公开(公告)号：US09225085B2

公开(公告)日：2015-12-29

申请号：US13930351

申请日：2013-06-28

申请人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R13/648 ,  H01R12/70 ,  H01R12/71 ,  H01R43/20 ,  H01R13/6587 ,  H05K1/02

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20140004724A1

公开(公告)日：2014-01-02

申请号：US13930531

申请日：2013-06-28

申请人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/70

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US09583853B2

公开(公告)日：2017-02-28

申请号：US13930447

申请日：2013-06-28

申请人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/70 ,  H01R13/648 ,  H01R12/71 ,  H01R43/20 ,  H01R13/6587 ,  H05K1/02

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US09022806B2

公开(公告)日：2015-05-05

申请号：US13930531

申请日：2013-06-28

申请人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R13/648 ,  H01R12/70 ,  H01R12/71 ,  H01R43/20 ,  H01R13/6587 ,  H05K1/02

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20140004746A1

公开(公告)日：2014-01-02

申请号：US13930351

申请日：2013-06-28

申请人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/71

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20140004726A1

公开(公告)日：2014-01-02

申请号：US13930447

申请日：2013-06-28

申请人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/71 ,  H01R43/20

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20110230095A1

公开(公告)日：2011-09-22

申请号：US13029052

申请日：2011-02-16

申请人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

发明人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

IPC分类号： H01R13/648

CPC分类号： H01R13/6461 ,  H01R12/585 ,  H01R12/724 ,  H01R12/735 ,  H01R13/504 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/658 ,  H01R13/6585 ,  H01R13/6587 ,  H01R13/6598 ,  H01R24/62 ,  H01R24/68

摘要： An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair. By using material of relatively low loss, loss when the conductive members are used to carry signals is relatively low, but an appreciable attenuation of resonances is provided on pairs connected to ground. As a result, an overall improvement of signal to noise ratio is achieved.

摘要翻译： 一个改进的宽边耦合，开放引脚现场连接器。 当连接器安装到印刷电路板上时，连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。 该材料还可以减少串扰和模式转换。 选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振，而不会有不可接受地衰减由其他对承载的信号。 有损材料可以选择性地定位在导电构件的匹配接触部分附近。 描述了用于选择性地定位有损材料的多种技术，包括模制，将有损构件插入到连接器壳体的壳体或涂层表面中。 有损耗材料可替代地位于一对导电构件的宽侧之间。 通过使用相对较低损耗的材料，当导电构件用于承载信号时的损耗相对较低，但是在连接到地面的对上提供明显的谐振衰减。 结果，实现了信噪比的全面提高。

公开(公告)号：US08864521B2

公开(公告)日：2014-10-21

申请号：US13029052

申请日：2011-02-16

申请人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

发明人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

IPC分类号： H01R13/648 ,  H01R12/73 ,  H01R13/6585 ,  H01R13/6477 ,  H01R13/514 ,  H01R13/504 ,  H01R12/72 ,  H01R13/6587

CPC分类号： H01R13/6461 ,  H01R12/585 ,  H01R12/724 ,  H01R12/735 ,  H01R13/504 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/658 ,  H01R13/6585 ,  H01R13/6587 ,  H01R13/6598 ,  H01R24/62 ,  H01R24/68

摘要： An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.

摘要翻译： 一个改进的宽边耦合，开放引脚现场连接器。 当连接器安装到印刷电路板上时，连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。 该材料还可以减少串扰和模式转换。 选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振，而不会有不可接受地衰减由其他对承载的信号。 有损材料可以选择性地定位在导电构件的匹配接触部分附近。 描述了用于选择性地定位有损材料的多种技术，包括模制，将有损构件插入到连接器壳体的壳体或涂层表面中。 有损耗材料可替代地位于一对导电构件的宽侧之间。

公开(公告)号：US20130112468A1

公开(公告)日：2013-05-09

申请号：US13553414

申请日：2012-07-19

申请人： Thomas S. COHEN ,  Marc B. Cartier, JR. ,  Mark W. Gailus

发明人： Thomas S. COHEN ,  Marc B. Cartier, JR. ,  Mark W. Gailus

IPC分类号： H05K1/11

CPC分类号： H01R13/646 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6587 ,  H01R23/688 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/116 ,  H05K1/14 ,  H05K3/429 ,  H05K7/1445 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189 ,  H05K2203/1572

摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

公开(公告)号：US08226438B2

公开(公告)日：2012-07-24

申请号：US12789621

申请日：2010-05-28

申请人： Thomas S. Cohen ,  Marc B. Cartier, Jr. ,  Mark W. Gailus

发明人： Thomas S. Cohen ,  Marc B. Cartier, Jr. ,  Mark W. Gailus

IPC分类号： H01R13/648

CPC分类号： H05K7/1445 ,  H01R13/514 ,  H01R13/6587 ,  H01R13/6591 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/116 ,  H05K1/14 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189 ,  H05K2203/1572

摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

摘要翻译： 中平面具有连接第一差分连接器的接触端的第一侧和与第二差分连接器的接触端连接的第一侧相对的第二侧。 中平面包括从第一侧延伸到第二侧的多个通孔，其中通孔在第一侧上提供第一信号发射，而第二信号在第二侧上发射。 第一信号发射被设置成多行，每行具有沿着第一线的第一信号发射，并且第一信号沿着基本上平行于第一线的第二线发射。 第二信号发射被提供在多列中，每列具有沿着第三线的第二信号发射，而第二信号沿着基本上平行于第三线的第四线发射。