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公开(公告)号：US06678168B2
公开(公告)日：2004-01-13
申请号：US10114005
申请日：2002-03-27
申请人： Thomas William Kenny, Jr. , Kenneth E. Goodson , Juan G. Santiago , John J. Kim , Robert C. Chaplinsky , George Carl Everett, Jr.
发明人： Thomas William Kenny, Jr. , Kenneth E. Goodson , Juan G. Santiago , John J. Kim , Robert C. Chaplinsky , George Carl Everett, Jr.
IPC分类号： H05K118
CPC分类号： G06F1/26 , H01L23/34 , H01L23/473 , H01L23/49827 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13025 , H01L2224/16 , H01L2924/19105 , H01L2924/00014
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
摘要翻译： 一方面，本发明是一种用于调节消耗装置的功率的技术和系统。 在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。 功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。 所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。 每个焊盘连接到第一或第二接口上的对应的一个接口通孔。 功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。 电路可以设置在第一接口，第二接口或两个接口上。 此外，电路包括至少一个电压调节器和至少一个电容器。
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公开(公告)号：US06606251B1
公开(公告)日：2003-08-12
申请号：US10072137
申请日：2002-02-07
IPC分类号： H05K118
CPC分类号： G06F1/26 , H01L23/34 , H01L23/473 , H01L23/49827 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13025 , H01L2224/16 , H01L2924/19105 , H01L2924/00014
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
摘要翻译： 一方面，本发明是一种用于调节消耗装置的功率的技术和系统。 在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。 功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。 所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。 每个焊盘连接到第一或第二接口上的对应的一个接口通孔。 功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。 电路可以设置在第一接口，第二接口或两个接口上。 此外，电路包括至少一个电压调节器和至少一个电容器。
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公开(公告)号：US07061104B2
公开(公告)日：2006-06-13
申请号：US10882475
申请日：2004-06-30
CPC分类号： G06F1/26 , H01L23/34 , H01L23/473 , H01L23/49827 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13025 , H01L2224/16 , H01L2924/19105 , H01L2924/00014
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
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公开(公告)号：US07019972B2
公开(公告)日：2006-03-28
申请号：US10883530
申请日：2004-06-30
IPC分类号： H05K7/20
CPC分类号： G06F1/26 , H01L23/34 , H01L23/473 , H01L23/49827 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13025 , H01L2224/16 , H01L2924/19105 , H01L2924/00014
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
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公开(公告)号：US07050308B2
公开(公告)日：2006-05-23
申请号：US10882607
申请日：2004-06-30
CPC分类号： G06F1/26 , H01L23/34 , H01L23/473 , H01L23/49827 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13025 , H01L2224/16 , H01L2924/19105 , H01L2924/00014
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
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6.发明授权Apparatus for conditioning power and managing thermal energy in an electronic device 失效用于调节电力和管理电子设备中的热能的装置公开(公告)号：US06882543B2
公开(公告)日：2005-04-19
申请号：US10384000
申请日：2003-03-07
IPC分类号： G06F1/26 , H01L23/34 , H01L23/473 , H01L23/498 , H02M1/00 , H05K1/18
CPC分类号： G06F1/26 , H01L23/34 , H01L23/473 , H01L23/49827 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13025 , H01L2224/16 , H01L2924/19105 , H01L2924/00014
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
摘要翻译： 一方面，本发明是一种用于调节消耗装置的功率的技术和系统。 在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。 功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。 所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。 每个焊盘连接到第一或第二接口上的对应的一个接口通孔。 功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。 电路可以设置在第一接口，第二接口或两个接口上。 此外，电路包括至少一个电压调节器和至少一个电容器。
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