公开(公告)号：US11676799B2

公开(公告)日：2023-06-13

申请号：US17198043

申请日：2021-03-10

Applicant: Tokyo Electron Limited

Inventor： Koji Yamagishi ,  Hiroshi Ikeda ,  Hiroyuki Kondo

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32577 ,  H01J2237/3344

Abstract: A plasma processing apparatus includes a chamber; a first electrode facing an inside of the chamber; a radio-frequency power supply configured to supply a radio-frequency power to the first electrode; a feeding rod configured to feed the radio-frequency power to a center of a surface of the first electrode opposite to a surface facing the inside of the chamber; a conductive plate provided in parallel to the surface of the first electrode opposite to the surface facing the inside of the chamber, the plate being grounded; and a dielectric plate connecting the first electrode and the conductive plate, and having a shape that is rotationally symmetric with respect to a center of the first electrode.