PLASMA CVD APPARATUS, METHOD FOR FORMING THIN FILM AND SEMICONDUCTOR DEVICE
    2.
    发明申请
    PLASMA CVD APPARATUS, METHOD FOR FORMING THIN FILM AND SEMICONDUCTOR DEVICE 审中-公开
    等离子体CVD装置,形成薄膜和半导体器件的方法

    公开(公告)号:US20130160711A1

    公开(公告)日:2013-06-27

    申请号:US13772795

    申请日:2013-02-21

    IPC分类号: B05D1/00

    摘要: A plasma CVD apparatus including a reaction chamber including an inlet for supplying a compound including a borazine skeleton, a feeding electrode, arranged within the reaction chamber, for supporting a substrate and being applied with a negative charge, and a plasma generating mechanism, arranged opposite to the feeding electrode via the substrate, for generating a plasma within the reaction chamber. A method forms a thin film wherein a thin film is formed by using a compound including a borazine skeleton as a raw material, and a semiconductor device includes a thin film formed by such a method as an insulating film. The apparatus and method enable to produce a thin film wherein low dielectric constant and high mechanical strength are stably maintained for a long time and insulating characteristics are secured.

    摘要翻译: 一种等离子体CVD装置,包括反应室,该反应室包括用于供给包含环硼氮烷骨架的化合物的入口,设置在反应室内的供电电极,用于支撑基板并施加负电荷;以及等离子体产生机构, 经由衬底到达馈电电极,用于在反应室内产生等离子体。 一种方法形成薄膜,其中通过使用包含环硼氮烷骨架的化合物作为原料形成薄膜,并且半导体器件包括通过诸如绝缘膜的方法形成的薄膜。 该装置和方法能够制造其中低介电常数和高机械强度长时间稳定地保持并且确保绝缘特性的薄膜。