Copolyimide with a combination of flexibilizing groups
    1.
    发明授权
    Copolyimide with a combination of flexibilizing groups 失效
    具有柔性基团组合的共聚酰亚胺

    公开(公告)号:US4837300A

    公开(公告)日:1989-06-06

    申请号:US71686

    申请日:1987-07-09

    IPC分类号: C08G73/10

    摘要: Novel copolyimides are prepared by reacting one or more aromatic dianhydrides with a meta-substituted phenylene diamine and an aromatic bridged diamine. The incorporation of meta-substituted phenylene diamine derived units and bridged aromatic diamine derived units into the linear aromatic polymer backbone results in a copolyimide of improved flexibility, processability, and melt-flow characteristics. The novel copolyimides are especially useful as thermoplastic hot-melt adhesives.

    摘要翻译: 通过使一种或多种芳族二酸酐与间位取代的苯二胺和芳族桥连二胺反应制备新型共聚酰亚胺。 将间位取代的苯二胺衍生的单元和桥连的芳族二胺衍生的单元并入线性芳族聚合物主链中导致具有改进的柔性,加工性和熔体流动特性的共聚酰亚胺。 新型共聚酰亚胺特别适用于热塑性热熔胶。

    Polyimide molding powder, coating, adhesive and matrix resin
    2.
    发明授权
    Polyimide molding powder, coating, adhesive and matrix resin 失效
    聚酰亚胺成型粉末,涂料,粘合剂和基体树脂

    公开(公告)号:US5147966A

    公开(公告)日:1992-09-15

    申请号:US560717

    申请日:1990-07-31

    IPC分类号: C08G73/10

    摘要: The invention is a novel polyimide prepared from 3,4'-oxydianiline (3,4'-ODA) and 4,4'-oxydiphthalic anhydride (ODPA), in 2-methoxyethyl ether (diglyme). The polymer has been prepared in ultra high molecular weight and in a controlled molecular weight form which has a 2.5 percent offset is stoichiometry (excess diamine) with a 5.0 percent level of phthalic anhydride as an endcap. This controlled molecular weight form allows for greatly improved processing of the polymer for moldings, adhesive bonding, and composite fabrication. The higher molecular weight version affords tougher films and coatings. The overall polymer structure groups in the dianhydride, the diamine, and a metal linkage in the diamine affords adequate flow properties for making this polymer useful as a molding powder, adhesive, and matrix resin.

    摘要翻译: 本发明是由3,4-氧代二苯胺(3,4'-ODA)和4,4'-氧联二邻苯二甲酸酐(ODPA)在2-甲氧基乙醚(二甘醇二甲醚)中制备的新型聚酰亚胺。 聚合物已经以超高分子量和受控的分子量形式制备,其具有2.5%的偏移量是化学计量(过量二胺),5.0%邻苯二甲酸酐作为端帽。 这种受控的分子量形式允许用于模制品,粘合剂粘合和复合材料制造的聚合物的大大改进的处理。 更高的分子量版本提供更坚韧的膜和涂层。 在二酐中的整体聚合物结构基团,二胺和二胺中的金属键提供了足够的流动性能,用于使该聚合物用作成型粉末,粘合剂和基质树脂。

    Polyimide adhesives
    5.
    发明授权
    Polyimide adhesives 失效
    聚酰亚胺粘合剂

    公开(公告)号:US4065345A

    公开(公告)日:1977-12-27

    申请号:US734901

    申请日:1976-10-22

    摘要: A process of preparing aromatic polyamide-acids for use as adhesives by reacting an aromatic dianhydride to an approximately equimolar amount of an aromatic diamine in a water or lower alkanol miscible ether solvent and wherein the polyamide-acids are converted to polyimides by heating to the temperature range of 200.degree. - 300.degree. C. and wherein the polyimides are thermally stable and insoluble in ethers and other organic solvents.

    摘要翻译: 通过使芳族二酐与水或低级链烷醇混溶性醚溶剂中的大约等摩尔量的芳族二胺反应制备用作粘合剂的芳族聚酰胺酸的方法,其中通过加热至温度将聚酰胺酸转化为聚酰亚胺 范围为200-300℃,其中聚酰亚胺是热稳定的,不溶于醚和其它有机溶剂。

    Polyimide processing additives
    6.
    发明授权
    Polyimide processing additives 失效
    聚酰亚胺加工助剂

    公开(公告)号:US5272248A

    公开(公告)日:1993-12-21

    申请号:US892058

    申请日:1992-05-22

    摘要: A process for preparing polyamides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15% by weight of additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.

    摘要翻译: 描述了一种制备具有增强的熔体流动性能的聚酰胺的方法。 该方法包括将高分子量聚(酰胺酸)或聚酰亚胺与低分子量酰胺酸添加剂的混合物加入0.05至15重量%的添加剂。 如此获得的聚酰亚胺粉末显示出改进的加工性能,如通过毛细管流变测定法的较低熔体粘度所证明的。 同样,由聚合物与添加剂的混合物制备的薄膜也显示改善的加工性能,并且通过TMA早期开始拉伸。

    Polyimide processing additives
    7.
    发明授权
    Polyimide processing additives 失效
    聚酰亚胺加工助剂

    公开(公告)号:US5116939A

    公开(公告)日:1992-05-26

    申请号:US84064

    申请日:1987-08-11

    IPC分类号: C08G73/10 C08K5/21 C08K5/3415

    摘要: A process for preparing polyimides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15% by weight of additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.

    摘要翻译: 描述了制备具有增强的熔体流动性能的聚酰亚胺的方法。 该方法包括将高分子量聚(酰胺酸)或聚酰亚胺与低分子量酰胺酸添加剂的混合物加入0.05至15重量%的添加剂。 如此获得的聚酰亚胺粉末显示出改进的加工性能,如通过毛细管流变测定法的较低熔体粘度所证明的。 同样,由聚合物与添加剂的混合物制备的薄膜也显示改善的加工性能,并且通过TMA早期开始拉伸。

    Process of end-capping a polyimide system
    8.
    发明授权
    Process of end-capping a polyimide system 失效
    封端聚酰亚胺系统的工艺

    公开(公告)号:US4552931A

    公开(公告)日:1985-11-12

    申请号:US649328

    申请日:1984-09-11

    IPC分类号: C08G73/10

    摘要: A process of endcapping a polyimide system with an endcapping agent in order to achieve a controlled decrease in molecular weight and melt viscosity along with predictable fracture resistance of the molded products is disclosed. The uncapped system is formed by combining an equimolar ratio of 4,4'-bis(3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA) and 1,3-bis(aminophenoxy)benzene (APB) dissolved in bis(2-methoxyethyl)ether. The endcapped system is formed by dissolving APB in bis-(2-methoxyethyl)ether, adding the endcapping agent, and then adding the BDSDA. By varying the amount of endcapping from 0 to 4%, molecular weight is decreased from 13,900 to 8660. At a processing temperature of 250.degree. C., there is a linear relationship between molecular weight and viscosity, with the viscosity decreasing by two orders of magnitude as the molecular weight decreased from 13,900 to 8660. A greater drop in viscosity is noted at higher temperatures. Apparent viscosity as a function of molecular weight at 250.degree. C. and at 280.degree. C. is depicted in FIG. 2. Reducing the molecular weight also results in a linear decrease in the fracture resistance from 4100 J/m.sup.2 to 296 J/m.sup.2, as shown in FIG. 1.

    摘要翻译: 公开了一种使用封端剂封端聚酰亚胺系统以便实现分子量和熔体粘度的受控降低以及模制产品的可预测的耐断裂性的方法。 未封端的体系是通过将等摩尔比的4,4'-双(3,4-二羧基苯氧基)二苯硫醚二酐(BDSDA)和1,3-双(氨基苯氧基)苯(APB))溶于双(2-甲氧基乙基) 醚。 通过将APB溶解在双(2-甲氧基乙基)醚中,加入封端剂,然后加入BDSDA形成封端体系。 通过将封端量从0降低到4%,分子量从13,900降低到8660.在250℃的加工温度下,分子量和粘度之间存在线性关系,粘度降低了两个数量级 随着分子量从13,900降低到8660.在较高的温度下,粘度的下降更大。 在250℃和280℃下作为分子量的函数的表观粘度如图1所示。 降低分子量也导致断裂阻力从4100J / m 2到296J / m 2的线性降低,如图2所示。 1。

    Polyphenylene ethers with imide linking groups
    9.
    发明授权
    Polyphenylene ethers with imide linking groups 失效
    聚亚苯基醚与酰亚胺连接基团

    公开(公告)号:US4444979A

    公开(公告)日:1984-04-24

    申请号:US469866

    申请日:1983-02-25

    IPC分类号: C08G73/00 C08G73/10

    摘要: Novel polyphenylene ethers with imide linking units are disclosed. These polymers incorporate the solvent and thermal resistance of polyimides and the processability of polyphenylene ethers. Improved physical properties over those of the prior art are obtained by incorporating meta linked ethers and/or polyphenylene oxides into the polymer backbone. A novel process for making polymers of this type is also disclosed. The process is unique in that the expected need of high process temperatures and/or special atmospheres are eliminated.

    摘要翻译: 公开了具有酰亚胺连接单元的新型聚苯醚。 这些聚合物结合聚酰亚胺的溶剂和耐热性以及聚苯醚的加工性。 通过将间接连接的醚和/或聚苯醚掺入聚合物主链中,获得了比现有技术更好的物理性能。 还公开了一种制备这种类型的聚合物的新方法。 该方法是独特的,因为预期需要高的工艺温度和/或特殊的气氛被消除。

    Liquid crystalline thermosets from ester, ester-imide, and ester-amide oligomers
    10.
    发明授权
    Liquid crystalline thermosets from ester, ester-imide, and ester-amide oligomers 有权
    来自酯,酯 - 酰亚胺和酯 - 酰胺低聚物的液晶热固性材料

    公开(公告)号:US07507784B2

    公开(公告)日:2009-03-24

    申请号:US11124508

    申请日:2005-04-29

    摘要: Main chain thermotropic liquid crystal esters, ester-imides, and ester-amides were prepared from AA, BB, and AB type monomeric materials and end-capped with phenylacetylene, phenylmaleimide, or nadimide reactive end-groups. The end-capped liquid crystal oligomers are thermotropic and have, preferably, molecular weights in the range of approximately 1000-15,000 grams per mole. The end-capped liquid crystal oligomers have broad liquid crystalline melting ranges and exhibit high melt stability and very low melt viscosities at accessible temperatures. The end-capped liquid crystal oligomers are stable for up to an hour in the melt phase. They are highly processable by a variety of melt process shape forming and blending techniques. Once processed and shaped, the end-capped liquid crystal oligomers were heated to further polymerize and form liquid crystalline thermosets (LCT). The fully cured products are rubbers above their glass transition temperatures.

    摘要翻译: 主链热致液晶酯,酯 - 酰亚胺和酯 - 酰胺由AA,BB和AB型单体材料制备,并用苯乙炔,苯基马来酰亚胺或纳二酰胺反应性端基封端。 封端的液晶低聚物是热致变性的,并且优选分子量在约1000-15,000克/摩尔的范围内。 封端的液晶低聚物具有宽的液晶熔融范围,并且在可接近的温度下表现出高的熔体稳定性和非常低的熔体粘度。 封端的液晶低聚物在熔融相中稳定长达一个小时。 它们通过各种熔体加工形状和混合技术可高度加工。 一旦加工和成形,加热封端的液晶低聚物进一步聚合并形成液晶热固性塑料(LCT)。 完全固化的产品是高于其玻璃化转变温度的橡胶。