5136 ,  Y10T29/5137 ,  Y10T29/53061 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/532 ,  Y10T29/53243 ,  Y10T29/53261 ,  Y10T29/53539

摘要： The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.

摘要翻译： 用于制造布线替代品的装置包括具有片材循环的电路的运送器; 用于在片材上印刷导电膏的丝网印刷机; 用于计数在片材上印刷导电糊的次数的计数器; 以及当计数的数量达到预设数量时从电路中弹出纸张的分配器。 因此，可以以高生产率自动地在导电箔上形成具有均匀性质的导电柱。