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    System including power conditioning modules
    1.
    发明授权
    System including power conditioning modules 失效
    系统包括电源调节模块

    公开(公告)号：US06678168B2

    公开(公告)日：2004-01-13

    申请号：US10114005

    申请日：2002-03-27

    申请人： Thomas William Kenny, Jr. ,  Kenneth E. Goodson ,  Juan G. Santiago ,  John J. Kim ,  Robert C. Chaplinsky ,  George Carl Everett, Jr.

    发明人： Thomas William Kenny, Jr. ,  Kenneth E. Goodson ,  Juan G. Santiago ,  John J. Kim ,  Robert C. Chaplinsky ,  George Carl Everett, Jr.

    IPC分类号： H05K118

    CPC分类号： G06F1/26 ,  H01L23/34 ,  H01L23/473 ,  H01L23/49827 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2924/19105 ,  H01L2924/00014

    摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

    摘要翻译： 一方面，本发明是一种用于调节消耗装置的功率的技术和系统。 在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。 功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。 所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。 每个焊盘连接到第一或第二接口上的对应的一个接口通孔。 功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。 电路可以设置在第一接口，第二接口或两个接口上。 此外，电路包括至少一个电压调节器和至少一个电容器。

    Power conditioning module
    2.
    发明授权
    Power conditioning module 失效
    电源调节模块

    公开(公告)号：US06606251B1

    公开(公告)日：2003-08-12

    申请号：US10072137

    申请日：2002-02-07

    申请人： Thomas William Kenny, Jr. ,  Kenneth E. Goodson ,  Juan G. Santiago ,  George Carl Everett, Jr.

    发明人： Thomas William Kenny, Jr. ,  Kenneth E. Goodson ,  Juan G. Santiago ,  George Carl Everett, Jr.

    IPC分类号： H05K118

    CPC分类号： G06F1/26 ,  H01L23/34 ,  H01L23/473 ,  H01L23/49827 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2924/19105 ,  H01L2924/00014

    摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

    摘要翻译： 一方面，本发明是一种用于调节消耗装置的功率的技术和系统。 在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。 功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。 所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。 每个焊盘连接到第一或第二接口上的对应的一个接口通孔。 功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。 电路可以设置在第一接口，第二接口或两个接口上。 此外，电路包括至少一个电压调节器和至少一个电容器。

    Apparatus for conditioning power and managing thermal energy in an electronic device
    5.
    发明授权
    Apparatus for conditioning power and managing thermal energy in an electronic device 失效
    用于调节电力和管理电子设备中的热能的装置

    公开(公告)号：US06882543B2

    公开(公告)日：2005-04-19

    申请号：US10384000

    申请日：2003-03-07

    申请人： Thomas William Kenny, Jr. ,  Kenneth E. Goodson ,  Juan G. Santiago ,  George Carl Everett, Jr.

    发明人： Thomas William Kenny, Jr. ,  Kenneth E. Goodson ,  Juan G. Santiago ,  George Carl Everett, Jr.

    IPC分类号： G06F1/26 ,  H01L23/34 ,  H01L23/473 ,  H01L23/498 ,  H02M1/00 ,  H05K1/18

    CPC分类号： G06F1/26 ,  H01L23/34 ,  H01L23/473 ,  H01L23/49827 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2924/19105 ,  H01L2924/00014

    摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

    摘要翻译： 一方面，本发明是一种用于调节消耗装置的功率的技术和系统。 在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。 功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。 所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。 每个焊盘连接到第一或第二接口上的对应的一个接口通孔。 功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。 电路可以设置在第一接口，第二接口或两个接口上。 此外，电路包括至少一个电压调节器和至少一个电容器。

    Electroosmotic micropump with planar features
    8.
    发明授权
    Electroosmotic micropump with planar features 有权
    具有平面特征的Electroosmotic微型泵

    公开(公告)号：US07316543B2

    公开(公告)日：2008-01-08

    申请号：US10449564

    申请日：2003-05-30

    申请人： Kenneth E. Goodson ,  Thomas W. Kenny ,  Juan G. Santiago ,  Daniel J. Laser ,  Chuan-Hua Chen

    发明人： Kenneth E. Goodson ,  Thomas W. Kenny ,  Juan G. Santiago ,  Daniel J. Laser ,  Chuan-Hua Chen

    IPC分类号： H02K44/00 ,  H02K44/08 ,  F04B37/02 ,  F04F11/00

    CPC分类号： F04B19/006 ,  F04B17/00

    摘要： An electroosmotic micropump having a plurality of thin, closely-spaced, approximately planar, transversel aligned partitions formed in or on a substrate, among which electroosmotic flow (EOF) is generated. Electrodes are located within enclosed inlet and outlet manifolds on either side of the partition array. Inlet and outlet ports enable fluid to be pumped into and through the micropump and through an external friction load or head. Insulating layer coatings on the formed substrate limit substrate leakage current during pumping operation.

    摘要翻译： 一种具有形成在基底中或基底上的多个薄的，紧密间隔的大致平面的横向对准的隔离物的电渗微型泵，其中产生电渗流（EOF）。 电极位于分隔阵列任一侧封闭的入口和出口歧管内。 入口和出口端口使流体能够泵入并穿过微型泵并通过外部摩擦负载或头部。 所形成的衬底上的绝缘层涂层在泵送操作期间限制衬底漏电流。