Semiconductor thin film crystallization device and semiconductor thin film crystallization method
    2.
    发明申请
    Semiconductor thin film crystallization device and semiconductor thin film crystallization method 审中-公开
    半导体薄膜结晶装置和半导体薄膜结晶方法

    公开(公告)号:US20080084901A1

    公开(公告)日:2008-04-10

    申请号:US11982568

    申请日:2007-11-02

    IPC分类号: H01S3/10 H01L31/0248

    摘要: A first laser beam is emitted from a first laser oscillator in a pulsed manner at a high repetition frequency, and converged onto a substrate by a first intermediate optical system 2 so as to form a slit-like first beam spot. A second laser beam is emitted from a second laser beam oscillator in a pulsed manner to rise precedent to and fall subsequent to the first laser beam, and converged onto the substrate by a second intermediate optical system so as to form a second beam spot similar in configuration to the first beam spot and to contain the first beam spot. Crystallization of a semiconductor thin film on the substrate is carried out while the substrate or the first, second beam spots are moved. Thereby, the whole semiconductor thin film is formed into a crystal surface that has grown in one direction and free from ridges. Thus, the semiconductor thin film has an extremely flat surface, extremely few defects, large crystal grains and high throughput.

    摘要翻译: 第一激光束以高重复频率以脉冲方式从第一激光振荡器发射,并且通过第一中间光学系统2会聚到基板上,以形成狭缝状的第一光束点。 第二激光束以脉冲方式从第二激光束振荡器发射,以在第一激光束之前先进并落下,并且通过第二中间光学系统会聚到衬底上,以形成与第二激光束相似的第二光束点 配置到第一束斑并且包含第一束斑。 在基板或第一,第二光束点移动的同时进行半导体薄膜在基板上的结晶。 由此,整个半导体薄膜形成为在一个方向上生长并且没有脊的晶体表面。 因此,半导体薄膜具有非常平坦的表面,极少的缺陷,大的晶粒和高的通量。