Abstract:
A wiring board constructed of an integral combination of an insulating substrate including 60-95% by weight of a powder of an inorganic insulating material and 5-40% by weight of a thermosetting resin which joins the particles of the powder of an inorganic insulating material, and an insulating substrate-coating, wiring conductor which includes 70-95% by weight of a metal powder and 5-30% by weight of a thermosetting resin.
Abstract:
Resins suitable for adhesives are based on .alpha.-methyl styrene, styrene and phenol in certain percentages, viz. 25 to 63, 35 to 73 and 2 to 15 percent by weight, respectively,Combinations of resin, ethylene vinyl acetate copolymer or thermoelastomer and optionally a wax or tackifying oil yield excellent adhesives, in particular hot-melt adhesives.
Abstract:
What is disclosed is an adhesion improved plastisol composition adaptable to use as a coating material or adhesive and comprising a finely-divided vinyl chloride polymer together with a plasticizer and filler and an adhesion improver which is (1) a condensation product formed between a polymerized fatty acid mixture having a content, X, measured in weight percent of said mixture, of tripolymeric and higher polymeric fatty acids and excess polyalkylene polyamine; (2) a product formed by reacting said condensation product (1) with an aldehyde or ketone; or (3) an adduct formed between said condensation product (1) and an epoxy compound; said adhesion improver (1), (2), or (3) having a content, Y, of imidazoline groups, expressed as a percent by weight of condensation product (1), such that the values of both X and Y are at least 40, or if the value of either X or Y is below 40 then the other value is at least 40+Z, where Z is the difference between 40 and the smaller value.
Abstract:
A segmented thermoplastic copolyester containing intralinear long chain and short chain ester units is bonded to a fiber-forming condensation polymer or regenerated cellulose by reaction with a polyisocyanate reaction product, having an available isocyanato group content of at least 2 percent, at elevated temperature and/or elevated pressure.
Abstract:
There is disclosed the preparation of polymer composites with porous cellulosic materials, such as wood. The process for forming such a composite involves impregnating the wood with a polymerizable complex of a monomer combination such as a complex of maleic anhydride and styrene. The polymerization is uncatalyzed - i.e., it is conducted without employing conventional means for inducing polymerization of monomers in wood, such as high-energy radiation or the thermal decomposition of a chemical free radical precursor. There is also disclosed a solid, stable complex of styrene and maleic anhydride.
Abstract:
Very rapid catalytic formation and polymerization of polyurethane polymers followed by cross-linking with complex, hindered polyamines permits one-step, in-situ and continuous production of new types of pressure-sensitive adhesives and impregnated permeable materials. This pressure sensitive adhesive may be coated onto one side of a heat-resistant inert liner and then said adhesive coated side may be laminated to a matching sheet of cured rubber.
Abstract:
This invention is directed to compositions of normally crystalline copolymers of vinylidene chloride and vinyl chloride containing small amounts of a polycaprolactone resin, which compositions are particularly suited for use as an adhesive seam in fabric construction, e.g., in the dielectric bonding of woven or nonwoven fabric materials.
Abstract:
There is disclosed polyamide compositions of fractionated polymeric fat acids and diamines of the formula WHERE R'' is an alkyl group having from 1-4 carbon atoms and n is an integer designating the number of substituent groups present. When n is O, the ring is accordingly an unsubstituted cyclohexyl ring. Illustrative diamines are 4,4''-diaminodicyclohexylmethane and 4,4''-diamino-3,3''-dimethyldicyclohexylmethane. Copolymerizing dibasic acids such as suberic, sebacic or dodecanedioic acids may also be present. The polyamides find utility as molding powders, adhesives and in the form of films or sheets.