公开(公告)号：US20210156043A1

公开(公告)日：2021-05-27

申请号：US16693613

申请日：2019-11-25

申请人： The Boeing Company

发明人： Edgardo A. Reyes Brondo ,  Michael Howard-Edward Ware ,  Ethan L. Moore

IPC分类号： C25D5/34 ,  C25D3/30 ,  C25D3/48 ,  C25D3/44 ,  C25D3/04 ,  C25D3/12

摘要： A method for plating a metallic material onto a titanium substrate, wherein the titanium substrate includes an outer surface and an oxide layer on the outer surface. The method includes chemically etching the outer surface of the titanium substrate to remove at least a portion of the oxide layer, thereby yielding an etched titanium substrate. The method also includes establishing a cathodic protection current through the etched titanium substrate while the etched titanium substrate is immersed in a cathodic electrolyte solution. The method further includes strike plating a bond promoter layer onto the outer surface of the etched titanium substrate after the establishing of the cathodic protection current. The method lastly includes plating the metallic material onto the bond promoter layer.