公开(公告)号：US5746835A

公开(公告)日：1998-05-05

申请号：US252817

申请日：1994-06-02

申请人： Terry R. Turner ,  James F. Belcher ,  Gary W. Andrews

发明人： Terry R. Turner ,  James F. Belcher ,  Gary W. Andrews

IPC分类号： G01N27/28 ,  C23C16/00

CPC分类号： G01N27/60

摘要： A retractable probe system (12) senses in situ a plurality of predetermined process parameters of a wafer (24) fabrication environment (16) and includes a sensing device (47) for sensing the predetermined process parameters, a probe arm (46) for holding sensing device (47) and having sufficient length to extend sensing device (47) into a predetermined location of the fabrication environment (16). A housing (36) receives the sensing device (47) and probe arm (46). A locator mechanism (52, 42, and 44) controllably locates sensing device 47) and probe arm (46) within fabrication environment (16) and within housing (36). An isolator mechanism (34) isolates sensing device (47) and probe arm (46) within housing (36) and essentially out of gases communication with fabrication environment (16). Cleaning mechanism (54) cleanses sensing device (47) within housing (36) and permits sensing device (47) to be immediately thereafter located in fabrication environment (16).

公开(公告)号：US5716878A

公开(公告)日：1998-02-10

申请号：US787559

申请日：1997-01-22

申请人： Terry R. Turner ,  James F. Belcher ,  Gary W. Andrews

发明人： Terry R. Turner ,  James F. Belcher ,  Gary W. Andrews

IPC分类号： G01N27/28 ,  G01N27/00 ,  H01L21/00

CPC分类号： G01N27/60

摘要： A retractable probe system (12) senses in situ a plurality of predetermined process parameters of a wafer (24) fabrication environment (16) and includes a sensing device (47) for sensing the predetermined process parameters, a probe arm (46) for holding sensing device (47) and having sufficient length to extend sensing device (47) into a predetermined location of the fabrication environment (16). A housing (36) receives the sensing device (47) and probe arm (46). A locator mechanism (52, 42, and 44) controllably locates sensing device 47) and probe arm (46) within fabrication environment (16) and within housing (36). An isolator mechanism (34) isolates sensing device (47) and probe arm (46) within housing (36) and essentially out of gases communication with fabrication environment (16). Cleaning mechanism (54) cleanses sensing device (47) within housing (36) and permits sensing device (47) to be immediately thereafter located in fabrication environment (16).

摘要翻译： 可伸缩探针系统（12）原位感测晶片（24）制造环境（16）的多个预定工艺参数，并且包括用于感测预定工艺参数的感测装置（47），用于保持 感测装置（47）并且具有足够的长度以将感测装置（47）延伸到制造环境（16）的预定位置。 壳体（36）接收感测装置（47）和探测臂（46）。 定位器机构（52,42和44）可控地定位传感装置47）和探针臂（46）在制造环境（16）内和壳体（36）内。 隔离器机构（34）将感测装置（47）和探针臂（46）隔离在壳体（36）内，并且基本上不与制造环境（16）连通。 清洁机构（54）清洁壳体（36）内的感测装置（47），并且允许感测装置（47）立即定位在制造环境（16）中。

公开(公告)号：US5370301A

公开(公告)日：1994-12-06

申请号：US177038

申请日：1994-01-04

申请人： James F. Belcher ,  Gary W. Andrews

发明人： James F. Belcher ,  Gary W. Andrews

IPC分类号： H01L21/00 ,  H01L21/60

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/8121 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： A bonding apparatus (40) is provided for use in coupling a first substrate (20) with flip chip type interconnections (24) to a second substrate (22) having matching flip chip type interconnections (26). The bonding apparatus (40) includes a pedestal assembly (50) which may be used to align and couple the first substrate (20) with the second substrate (22) and transport the substrates (20 and 22) from the bonding apparatus (40) to a heater assembly (110). Magnetic force is used to maintain the alignment of the first substrate (20) with the second substrate (22) during temperature cycling within the heater assembly. The pedestal assembly (50) includes a magnet slidably disposed on the exterior of the pedestal assembly (50). For some applications, the magnet (60) may be formed from one or more permanent magnets. For other applications, magnet (60) may be formed from one or more electromagnets.

摘要翻译： 提供了一种用于将第一衬底（20）与倒装芯片型互连（24）耦合到具有匹配倒装芯片型互连（26）的第二衬底（22）的接合装置（40）。 接合装置（40）包括可用于将第一基板（20）与第二基板（22）对准和联接并将基板（20和22）从接合装置（40）传送的基座组件（50） 到加热器组件（110）。 在加热器组件内的温度循环期间，使用磁力来保持第一基板（20）与第二基板（22）的对准。 基座组件（50）包括可滑动地设置在基座组件（50）的外部上的磁体。 对于一些应用，磁体（60）可以由一个或多个永磁体形成。 对于其它应用，磁体（60）可以由一个或多个电磁体形成。

公开(公告)号：US5351876A

公开(公告)日：1994-10-04

申请号：US177037

申请日：1994-01-04

申请人： James F. Belcher ,  Gary W. Andrews

发明人： James F. Belcher ,  Gary W. Andrews

IPC分类号： H01L21/603 ,  H01L21/00 ,  H01L21/60 ,  H01L21/68

CPC分类号： H01L21/67121 ,  H01L21/68 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75734 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： A bonding apparatus (40) having one or more electromagnets (60) is provided for use in coupling a first substrate (20) with flip chip type interconnections (24) to a second substrate (22) having matching flip chip type interconnections (26). The bonding apparatus (40) includes a pedestal assembly (50) which may be used to align and couple the first substrate (20) with the second substrate (22). The bonding apparatus (40) includes an electrical control system (108) with a control unit (130) for varying the amount of electrical power supplied to the electromagnet (60). One or more heater assemblies (110) are provided for temperature cycling of the substrates (20 and 22) during the bonding process. Magnetic force is used to maintain the alignment of the first substrate (20) with the second substrate (22) during temperature cycling.

摘要翻译： 提供具有一个或多个电磁体（60）的接合装置（40），用于将第一衬底（20）与倒装芯片型互连（24）耦合到具有匹配倒装芯片型互连（26）的第二衬底（22） 。 接合装置（40）包括可用于将第一基板（20）与第二基板（22）对准和联接的基座组件（50）。 接合装置（40）包括具有用于改变供应给电磁体（60）的电力量的控制单元（130）的电气控制系统（108）。 提供一个或多个加热器组件（110），用于在接合过程期间衬底（20和22）的温度循环。 磁力用于在温度循环期间保持第一衬底（20）与第二衬底（22）的对准。

公开(公告)号：US5460320A

公开(公告)日：1995-10-24

申请号：US274084

申请日：1994-07-12

申请人： James F. Belcher ,  Gary W. Andrews

发明人： James F. Belcher ,  Gary W. Andrews

IPC分类号： H01L21/00 ,  H01L21/60

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/8121 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： A bonding apparatus (40) is provided for use in coupling a first substrate (20) with flip chip type interconnections (24) to a second substrate (22) having matching flip chip type interconnections (26). The bonding apparatus (40) includes a pedestal assembly (50) which may be used to align and couple the first substrate (20) with the second substrate (22) and transport the substrates (20 and 22) from the bonding apparatus (40) to a heater assembly (110). Magnetic force is used to maintain the alignment of the first substrate (20) with the second substrate (22) during temperature cycling within the heater assembly. The pedestal assembly (50) includes a magnet slidably disposed on the exterior of the pedestal assembly (50). For some applications, the magnet (60) may be formed from one or more permanent magnets. For other applications, magnet (60) may be formed from one or more electromagnets.

摘要翻译： 提供了一种用于将第一衬底（20）与倒装芯片型互连（24）耦合到具有匹配倒装芯片型互连（26）的第二衬底（22）的接合装置（40）。 接合装置（40）包括可用于将第一基板（20）与第二基板（22）对准和联接并将基板（20和22）从接合装置（40）传送的基座组件（50） 到加热器组件（110）。 在加热器组件内的温度循环期间，使用磁力来保持第一基板（20）与第二基板（22）的对准。 基座组件（50）包括可滑动地设置在基座组件（50）的外部上的磁体。 对于一些应用，磁体（60）可以由一个或多个永磁体形成。 对于其它应用，磁体（60）可以由一个或多个电磁体形成。

公开(公告)号：US4520629A

公开(公告)日：1985-06-04

申请号：US526851

申请日：1983-08-26

申请人： Robert M. Dix ,  Timothy A. Ellis ,  Gary W. Andrews

发明人： Robert M. Dix ,  Timothy A. Ellis ,  Gary W. Andrews

IPC分类号： F16H21/18 ,  F02G1/053 ,  F16H25/14 ,  F16J15/16 ,  F25B9/14 ,  F25B9/00

CPC分类号： F25B9/14 ,  F02G1/0535 ,  F02G2244/00 ,  Y10T74/2107

摘要： An improved cryogenic refrigerator having a drive mechanism suitable for use with gap or clearance seals is disclosed. The drive mechanism includes two reciprocating members, e.g. piston and regenerator/displacer, driven by a common rotating drive shaft. The regenerator/displacer portion of the drive shaft includes a roller at one end in engagement with a rod base plate for driving a rod connected to the regenerator/displacer and a spring for returning the regenerator/displacer simultaneously with the withdrawal of the drive shaft. The piston portion of the drive shaft is connected to a first end of a hollow body. The second end of the hollow body which is opposite the first end has the piston rigidly affixed thereto. The hollow body has a portion adjacent the first end supported by a guide whereby the piston is substantially isolated from side force loads during reciprocation.

摘要翻译： 公开了一种具有适用于间隙或间隙密封的驱动机构的改进的低温冰箱。 驱动机构包括两个往复运动件，例如 活塞和再生器/置换器，由共同的旋转驱动轴驱动。 驱动轴的再生器/置换器部分包括一端与杆基板接合的辊，用于驱动连接到再生器/置换器的杆，以及用于在驱动轴的撤出的同时使再生器/置换器返回的弹簧。 驱动轴的活塞部分连接到中空体的第一端。 中空体的与第一端相对的第二端具有刚性地固定在其上的活塞。 中空体具有靠近由引导件支撑的第一端部的部分，由此活塞在往复运动期间基本上与侧向力负载隔离。