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    Reinforced Silicone Resin Film and Method of Preparing Same
    8.
    发明申请
    Reinforced Silicone Resin Film and Method of Preparing Same 失效
    增强硅树脂薄膜及其制备方法

    公开(公告)号：US20080051548A1

    公开(公告)日：2008-02-28

    申请号：US11794924

    申请日：2006-02-01

    申请人： Debbie Bailey ,  Dimitris Katsoulis ,  Michitaka Suto ,  Bizhong Zhu

    发明人： Debbie Bailey ,  Dimitris Katsoulis ,  Michitaka Suto ,  Bizhong Zhu

    IPC分类号： C08L83/04 ,  B32B25/20

    CPC分类号： C08J5/04 ,  C08J5/24 ,  C08J2383/04 ,  C08J2383/14 ,  C09D183/04 ,  C09D183/14 ,  Y10T428/31598 ,  C08L83/00

    摘要： A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a hydrosilylation-curable silicone composition comprising a silicone resin, and heating the impregnated fiber reinforcement at a temperature sufficient to cure the silicone resin, wherein the reinforced silicone resin film comprises from 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 μm; and a reinforced silicone resin film prepared according to the method.

    摘要翻译： 一种制备增强硅树脂薄膜的方法，该方法包括以下步骤：将纤维增强物浸渍在包含硅树脂的氢化硅烷化可固化的硅氧烷组合物中，并在足以固化硅树脂的温度下加热浸渍的纤维增强体，其中 增强有机硅树脂膜包含10至99％（w / w）的固化的有机硅树脂，该膜的厚度为15至500μm; 和根据该方法制备的增强硅树脂膜。

    Embossing toughened silicone resin substrates
    9.
    发明申请
    Embossing toughened silicone resin substrates 失效
    压花增韧硅树脂基材

    公开(公告)号：US20070098958A1

    公开(公告)日：2007-05-03

    申请号：US10577377

    申请日：2004-10-22

    申请人： Dimitris Katsoulis ,  Bizhong Zhu

    发明人： Dimitris Katsoulis ,  Bizhong Zhu

    IPC分类号： B32B3/00 ,  G11B5/64

    CPC分类号： B29C59/022 ,  B29C2059/023 ,  B29K2083/00 ,  B29K2105/24 ,  Y10T428/24479 ,  Y10T428/265

    摘要： This invention relates to a method of embossing a cured silicone resin thermoset substrate to imprint patterns onto the substrate from a master mold comprising (i) stacking a master mold with a cured silicone resin thermoset substrate such that the surface of the master mold containing a feature is facing the silicone resin substrate; (ii) applying pressure to the product of (i) in a press at a temperature slightly higher than the Tg of the silicone resin but lower than the softening point of the master mold; (iii) cooling the product of (ii) and maintaining the pressure on the mold; and (iv) releasing the substrate whereby the feature is imprinted on the silicone resin substrate. Cured silicone resin thermoset substrates offer advantages over the organic thermoplastics in terms of hot embossing lithography by offering a very smooth surface which promotes high fidelity of replication in the micrometer and manometer domain, and requiring no release agent for demolding.

    摘要翻译： 本发明涉及一种将固化的硅氧烷树脂热固性基材压花的方法，以从母模将压印图案压印到基材上，该方法包括：（i）用固化的硅氧烷树脂热固性基材堆叠母模，使得主模具的表面含有特征 面向硅树脂基板; （ii）在稍高于有机硅树脂的Tg但低于母模的软化点的温度下在压力机中对（i）的产物施加压力; （iii）冷却（ii）的产品并保持模具上的压力; 和（iv）释放基板，由此将特征压印在硅树脂基板上。 固化有机硅树脂热固性基材通过提供非常光滑的表面，在热压花纹光刻方面提供优于有机热塑性塑料的优点，这促进了在千分尺和压力计领域中的复制的高保真度，并且不需要脱模剂用于脱模。

    Embossing toughened silicone resin substrates
    10.
    发明授权
    Embossing toughened silicone resin substrates 失效
    压花增韧硅树脂基材

    公开(公告)号：US07682545B2

    公开(公告)日：2010-03-23

    申请号：US10577377

    申请日：2004-10-22

    申请人： Dimitris Katsoulis ,  Bizhong Zhu

    发明人： Dimitris Katsoulis ,  Bizhong Zhu

    IPC分类号： B28B3/00

    CPC分类号： B29C59/022 ,  B29C2059/023 ,  B29K2083/00 ,  B29K2105/24 ,  Y10T428/24479 ,  Y10T428/265

    摘要： This invention relates to a method of embossing a cured silicone resin thermoset substrate to imprint patterns onto the substrate from a master mold comprising (i) stacking a master mold with a cured silicone resin thermoset substrate such that the surface of the master mold containing a feature is facing the silicone resin substrate; (ii) applying pressure to the product of (i) in a press at a temperature slightly higher than the Tg of the silicone resin but lower than the softening point of the master mold; (iii) cooling the product of (ii) and maintaining the pressure on the mold; and (iv) releasing the substrate whereby the feature is imprinted on the silicone resin substrate. Cured silicone resin thermoset substrates offer advantages over the organic thermoplastics in terms of hot embossing lithography by offering a very smooth surface which promotes high fidelity of replication in the micrometer and manometer domain, and requiring no release agent for demolding.

    摘要翻译： 本发明涉及一种将固化的硅氧烷树脂热固性基材压花的方法，以从母模将压印图案压印到基材上，该方法包括：（i）用固化的硅氧烷树脂热固性基材堆叠母模，使得主模具的表面含有特征 面向硅树脂基板; （ii）在稍高于有机硅树脂的Tg但低于母模的软化点的温度的压力机中对（i）的产物施加压力; （iii）冷却（ii）的产品并保持模具上的压力; 和（iv）释放基板，由此将特征压印在硅树脂基板上。 固化有机硅树脂热固性基材通过提供非常光滑的表面，在热压花纹光刻方面提供优于有机热塑性塑料的优点，这促进了在千分尺和压力计领域中的复制的高保真度，并且不需要脱模剂用于脱模。