-
1.发明申请Method of Forming an Integrated Circuit Package Including a Direct Connect Pad, A Blind Via, and a Bond Pad Electrically Coupled to the Direct Connect Pad 有权形成集成电路封装的方法，包括直接连接焊盘，盲孔和键合电极耦合到直接连接焊盘公开(公告)号：US20130295722A1
公开(公告)日：2013-11-07
申请号：US13939804
申请日：2013-07-11
Applicant: Texas Instruments Incorporated
Inventor： Kenneth Robert Rhyner , Peter R. Harper
IPC: H01L23/00
CPC classification number: H01L24/03 , H01L21/50 , H01L23/48 , H01L23/49805 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L24/05 , H01L24/16 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05147 , H01L2224/05569 , H01L2224/05571 , H01L2224/13022 , H01L2224/131 , H01L2224/16237 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2924/12042 , H01L2924/15787 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/00
Abstract: A method for forming an integrated circuit package is disclosed. A flex circuit is form by forming a direct connect pad on a first side of a dielectric layer. After forming the direct connect pad, an opening from a second side of the dielectric layer is formed to expose the direct connect pad. A blind via is formed within the opening in the dielectric layer. A first conductor is formed within the opening. A bond pad of a semiconductor die is electrically coupled with the direct connect pad using a second conductor, wherein the bond pad and the second conductor directly overlie the direct connect pad.
Abstract translation: 公开了一种用于形成集成电路封装的方法。 通过在电介质层的第一侧上形成直接连接焊盘来形成柔性电路。 在形成直接连接焊盘之后，形成从电介质层的第二侧的开口以暴露直接连接焊盘。 在电介质层的开口内形成盲通孔。 第一导体形成在开口内。 半导体管芯的接合焊盘使用第二导体与直接连接焊盘电耦合，其中接合焊盘和第二导体直接覆盖在直接连接焊盘上。
-
2.发明授权Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad 有权形成集成电路封装的方法，该集成电路封装包括电连接到直接连接焊盘的直接连接焊盘，盲通孔和焊盘公开(公告)号：US08828799B2
公开(公告)日：2014-09-09
申请号：US13939804
申请日：2013-07-11
Applicant: Texas Instruments Incorporated
Inventor： Kenneth Robert Rhyner , Peter R. Harper
CPC classification number: H01L24/03 , H01L21/50 , H01L23/48 , H01L23/49805 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L24/05 , H01L24/16 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05147 , H01L2224/05569 , H01L2224/05571 , H01L2224/13022 , H01L2224/131 , H01L2224/16237 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2924/12042 , H01L2924/15787 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/00
Abstract: A method for forming an integrated circuit package is disclosed. A flex circuit is form by forming a direct connect pad on a first side of a dielectric layer. After forming the direct connect pad, an opening from a second side of the dielectric layer is formed to expose the direct connect pad. A blind via is formed within the opening in the dielectric layer. A first conductor is formed within the opening. A bond pad of a semiconductor die is electrically coupled with the direct connect pad using a second conductor, wherein the bond pad and the second conductor directly overlie the direct connect pad.
Abstract translation: 公开了一种用于形成集成电路封装的方法。 通过在电介质层的第一侧上形成直接连接焊盘来形成柔性电路。 在形成直接连接焊盘之后，形成从电介质层的第二侧的开口以暴露直接连接焊盘。 在电介质层的开口内形成盲通孔。 第一导体形成在开口内。 半导体管芯的接合焊盘使用第二导体与直接连接焊盘电耦合，其中接合焊盘和第二导体直接覆盖在直接连接焊盘上。
-
Search Results
2
records
(took 0.022 seconds)
