公开(公告)号：US09225085B2

公开(公告)日：2015-12-29

申请号：US13930351

申请日：2013-06-28

申请人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R13/648 ,  H01R12/70 ,  H01R12/71 ,  H01R43/20 ,  H01R13/6587 ,  H05K1/02

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20140004724A1

公开(公告)日：2014-01-02

申请号：US13930531

申请日：2013-06-28

申请人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/70

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US09583853B2

公开(公告)日：2017-02-28

申请号：US13930447

申请日：2013-06-28

申请人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/70 ,  H01R13/648 ,  H01R12/71 ,  H01R43/20 ,  H01R13/6587 ,  H05K1/02

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US09022806B2

公开(公告)日：2015-05-05

申请号：US13930531

申请日：2013-06-28

申请人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R13/648 ,  H01R12/70 ,  H01R12/71 ,  H01R43/20 ,  H01R13/6587 ,  H05K1/02

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20140004746A1

公开(公告)日：2014-01-02

申请号：US13930351

申请日：2013-06-28

申请人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/71

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20140004726A1

公开(公告)日：2014-01-02

申请号：US13930447

申请日：2013-06-28

申请人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/71 ,  H01R43/20

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20110230095A1

公开(公告)日：2011-09-22

申请号：US13029052

申请日：2011-02-16

申请人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

发明人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

IPC分类号： H01R13/648

CPC分类号： H01R13/6461 ,  H01R12/585 ,  H01R12/724 ,  H01R12/735 ,  H01R13/504 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/658 ,  H01R13/6585 ,  H01R13/6587 ,  H01R13/6598 ,  H01R24/62 ,  H01R24/68

摘要： An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair. By using material of relatively low loss, loss when the conductive members are used to carry signals is relatively low, but an appreciable attenuation of resonances is provided on pairs connected to ground. As a result, an overall improvement of signal to noise ratio is achieved.

摘要翻译： 一个改进的宽边耦合，开放引脚现场连接器。 当连接器安装到印刷电路板上时，连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。 该材料还可以减少串扰和模式转换。 选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振，而不会有不可接受地衰减由其他对承载的信号。 有损材料可以选择性地定位在导电构件的匹配接触部分附近。 描述了用于选择性地定位有损材料的多种技术，包括模制，将有损构件插入到连接器壳体的壳体或涂层表面中。 有损耗材料可替代地位于一对导电构件的宽侧之间。 通过使用相对较低损耗的材料，当导电构件用于承载信号时的损耗相对较低，但是在连接到地面的对上提供明显的谐振衰减。 结果，实现了信噪比的全面提高。

公开(公告)号：US08864521B2

公开(公告)日：2014-10-21

申请号：US13029052

申请日：2011-02-16

申请人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

发明人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

IPC分类号： H01R13/648 ,  H01R12/73 ,  H01R13/6585 ,  H01R13/6477 ,  H01R13/514 ,  H01R13/504 ,  H01R12/72 ,  H01R13/6587

CPC分类号： H01R13/6461 ,  H01R12/585 ,  H01R12/724 ,  H01R12/735 ,  H01R13/504 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/658 ,  H01R13/6585 ,  H01R13/6587 ,  H01R13/6598 ,  H01R24/62 ,  H01R24/68

摘要： An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.

摘要翻译： 一个改进的宽边耦合，开放引脚现场连接器。 当连接器安装到印刷电路板上时，连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。 该材料还可以减少串扰和模式转换。 选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振，而不会有不可接受地衰减由其他对承载的信号。 有损材料可以选择性地定位在导电构件的匹配接触部分附近。 描述了用于选择性地定位有损材料的多种技术，包括模制，将有损构件插入到连接器壳体的壳体或涂层表面中。 有损耗材料可替代地位于一对导电构件的宽侧之间。

公开(公告)号：US07794278B2

公开(公告)日：2010-09-14

申请号：US12062581

申请日：2008-04-04

申请人： Thomas S. Cohen ,  Brian Kirk ,  Jason E. Chan ,  Andreas C. Pfahnl ,  Marc B. Cartier, Jr. ,  David Manter

发明人： Thomas S. Cohen ,  Brian Kirk ,  Jason E. Chan ,  Andreas C. Pfahnl ,  Marc B. Cartier, Jr. ,  David Manter

IPC分类号： H01R13/648

CPC分类号： H01R12/727 ,  H01R13/6471 ,  H01R13/6474 ,  H01R13/6585 ,  H01R13/6587

摘要： An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers containing columns of conductive elements, some of which form differential pairs. Each column may include ground conductors adjacent pairs of signal conductors. The ground conductors may be wider than the signal conductors, with ground conductors between adjacent pairs of signal conductors being wider than ground conductors positioned at an end of at least some of the columns. Each of the conductive elements may end in a mating contact portion positioned to engage a complementary contact element in a mating connector. The mating contact portions of the signal conductors in some of the pairs may be rotated relative to the columns. The printed circuit board to which the differential signal connector is mounted may be constructed with elongated antipads around pairs of signal conductors.

摘要翻译： 具有高速差动电连接器的电气互连系统。 连接器由包含导电元件列的晶片组装，其中一些形成差分对。 每列可以包括相邻的信号导体对的接地导体。 接地导体可以比信号导体更宽，相邻的信号导体对之间的接地导体宽于位于至少一些列的端部的接地导体。 每个导电元件可以在匹配的接触部分中端部，该配合接触部分定位成接合配合连接器中的互补接触元件。 一些成对的信号导体的配合接触部分可以相对于列旋转。 安装有差分信号连接器的印刷电路板可以在信号导体对周围形成细长的止动片。

公开(公告)号：US07494383B2

公开(公告)日：2009-02-24

申请号：US11880679

申请日：2007-07-23

申请人： Thomas S. Cohen ,  David Manter

发明人： Thomas S. Cohen ,  David Manter

IPC分类号： H01R9/09

CPC分类号： H01R12/725 ,  H01R12/7029 ,  H01R12/7041 ,  H01R13/6658 ,  H01R31/06

摘要： An electrical connector suitable for use in an adapter. The connector includes conductive elements that can be routed in three dimensions to facilitate interconnections between connectors used to form an adapter. Simplified construction is achieved through use of connector wafers, each of which route signals in a plane such that when the wafers are organized side-by-side in a connector, signals may be routed through multiple parallel planes. Some of the wafers may include holes through which conductive elements from other wafers may pass, to that signal may be routed in a third dimension, perpendicular to the parallel planes. The adapter may be mounted on a printed circuit board or other substrate with active components. Signals may pass through the adapter in one of the parallel planes or may be routed for conditioning in the active components.

摘要翻译： 适用于适配器的电连接器。 连接器包括导电元件，其可以三维布线以便于用于形成适配器的连接器之间的互连。 通过使用连接器晶片来实现简化的结构，每个连接器晶片在平面中路由信号，使得当晶片被并排组装在连接器中时，信号可以通过多个平行平面布线。 一些晶片可以包括来自其它晶片的导电元件穿过的孔，该信号可以在垂直于平行平面的第三维度中布线。 适配器可以安装在具有有源部件的印刷电路板或其它基板上。 信号可以通过其中一个平行平面中的适配器，或者可以在有源部件中进行路由以进行调理。