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    DEVICES, SYSTEMS, AND METHODS FOR OBTAINING SENSOR MEASUREMENTS
    1.
    发明公开
    DEVICES, SYSTEMS, AND METHODS FOR OBTAINING SENSOR MEASUREMENTS 审中-公开

    公开(公告)号：US20230348260A1

    公开(公告)日：2023-11-02

    申请号：US18348268

    申请日：2023-07-06

    Applicant: Canon Solutions America, Inc.

    Inventor： Jeffrey David Kane

    IPC: B81B7/00 ,  B81B7/04 ,  B41J11/00

    CPC classification number: B81B7/008 ,  B81B7/04 ,  B41J11/0095

    Abstract: Some embodiments of a device comprise an image-forming medium and one or more sensors that are attached to the image-forming medium. Also, in some embodiments, the image-forming medium is paper or a medium that has paper-like characteristics, at least some of the one or more sensors are microelectromechanical systems (MEMS), or the one or more sensors are configured to be powered by wireless power transfer. And some embodiments of the device further comprise a system-on-a-chip that is in communication with the one or more sensors, a transceiver that is in communication with the system-on-a-chip, or a radio-frequency identification (RFID) tag.

    Devices, systems, and methods for obtaining sensor measurements
    2.
    发明授权
    Devices, systems, and methods for obtaining sensor measurements 有权

    公开(公告)号：US11731870B2

    公开(公告)日：2023-08-22

    申请号：US16999020

    申请日：2020-08-20

    Applicant: Canon Solutions America, Inc.

    Inventor： Jeffrey David Kane

    IPC: B81B7/00 ,  B81B7/04 ,  B41J11/00

    CPC classification number: B81B7/008 ,  B41J11/0095 ,  B81B7/04

    Abstract: Some embodiments of a device comprise an image-forming medium and one or more sensors that are attached to the image-forming medium. Also, in some embodiments, the image-forming medium is paper or a medium that has paper-like characteristics, at least some of the one or more sensors are microelectromechanical systems (MEMS), or the one or more sensors are configured to be powered by wireless power transfer. And some embodiments of the device further comprise a system-on-a-chip that is in communication with the one or more sensors, a transceiver that is in communication with the system-on-a-chip, or a radio-frequency identification (RFID) tag.

    RELEASE HOLE PLUS CONTACT VIA FOR FINE PITCH ULTRASOUND TRANSDUCER INTEGRATION
    6.
    发明申请
    RELEASE HOLE PLUS CONTACT VIA FOR FINE PITCH ULTRASOUND TRANSDUCER INTEGRATION 审中-公开
    通过超声波超声波传感器集成来释放孔加入

    公开(公告)号：US20170066014A1

    公开(公告)日：2017-03-09

    申请号：US15254593

    申请日：2016-09-01

    Applicant: QUALCOMM Incorporated

    Inventor： Donald William Kidwell, JR. ,  Ravindra Shenoy ,  Jon Lasiter

    IPC: B06B1/02 ,  H01L41/332 ,  B81B7/04 ,  B06B1/06 ,  B81C1/00 ,  B81B3/00

    CPC classification number: B06B1/0292 ,  B06B1/0622 ,  B81B3/0021 ,  B81B3/0097 ,  B81B7/04 ,  B81C1/00134 ,  B81C1/00214 ,  H01L41/332

    Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

    Abstract translation: 提出了用于高密度微机电系统（MEMS）的方法，系统，计算机可读介质和装置。 在一些实施例中，用于在基底上制造微电子机械装置的方法可以包括通过装置的层蚀刻释放通路。 该方法还可以包括使用释放通道作为导管在装置的层中产生空腔，以进入空腔的期望位置，空腔使得能够移动装置的换能器。 该方法然后可以包括将低阻抗导电材料沉积到释放通孔中以形成通过该层的导电路径。 最后，该方法可以包括将导电材料电耦合到换能器的电极。

    Relative and Absolute Pressure Sensor Combined on Chip
    8.
    发明申请
    Relative and Absolute Pressure Sensor Combined on Chip 审中-公开
    相对和绝对压力传感器组合在一起

    公开(公告)号：US20160153815A1

    公开(公告)日：2016-06-02

    申请号：US14956770

    申请日：2015-12-02

    Applicant: X-FAB Semiconductor Foundries AG ,  Melexis Technologies NV

    Inventor： Appolonius Jacobus VAN DER WIEL ,  Uwe SCHWARZ ,  Rudi DE WINTER

    IPC: G01F1/34 ,  B81B7/04 ,  G01F15/14 ,  B81C1/00

    CPC classification number: G01F1/34 ,  B81B7/04 ,  B81B2201/0264 ,  B81C1/00214 ,  G01F15/14 ,  G01L9/008 ,  G01L15/00

    Abstract: A method for manufacturing a system in a wafer for measuring an absolute and a relative pressure includes etching a shallow and a deep cavity in the wafer. A top wafer is applied and the top wafer is thinned for forming a first respectively second membrane over the shallow respectively deep cavity, and for forming in the top wafer first respectively second bondpads at the first respectively second membrane resulting in a first respectively second sensor. Back grinding the wafer results in an opened deep cavity and a still closed shallow cavity. The first bondpads of the first sensor measure an absolute pressure and the second bondpads of the second sensor measure a relative pressure. The etching in the first step defines the edges of the first membrane and of the second membrane in respectively the sensors formed from the shallow and the deep cavity.

    Abstract translation: 用于制造用于测量绝对压力和相对压力的晶片中的系统的方法包括蚀刻晶片中的浅层和深空腔。 施加顶部晶片并且顶部晶片被薄化以在浅的分别的深空腔上形成第一分别为第二膜，并且在顶部晶片中首先分别在第一分开的第二膜处分别形成第二粘合垫，从而产生第一分别为第二传感器。 背面研磨晶圆导致开放的深腔和仍然闭合的浅腔。 第一传感器的第一粘合垫测量绝对压力，并且第二传感器的第二粘合垫测量相对压力。 在第一步骤中的蚀刻分别限定由浅层和深腔形成的传感器中的第一膜和第二膜的边缘。

    Micromachined monolithic 3-axis gyroscope with single drive
    9.
    发明授权
    Micromachined monolithic 3-axis gyroscope with single drive 有权
    具单驱动的微加工单片三轴陀螺仪

    公开(公告)号：US09246018B2

    公开(公告)日：2016-01-26

    申请号：US13821842

    申请日：2011-09-18

    Applicant: Cenk Acar

    Inventor： Cenk Acar

    IPC: G01P21/02 ,  H01L29/84 ,  G01C19/5755 ,  G01P15/125 ,  G01P15/18 ,  G01P15/08

    CPC classification number: H01L29/84 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/051 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058 ,  B81B2207/094 ,  G01C19/5755 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0848

    Abstract: This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.

    Abstract translation: 本文件尤其讨论了盖晶片和通孔晶片，其被配置为封装形成在器件层的x-y平面中的单个校准质量3轴陀螺仪。 单个质量3轴陀螺仪可以包括悬挂在单个中心锚杆上的主要质量部分，主要质量部分包括朝向3轴陀螺仪传感器的边缘向外延伸的径向部分，中心 悬架系统，其构造成将三轴陀螺仪从单个中心锚固件悬挂起来;以及驱动电极，其包括移动部分和固定部分，所述移动部分联接到所述径向部分，其中所述驱动电极和所述中央悬挂系统被配置 以驱动频率使三轴陀螺仪围绕垂直于xy平面的z轴摆动。

    SYSTEM FOR DRIVING AN ARRAY OF MEMS STRUCTURES AND CORRESPONDING DRIVING METHOD
    10.
    发明申请
    SYSTEM FOR DRIVING AN ARRAY OF MEMS STRUCTURES AND CORRESPONDING DRIVING METHOD 有权
    用于驱动MEMS结构阵列和相应驱动方法的系统

    公开(公告)号：US20150344295A1

    公开(公告)日：2015-12-03

    申请号：US14675230

    申请日：2015-03-31

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Alberto CATTANI ,  Alessandro GASPARINI ,  Federico GUANZIROLI ,  Pierangelo CONFALONIERI

    IPC: B81B7/00

    CPC classification number: B81B7/008 ,  B81B3/00 ,  B81B7/04 ,  B81B2201/0257 ,  B81B2207/03 ,  B81B2207/053 ,  H04R3/007 ,  H04R3/12 ,  H04R19/005 ,  H04R2201/003

    Abstract: A system for driving a MEMS array having a number of MEMS structures, each defining at least one row terminal and one column terminal, envisages: a number of row driving stages, each for supplying row-biasing signals to the row terminal of each MEMS structure associated to a respective row; a number of column driving stages, each for supplying column-biasing signals to the column terminal of each MEMS structure associated to a respective column; and a control unit, for supplying row-address signals to the row driving stages for generation of the row-biasing signals and for supplying column-address signals to the column driving stages for generation of the column-biasing signals. The control unit further supplies row-deactivation and/or column-deactivation signals to one or more of the row and column driving stages, for causing deactivation of one or more rows and/or columns of the MEMS array.

    Abstract translation: 用于驱动具有多个MEMS结构的MEMS阵列的系统，每个MEMS结构限定至少一个行端子和一个列端子，设想：多个行驱动级，每个用于向每个MEMS结构的行端子提供行偏置信号 相关联的行; 多个列驱动级，每个列驱动级用于向与各列相关联的每个MEMS结构的列端子提供列偏置信号; 以及控制单元，用于将行地址信号提供到行驱动级，用于产生行偏置信号，并将列地址信号提供给列驱动级，以产生列偏置信号。 控制单元还向行驱动级和列驱动级中的一个或多个驱动级提供行去激活和/或列停用信号，以使MEMS阵列的一个或多个行和/或列的去激活。

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