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公开(公告)号:US07794278B2
公开(公告)日:2010-09-14
申请号:US12062581
申请日:2008-04-04
申请人: Thomas S. Cohen , Brian Kirk , Jason E. Chan , Andreas C. Pfahnl , Marc B. Cartier, Jr. , David Manter
发明人: Thomas S. Cohen , Brian Kirk , Jason E. Chan , Andreas C. Pfahnl , Marc B. Cartier, Jr. , David Manter
IPC分类号: H01R13/648
CPC分类号: H01R12/727 , H01R13/6471 , H01R13/6474 , H01R13/6585 , H01R13/6587
摘要: An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers containing columns of conductive elements, some of which form differential pairs. Each column may include ground conductors adjacent pairs of signal conductors. The ground conductors may be wider than the signal conductors, with ground conductors between adjacent pairs of signal conductors being wider than ground conductors positioned at an end of at least some of the columns. Each of the conductive elements may end in a mating contact portion positioned to engage a complementary contact element in a mating connector. The mating contact portions of the signal conductors in some of the pairs may be rotated relative to the columns. The printed circuit board to which the differential signal connector is mounted may be constructed with elongated antipads around pairs of signal conductors.
摘要翻译: 具有高速差动电连接器的电气互连系统。 连接器由包含导电元件列的晶片组装,其中一些形成差分对。 每列可以包括相邻的信号导体对的接地导体。 接地导体可以比信号导体更宽,相邻的信号导体对之间的接地导体宽于位于至少一些列的端部的接地导体。 每个导电元件可以在匹配的接触部分中端部,该配合接触部分定位成接合配合连接器中的互补接触元件。 一些成对的信号导体的配合接触部分可以相对于列旋转。 安装有差分信号连接器的印刷电路板可以在信号导体对周围形成细长的止动片。
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公开(公告)号:US20080248658A1
公开(公告)日:2008-10-09
申请号:US12062581
申请日:2008-04-04
申请人: Thomas S. Cohen , Brian Kirk , Jason E. Chan , Andreas C. Pfahnl , Marc B. Cartier , David Manter
发明人: Thomas S. Cohen , Brian Kirk , Jason E. Chan , Andreas C. Pfahnl , Marc B. Cartier , David Manter
CPC分类号: H01R12/727 , H01R13/6471 , H01R13/6474 , H01R13/6585 , H01R13/6587
摘要: An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers containing columns of conductive elements, some of which form differential pairs. Each column may include ground conductors adjacent pairs of signal conductors. The ground conductors may be wider than the signal conductors, with ground conductors between adjacent pairs of signal conductors being wider than ground conductors positioned at an end of at least some of the columns. Each of the conductive elements may end in a mating contact portion positioned to engage a complementary contact element in a mating connector. The mating contact portions of the signal conductors in some of the pairs may be rotated relative to the columns. The printed circuit board to which the differential signal connector is mounted may be constructed with elongated antipads around pairs of signal conductors.
摘要翻译: 具有高速差动电连接器的电气互连系统。 连接器由包含导电元件列的晶片组装,其中一些形成差分对。 每列可以包括相邻的信号导体对的接地导体。 接地导体可以比信号导体更宽,相邻的信号导体对之间的接地导体宽于位于至少一些列的端部的接地导体。 每个导电元件可以在匹配的接触部分中端部,该配合接触部分定位成接合配合连接器中的互补接触元件。 一些成对的信号导体的配合接触部分可以相对于列旋转。 安装有差分信号连接器的印刷电路板可以在信号导体对周围形成细长的止动片。
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公开(公告)号:US09225085B2
公开(公告)日:2015-12-29
申请号:US13930351
申请日:2013-06-28
申请人: Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人: Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号: H01R13/648 , H01R12/70 , H01R12/71 , H01R43/20 , H01R13/6587 , H05K1/02
CPC分类号: H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译: RF连接器模块和相关的印刷电路板,在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造,例如冲压,嵌入成型,多次成型和部件之间的过盈配合,以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构,其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造,包括钻孔以形成通孔。 结果,可以以低成本制造互连系统。 可以应用这些技术来提供性能,包括在RF信号之间的隔离的形式,与由更昂贵的组件提供的RF信号相当。
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公开(公告)号:US20140004724A1
公开(公告)日:2014-01-02
申请号:US13930531
申请日:2013-06-28
申请人: Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人: Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号: H01R12/70
CPC分类号: H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译: RF连接器模块和相关的印刷电路板,在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造,例如冲压,嵌件成型,多次成型和部件之间的过盈配合,以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构,其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造,包括钻孔以形成通孔。 结果,可以以低成本制造互连系统。 可以应用这些技术来提供性能,包括在RF信号之间的隔离的形式,与由更昂贵的组件提供的RF信号相当。
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公开(公告)号:US09583853B2
公开(公告)日:2017-02-28
申请号:US13930447
申请日:2013-06-28
申请人: Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人: Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号: H01R12/70 , H01R13/648 , H01R12/71 , H01R43/20 , H01R13/6587 , H05K1/02
CPC分类号: H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译: RF连接器模块和相关的印刷电路板,在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造,例如冲压,嵌入成型,多次成型和部件之间的过盈配合,以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构,其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造,包括钻孔以形成通孔。 结果,可以以低成本制造互连系统。 可以应用这些技术来提供性能,包括在RF信号之间的隔离的形式,与由更昂贵的组件提供的RF信号相当。
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公开(公告)号:US09022806B2
公开(公告)日:2015-05-05
申请号:US13930531
申请日:2013-06-28
申请人: Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人: Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号: H01R13/648 , H01R12/70 , H01R12/71 , H01R43/20 , H01R13/6587 , H05K1/02
CPC分类号: H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译: RF连接器模块和相关的印刷电路板,在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造,例如冲压,嵌件成型,多次成型和部件之间的过盈配合,以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构,其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造,包括钻孔以形成通孔。 结果,可以以低成本制造互连系统。 可以应用这些技术来提供性能,包括在RF信号之间的隔离的形式,与由更昂贵的组件提供的RF信号相当。
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公开(公告)号:US20140004746A1
公开(公告)日:2014-01-02
申请号:US13930351
申请日:2013-06-28
申请人: Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人: Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号: H01R12/71
CPC分类号: H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译: RF连接器模块和相关的印刷电路板,在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造,例如冲压,嵌入成型,多次成型和部件之间的过盈配合,以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构,其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造,包括钻孔以形成通孔。 结果,可以以低成本制造互连系统。 可以应用这些技术来提供性能,包括在RF信号之间的隔离的形式,与由更昂贵的组件提供的RF信号相当。
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公开(公告)号:US20140004726A1
公开(公告)日:2014-01-02
申请号:US13930447
申请日:2013-06-28
申请人: Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人: Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
CPC分类号: H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译: RF连接器模块和相关的印刷电路板,在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造,例如冲压,嵌入成型,多次成型和部件之间的过盈配合,以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构,其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造,包括钻孔以形成通孔。 结果,可以以低成本制造互连系统。 可以应用这些技术来提供性能,包括在RF信号之间的隔离的形式,与由更昂贵的组件提供的RF信号相当。
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公开(公告)号:US07335063B2
公开(公告)日:2008-02-26
申请号:US11635090
申请日:2006-12-07
IPC分类号: H01R13/648
CPC分类号: H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要: An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译: 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片,其中导电颗粒被布置在其中,从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性,同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性,从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中,并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接(例如,模制)到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙,从而进一步降低电噪声或其他损耗(例如串扰),而不会牺牲显着的信号强度。
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公开(公告)号:US07163421B1
公开(公告)日:2007-01-16
申请号:US11183564
申请日:2005-07-18
IPC分类号: H01R13/648
CPC分类号: H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要: An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译: 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片,其中导电颗粒被布置在其中,从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性,同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性,从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中,并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接(例如,模制)到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙,从而进一步降低电噪声或其他损耗(例如串扰),而不会牺牲显着的信号强度。
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