摘要:
One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices. Other embodiments are directed to methods of depositing a thin film on the back of a MEMS device.
摘要:
An array of magnetically actuated MEMS mirror devices is provided having stationary magnets configured to provide strong magnetic fields in the plane of the mirrors without any magnets or magnet-system components in the plane of the mirrors. Also, a magnetically actuated mirror device is provided that includes an improved actuation coil configuration that provides greater torque during mirror actuation. In addition, a mechanism is provided to detect the angular deflection of a moveable mirror. Also, an improved process is provided for manufacturing MEMS mirror devices.