公开(公告)号：US08864934B2

公开(公告)日：2014-10-21

申请号：US13434284

申请日：2012-03-29

申请人： Tatsuya Ogi ,  Wataru Ozawa ,  Kimihiro Fukasawa ,  Kazuhiro Kanaya

发明人： Tatsuya Ogi ,  Wataru Ozawa ,  Kimihiro Fukasawa ,  Kazuhiro Kanaya

IPC分类号： C23F1/00

CPC分类号： H01J37/32926 ,  H01J37/32532 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3299

摘要： Provided is a parallel flat-panel type plasma processing apparatus which includes a recipe storing unit storing a processing recipe for performing a plasma processing, a compensation setting unit setting an accumulation time of the plasma processing or the number of processed substrates after starting using a new second electrode and the compensation value of the set temperature of the second electrode in an input screen, and a storage unit storing the compensated set value. The plasma processing apparatus is further equipped with a program for controlling a temperature adjusting mechanism based on a set temperature after compensation by adding a set temperature of an upper electrode written in the processing recipe to the compensation value stored within the storage unit. As a result, the non-uniformity in the plasma processing between the substrates caused by the change of processing atmosphere is suppressed.

摘要翻译： 提供一种平行平板型等离子体处理装置，其包括存储用于执行等离子体处理的处理配方的配方存储单元，设置等离子体处理的累积时间的补偿设定单元或启动后的处理基板的数量，使用新的 第二电极和输入屏幕中第二电极的设定温度的补偿值，以及存储补偿的设定值的存储单元。 等离子体处理装置还配备有用于通过将在处理配方中写入的上部电极的设定温度与存储在存储单元中的补偿值相加而基于补偿后的设定温度来控制温度调节机构的程序。 结果，抑制了由处理气氛的变化引起的基板之间的等离子体处理的不均匀性。

公开(公告)号：US08663489B2

公开(公告)日：2014-03-04

申请号：US12732451

申请日：2010-03-26

申请人： Shigeru Ishizawa ,  Hiroshi Koizumi ,  Tatsuya Ogi

发明人： Shigeru Ishizawa ,  Hiroshi Koizumi ,  Tatsuya Ogi

IPC分类号： B44C1/22

CPC分类号： H01L21/67745 ,  H01L21/67748

摘要： A method for replacing plural substrates to be processed by a substrate processing apparatus which includes a substrate processing chamber, a load lock chamber, and a conveying apparatus including first and second conveying members for conveying the plural substrates into and out from the substrate processing chamber and the load lock chamber. The method includes the steps of a) conveying a first substrate out from the substrate processing chamber with the first conveying member, b) conveying a second substrate into the substrate processing chamber with the second conveying member, c) conveying the second substrate out from the load lock chamber with the second conveying member, and d) conveying the first substrate into the load lock chamber with the first conveying member. The steps c) and d) are performed between step a) and step b).

摘要翻译： 一种用于替换多个基板的方法，所述基板处理装置包括基板处理室，负载锁定室和输送装置，所述基板处理装置包括用于将多个基板输入和移出基板处理室的第一和第二输送部件， 负载锁定室。 该方法包括以下步骤：a）用第一输送部件从基板处理室输出第一基板，b）用第二输送部件将第二基板输送到基板处理室中，c）将第二基板从 负载锁定室与第二输送构件，以及d）用第一输送构件将第一基板输送到装载锁定室。 在步骤a）和步骤b）之间执行步骤c）和d）。

公开(公告)号：US08423176B2

公开(公告)日：2013-04-16

申请号：US13233728

申请日：2011-09-15

申请人： Tatsuya Ogi

发明人： Tatsuya Ogi

IPC分类号： G06F7/00

CPC分类号： H01L21/67253 ,  H01L21/67196 ,  Y10S414/135

摘要： In a substrate processing apparatus according to the present invention, wafer transfer timing with which wafers are to be transferred to individual processing chambers from a cassette container is determined in correspondence to each processing chamber, based upon the lengths of time required to process a single wafer in the processing chambers. Then, wafers are transferred from the cassette container in conformance to the transfer timing thus determined. By setting the wafer transfer timing with which wafers are transferred from the cassette container in coordination with the lengths of processing time at the individual processing chambers, the operation rates in the processing chambers are improved and ultimately, the throughput of the apparatus is improved.

摘要翻译： 在根据本发明的衬底处理装置中，基于处理单个晶片所需的时间长度，根据每个处理室确定晶片从盒式存储器转移到各个处理室的晶片传送定时 在处理室中。 然后，根据这样确定的传送时间，从盒式容器传送晶片。 通过与各个处理室的处理时间的长度一致地设置从盒式存储器传送晶片的晶片传送时间，处理室中的操作速度得到改善，并且最终提高了设备​​的吞吐量。

公开(公告)号：US08140181B2

公开(公告)日：2012-03-20

申请号：US12575930

申请日：2009-10-08

申请人： Tatsuya Ogi

发明人： Tatsuya Ogi

IPC分类号： G06F7/00

CPC分类号： H01L21/67265 ,  H01L21/67742 ,  H01L21/67748

摘要： A substrate transfer method for use in a substrate processing apparatus including a first processing unit that performs a first process on a substrate, a second processing unit performing a second process on the substrate, and a substrate transfer mechanism that transfers the substrate between the first and the second processing unit, includes: detecting misalignment of the substrate when the substrate is unloaded from the first processing unit; and correcting the misalignment of the substrate based on a detected result. Further, the substrate transfer method includes loading the misalignment-corrected substrate to a targeted position in the second processing unit.

摘要翻译： 一种用于基板处理装置的基板转印方法，所述基板处理装置包括：在基板上执行第一处理的第一处理单元，在所述基板上执行第二处理的第二处理单元;以及基板转印机构， 所述第二处理单元包括：当从所述第一处理单元卸载所述基板时，检测所述基板的未对准; 以及基于检测结果校正所述基板的未对准。 此外，基板转印方法包括将未对准校正的基板装载到第二处理单元中的目标位置。

公开(公告)号：US06711454B2

公开(公告)日：2004-03-23

申请号：US10364959

申请日：2003-02-11

申请人： Kentaro Joma ,  Tatsuya Ogi

发明人： Kentaro Joma ,  Tatsuya Ogi

IPC分类号： G06F1900

CPC分类号： G05B19/41865 ,  G05B2219/32265 ,  G05B2219/32277 ,  G05B2219/32304 ,  G05B2219/45031 ,  Y02P90/20 ,  Y02P90/285

摘要： In a system and method for scheduling the movement of wafers in a wafer-processing tool, the wafer-processing tool can include a load module, a wafer-transfer unit, a process module, and a scheduler. The scheduler can be configured to generate a schedule for the movement of wafers in the wafer-processing tool based on the duration of the operations to be performed by the wafer-transfer unit and the process module in processing the wafers.

摘要翻译： 在用于调度晶片处理工具中的晶片移动的系统和方法中，晶片处理工具可以包括负载模块，晶片传送单元，处理模块和调度器。 调度器可以被配置为基于晶片转移单元和处理模块在处理晶片时执行的操作的持续时间来生成用于在晶片处理工具中移动晶片的调度。

公开(公告)号：US06535784B2

公开(公告)日：2003-03-18

申请号：US09844582

申请日：2001-04-26

申请人： Kentaro Joma ,  Tatsuya Ogi

发明人： Kentaro Joma ,  Tatsuya Ogi

IPC分类号： G06F1900

CPC分类号： G05B19/41865 ,  G05B2219/32265 ,  G05B2219/32277 ,  G05B2219/32304 ,  G05B2219/45031 ,  Y02P90/20 ,  Y02P90/285

摘要： In a system and method for scheduling the movement of wafers in a wafer-processing tool, the wafer-processing tool can include a load module, a wafer-transfer unit, a process module, and a scheduler. The scheduler can be configured to generate a schedule for the movement of wafers in the wafer-processing tool based on the duration of the operations to be performed by the wafer-transfer unit and the process module in processing the wafers.

公开(公告)号：US20120248067A1

公开(公告)日：2012-10-04

申请号：US13434284

申请日：2012-03-29

申请人： Tatsuya Ogi ,  Wataru Ozawa ,  Kimihiro Fukasawa ,  Kazuhiro Kanaya

发明人： Tatsuya Ogi ,  Wataru Ozawa ,  Kimihiro Fukasawa ,  Kazuhiro Kanaya

IPC分类号： B44C1/22 ,  B05C11/00 ,  B05C9/00

CPC分类号： H01J37/32926 ,  H01J37/32532 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3299

摘要： Provided is a parallel flat-panel type plasma processing apparatus which includes a recipe storing unit storing a processing recipe for performing a plasma processing, a compensation setting unit setting an accumulation time of the plasma processing or the number of processed substrates after starting using a new second electrode and the compensation value of the set temperature of the second electrode in an input screen, and a storage unit storing the compensated set value. The plasma processing apparatus is further equipped with a program for controlling a temperature adjusting mechanism based on a set temperature after compensation by adding a set temperature of an upper electrode written in the processing recipe to the compensation value stored within the storage unit. As a result, the non-uniformity in the plasma processing between the substrates caused by the change of processing atmosphere is suppressed.

摘要翻译： 提供一种平行平板型等离子体处理装置，其包括存储用于执行等离子体处理的处理配方的配方存储单元，设置等离子体处理的累积时间的补偿设定单元或启动后的处理基板的数量，使用新的 第二电极和输入屏幕中第二电极的设定温度的补偿值，以及存储补偿的设定值的存储单元。 等离子体处理装置还配备有用于通过将在处理配方中写入的上部电极的设定温度与存储在存储单元中的补偿值相加而基于补偿后的设定温度来控制温度调节机构的程序。 结果，抑制了由处理气氛的变化引起的基板之间的等离子体处理的不均匀性。

公开(公告)号：US20120059502A1

公开(公告)日：2012-03-08

申请号：US13225672

申请日：2011-09-06

申请人： Eiki Endo ,  Tatsuya Ogi

发明人： Eiki Endo ,  Tatsuya Ogi

IPC分类号： H01L21/677 ,  G06F19/00

CPC分类号： H01L21/67748 ,  H01L21/67126 ,  H01L21/67742

摘要： There is provided a substrate transfer method capable of preventing fine particles from adhering to a wafer. A substrate processing system 10 includes process modules 12 to 17 each having therein an inner space S1; a transfer module 11, having an inner space S2, connected to the process modules 12 to 17; and opening/closing gate valves 30 each partitioning the inner space S1 and the inner space S2. The transfer module 11 includes in the inner space S2 a transfer arm device 21 for holding a wafer W and for loading/unloading the wafer W into/from the process modules 12 to 17. The transfer arm device 21 holds the wafer W at a retreated position deviated from a facing position facing the gate valve 30 during an opening motion of the gate valve 30.

摘要翻译： 提供了能够防止细颗粒附着在晶片上的基板转印方法。 基板处理系统10包括各自具有内部空间S1的处理模块12至17; 具有连接到处理模块12至17的内部空间S2的传送模块11; 以及分隔内部空间S1和内部空间S2的开闭闸门30。 传送模块11在内部空间S2中包括用于保持晶片W并用于将晶片W装载/从工艺模块12至17中卸载的传送臂装置21.传送臂装置21将晶片W保持在退避状态 位置在闸阀30的开启运动期间偏离面向闸阀30的面对位置。

公开(公告)号：US08078311B2

公开(公告)日：2011-12-13

申请号：US11289316

申请日：2005-11-30

申请人： Tatsuya Ogi

发明人： Tatsuya Ogi

IPC分类号： G06F7/00

CPC分类号： H01L21/67253 ,  H01L21/67196 ,  Y10S414/135

摘要： In a substrate processing apparatus according to the present invention, wafer transfer timing with which wafers are to be transferred to individual processing chambers from a cassette container is determined in correspondence to each processing chamber, based upon the lengths of time required to process a single wafer in the processing chambers. Then, wafers are transferred from the cassette container in conformance to the transfer timing thus determined. By setting the wafer transfer timing with which wafers are transferred from the cassette container in coordination with the lengths of processing time at the individual processing chambers, the operation rates in the processing chambers are improved and ultimately, the throughput of the apparatus is improved.

摘要翻译： 在根据本发明的衬底处理装置中，基于处理单个晶片所需的时间长度，根据每个处理室确定晶片从盒式存储器转移到各个处理室的晶片传送定时 在处理室中。 然后，根据这样确定的传送时间，从盒式容器传送晶片。 通过与各个处理室的处理时间的长度一致地设置从盒式存储器传送晶片的晶片传送时间，处理室中的操作速度得到改善，并且最终提高了设备​​的吞吐量。

公开(公告)号：US09002494B2

公开(公告)日：2015-04-07

申请号：US13225672

申请日：2011-09-06

申请人： Eiki Endo ,  Tatsuya Ogi

发明人： Eiki Endo ,  Tatsuya Ogi

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67748 ,  H01L21/67126 ,  H01L21/67742

摘要： There is provided a substrate transfer method capable of preventing fine particles from adhering to a wafer. A substrate processing system 10 includes process modules 12 to 17 each having therein an inner space S1; a transfer module 11, having an inner space S2, connected to the process modules 12 to 17; and opening/closing gate valves 30 each partitioning the inner space S1 and the inner space S2. The transfer module 11 includes in the inner space S2 a transfer arm device 21 for holding a wafer W and for loading/unloading the wafer W into/from the process modules 12 to 17. The transfer arm device 21 holds the wafer W at a retreated position deviated from a facing position facing the gate valve 30 during an opening motion of the gate valve 30.

摘要翻译： 提供了能够防止细颗粒附着在晶片上的基板转印方法。 基板处理系统10包括各自具有内部空间S1的处理模块12至17; 具有连接到处理模块12至17的内部空间S2的传送模块11; 以及分隔内部空间S1和内部空间S2的开闭闸门30。 传送模块11在内部空间S2中包括用于保持晶片W并用于将晶片W装载/从工艺模块12至17中卸载的传送臂装置21.传送臂装置21将晶片W保持在退避状态 位置在闸阀30的开启运动期间偏离面向闸阀30的面对位置。