公开(公告)号：US06570102B2

公开(公告)日：2003-05-27

申请号：US09878533

申请日：2001-06-11

申请人： Thomas Richard Miller ,  Konstantinos I. Papathomas ,  Brian Eugene Curcio ,  Joseph J. Sniezek

发明人： Thomas Richard Miller ,  Konstantinos I. Papathomas ,  Brian Eugene Curcio ,  Joseph J. Sniezek

IPC分类号： H01R1204

CPC分类号： H01L23/49822 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K3/246 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2203/0554 ,  Y10T29/4913 ,  H01L2924/00

摘要： A method and arrangement for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, there are provided vias of either through-holes, blind holes and buried holes filled with a conductive paste material to form electrical interconnections with conductive layers of the printed wiring board.

公开(公告)号：US4971715A

公开(公告)日：1990-11-20

申请号：US272847

申请日：1988-11-18

申请人： Richard G. Armant ,  Edward L. Arrington ,  Anilkumar C. Bhatt ,  Donald M. Egleton ,  Frederick M. Ortloff ,  Joseph J. Sniezek ,  John A. Welsh

发明人： Richard G. Armant ,  Edward L. Arrington ,  Anilkumar C. Bhatt ,  Donald M. Egleton ,  Frederick M. Ortloff ,  Joseph J. Sniezek ,  John A. Welsh

IPC分类号： G03F7/42 ,  H01L21/027 ,  H01L21/30

CPC分类号： G03F7/426

摘要： A stripping composition containing O-dichlorobenzene, dodecylbenzene sulfonic acid, perchloroethylene, and optionally an aromatic hydrocarbon containing at least 8 carbon atoms, and use thereof for removing photoresist.

公开(公告)号：US06524352B2

公开(公告)日：2003-02-25

申请号：US10043830

申请日：2002-01-09

申请人： Sylvia Adae-Amoakoh ,  John M. Lauffer ,  Michael D. Lowell ,  Voya R. Markovich ,  Joseph J. Sniezek

发明人： Sylvia Adae-Amoakoh ,  John M. Lauffer ,  Michael D. Lowell ,  Voya R. Markovich ,  Joseph J. Sniezek

IPC分类号： H01G900

CPC分类号： H05K1/053 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/162 ,  H05K3/403 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0338 ,  H05K2201/0919 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y10T29/417 ,  H01L2924/00

摘要： A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

公开(公告)号：US06370012B1

公开(公告)日：2002-04-09

申请号：US09652596

申请日：2000-08-30

申请人： Sylvia Adae-Amoakoh ,  John M. Lauffer ,  Michael D. Lowell ,  Voya R. Markovich ,  Joseph J. Sniezek

发明人： Sylvia Adae-Amoakoh ,  John M. Lauffer ,  Michael D. Lowell ,  Voya R. Markovich ,  Joseph J. Sniezek

IPC分类号： H01G4228

CPC分类号： H05K1/053 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/162 ,  H05K3/403 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0338 ,  H05K2201/0919 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y10T29/417 ,  H01L2924/00

摘要： A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

摘要翻译： 能够形成较大的电路板或类似结构的内部部分以提供电容的并联电容器结构。 或者，电容器可以用作互连器以互连两个不同的电子部件（例如，芯片载体，电路板，甚至半导体芯片），同时仍然为一个或多个所述部件提供期望的电容水平。 电容器包括至少一个内部导电层，在内部导体的相对侧上添加两个附加的导体层，以及无机介电材料（优选地，在第二导体层的外表面上的氧化物层或适用于诸如钛酸钡的适当介电材料 第二导体层）。 此外，电容器包括无机介电材料顶部的外部导体层，从而在内部和附加的导电层和外部导体之间形成并联的电容器。